World News
09/01/2003
WORLDWIDE HIGHLIGHTS
Recovery for 2004 predicted, new technologies introduced at Semicon West
In July, industry leaders at Semicon West generally agreed that the semiconductor equipment and materials industry is ready to come out of its prolonged downturn, and that 2004 will be a turnaround year with strong growth — but not as spectacular as the industry has experienced in past turnaround years.
Semi president and CEO Stanley Myers said that growth of 300mm processing equipment will be a primary driver for the recovery. "About 50% of new wafer-processing equipment will be on 300mm products, according to Semi estimates," Myers said. He also noted that stabilizing average selling prices of semiconductor devices are also helping the industry get back on its feet after two years of market decline.
"The spectacular 87% growth in 2000 was unsustainable," said Myers. "It was an exceptional bubble, and the worldwide market declined for the next two years. But the market has completely reversed and is now poised for new growth."
The general consensus of a news panel that consisted of heads of several companies and George Scalise, president of the Semiconductor Industry Association (SIA), agreed with Myers's upbeat statements. But some members added that the industry has undergone some fundamental changes driven by the most prolonged downturn in its history, and that future growth short of historical trends will affect the ability of equipment and materials companies to create new innovative technologies.
 A rendering of San Francisco's Moscone Convention Center's newly opened west wing. (Photo courtesy San Francisco Convention & Visitor's Bureau) |
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"In the year 2000, we would have been better off with less growth," said Richard Hill, chairman and CEO, Novellus Systems Inc. "There will be continued consolidation, and there will be more and more requirements for new technology from suppliers. You have to run a lean company, be an efficient producer, and anticipate the needs of customers three to five years out. One of the biggest problems will be the supply of capital to the industry."
Don Mitchell, chairman and CEO of FSI International Inc., expressed concern that slower future growth will dampen innovation. "During this downturn most equipment companies cut spending. If we spend less, it could slow the rate of innovation and challenge our ability to meet Moore's Law." He added that slower future growth will drive industry consolidation.
Mary Puma, president and CEO of Axcelis Inc., added that "most companies are changing their business model. It's a more price-competitive environment. More companies are going lean, not just in manufacturing but also in engineering." She added that Axcelis is outsourcing certain work to suppliers, "even of engineering. We'll all need to do this."
Emerging technologies at the show
New to Semicon West this year was the Technology Innovation Showcase, a forum for companies with significant technologies that are poised to enter the mainstream of IC fabrication. Presenting companies were selected by a Semi committee from more than 75 applicants.
Technologies showcased at the forum were diverse and included:
- a supercritical yield enhancement system based on supercritical CO2 chemistry for removing "virus-size particles at the 90nm node that held on to wafers with enormous Van der Waals forces" (Paul Castrucci & Associates);
- a mobile integrated platform for fab e-Manufacturing, based on a Bluetooth and Wi-Fi framework and designed by fab engineers, that speeds up efficiency in fab information using a mixed environment of PDAs and PCs. (CyberFab);
- software for advanced process control that combines a multivariant solver engine and a library of multivariant models for specific film stacks and process chemistries, all of which are Semi-standard compliant for 300mm wafer processing (Blue Control Technologies);
- Cerberus chemical "finger-printing" technology (a voltammagram) for real-time control of electroplating chemistry degradation and contamination (Technic Inc.); and
- a universal design that buffers existing automated equipment loadports with the same footprint, allowing fabs to reduce the size and number of stockers, thereby producing savings that can total $2 million for just one fab bay (Vertical Solutions).
USA
ETEC Systems, Hayward, CA, has been awarded a $13.5 million contract by the Defense Advanced Research Projects Agency to develop sub-45nm lithography systems. Under terms of the agreement, ETEC will research and develop a raster multiple-beam prototype system for mask and direct-write lithography applications, with pattern generation extendible down to 32nm.
Schlumberger Verification Systems, Concord, MA, and LSI Logic Corp., Milpitas, CA, have established a joint development program to explore metrology for the 65nm process node. Under terms of the deal, LSI will bring a Schlumberger ultra-low-voltage CD-SEM into its Gresham, OR, fab.
Matheson Tri-Gas Inc., Parsippany, NJ, has formed a new electronic and specialty gas equipment team to serve customers requiring high-purity gas delivery systems. The team will be led by John Smickenbecker, director of ESG equipment sales.
ASIAFocus
China
Infineon Technologies AG, Munich, Germany, and the China-Singapore Suzhou Industrial Park Venture Co. Ltd., Suzhou, China, are setting up a joint venture for the assembly and testing of memory ICs. The agreement provides for the construction of a joint facility in the Suzhou Industrial Park, west of Shanghai. Once completed, the facility will have a maximum capacity of up to one billion chips/year. The new company will operate under the name Infineon Technologies Suzhou Co. Ltd.
ST Assembly Test Service Ltd. (STATS) announced it will invest $10 million to set up a manufacturing plant in Zhangjiang High-Tech Park in Shanghai's Pudong District. STATS will transfer some equipment from its Singapore facilities to the new 2322m2 plant.
Japan
Nikon Corp. and Tokyo Electron Ltd. will jointly develop liquid immersion exposure technology. The two companies will share expertise in an effort to develop key technologies by the end of 2003.
Canon plans to invest more than ¥200 billion to establish four new domestic R&D centers by 2005. The company is looking to increase its resources in the advanced displays, nanotechnology, and next-generation semiconductor production equipment sectors.
Nikon Corp. and Dainippon Screen Mfg. Co. will collaborate on a photolithography process for next-generation semiconductors made with circuits narrower than 90nm. The two companies will work to combine Nikon's steppers with Dainippon Screen's photoresist coater-developers so the machines can be smoothly integrated on the same production line, sharing data in ways that will boost overall production yields when circuit patterns are defined on wafers.
Korea
Samsung Electronics will complete a 300mm wafer line at its chip plant in Hwaseong, Gyeonggi Province, within this year, which is earlier than its original deadline. When the line is up and running, Samsung will be able to produce a total of 32,000 wafers monthly, 25,000 from the 12th line and 7000 from the 11th line. The company is also planning to build another 300mm wafer line at its chip plant in Hwaseong.
The Korean Semiconductor Association (KSIA) has started an initiative to achieve technological independence in producing chips. The KSIA comprises about 220 firms, including Samsung and Hynix Semiconductor Inc.
Singapore
Chartered Semiconductor Manufacturing will provide multiyear volume-manufacturing services for Infineon Technologies AG. The agreement includes Infineon's OptiMOS technology, with potential expansion to the company's CoolMOS technology. Both processes are used to manufacture power MOSFETs. Infineon will transfer the OptiMOS technology process to Chartered's Fab 2, where it is to be qualified by the end of this year, with volume production to ramp in 2004.
Taiwan
UMC has entered into a partnership with Barcelona Design Inc., to develop synthesizable PLL and ADC solutions targeted at UMC process technologies, including 180, 150, and 130nm processes. The partnership will also enable UMC to provide customized analog circuits using Barcelona's synthesis solutions.
Intel reportedly plans to build a $29 million chip design center in Taiwan, its first in the Asia Pacific region. The facility will develop designs for chips and system platforms, and partner with domestic organizations to develop chips for wireless, broadband, and other consumer technologies.
EuroFocus
ASML, Veldhoven, The Netherlands, and Micronic Laser Systems AB, Taby, Sweden, are forming a joint venture to develop an optical maskless lithography system using ASML's lithography technology and Micronic's mask pattern generator. Maskless lithography is a solution to rising mask costs; optical maskless lithography is compatible with conventional volume lithography processes.
Ricoh Co. will raise monthly production capacity for 200mm wafers at its Yashiro plant in Hyogo Prefecture, Japan, to 6500 from the current 5500. The move is designed to respond to demand for power management chips used in mobile phones compatible with the Global System for Mobile Communications (GSM) standard.
The European Commission is investigating ¤76.8 million ($87 million) in aid from the Portuguese government to German chipmaker Infineon Technologies AG. The commission needs to verify whether a Portuguese subcontractor, Technicos-Fabrico de Semiconductores SA, is eligible to receive the aid, which would go toward funding an extension of an Infineon semiconductor plant producing DRAMS.