Product News
09/01/2003
Handheld particle counter has 0.2??m sensitivity
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The Handheld 2016 particle counter is claimed to be the first and only handheld counter with 0.2µm sensitivity. It displays six channels of particle data in either cumulative or differential mode, as well as temperature and relative humidity data. The user-friendly graphical interface is displayed on a backlit LCD touch-screen display, and a user-removable lithium ion battery simplifies portable usage. The Handheld 2016 can be used as a mobile particle monitor or can become part of a larger facility-monitoring system. Lighthouse Worldwide Solutions, Milpitas, CA; ph 408/945-5905, [email protected], www.golighthouse.com.
Dry etch equipment for 65nm maskmaking
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Mask Etcher IV uses ICP dry etch technology for 65nm maskmaking. The technology platform reportedly provides better ICP process solutions over previous systems, including particle control, ultra-low CD etch bias, CD uniformity, and feature-size linearity. This "Gen 4" technology is showing better performance results over Gen 3. Process performance results are claimed to comply with 65nm mask technology node requirements. Unaxis Semiconductors, Balzers, Liechtenstein; ph 423/388 45 15, [email protected], www.semiconductors.unaxis.com.
300mm coating/developing system is for DUV lithography
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The RF3 300mm coating/developing system is for advanced DUV lithography. The new track delivers 150 wafers/hour throughput, which meets the demand of next-generation scanners. Plans are in place to increase this capability to 180 wafers/hour. The RF3 is designed with a flexible, modular structure that enables customer-configurable designs with short lead times and quick installs. Dainippon Screen Mfg. Co. Ltd., Sunnyvale, CA; ph 408/523-9140, [email protected], www.screen.co.jp.
Bumping equipment offers high throughput
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PacLine 2000-A50 is a fully automatic, wafer-level electroless nickel/gold bumping system that provides high throughput, with an average processing time of only 20 min, which translates into 150 200mm wafers/hr, or 75 300mm wafers/hr. This is a modular system that consists of input and output stations; a robotic handling system; online central computer control with QualPac software for process and bath control and replenishment; SPC; and process data storage. Pac Tech USA, Santa Clara, CA; ph 408/588-1925, [email protected], www.pactech-usa.com.
Integrated metrology platform
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ISM300 integrated technology platform is a compact XY-Theta positioning system designed for fast and accurate measurements in applications including 300mm wafer .. metrology, thin film measurements, overlay metrology, and characterization of both patterned and unpatterned wafers. The compact, low-profile system features a unique 3-plate design and direct-drive rotation, and achieves total surface access on 300mm wafers while maintaining a constant orientation of the patterned elements on the wafer relative to measurement optics. Newport Corp., Irvine, CA; ph 800-222-6440, [email protected], www.newport.com.
Combination spin track
TrackTrix XP Combo combines coat, bake, chill, and develop functions in a spin track that is claimed to be half the size and cost of competitive systems. Features include Sof-Touch wafer handling for silicon and III-V substrates and a Windows XP graphical user interface. Exact, repeatable process results make this tool suitable for both R&D and manufacturing devices with feature sizes from 0.5–5.0µm. SITE Services Inc., Santa Clara, CA; ph 408/980-1155, [email protected], www.site.com.
Fluoropolymer membrane
The Ultikleen Excellar all-fluoropolymer membrane reduces defect-causing particles from the chemical cleaning solutions used in semiconductor processing. The filter is designed with a new 0.03µm PTFE non-dewetting membrane that enables semiconductor manufacturers to achieve the highest level of contaminant removal from chemical baths. Ultikleen Excellar filters are available as cartridges that fit into a standard housing, or as compact disposable Kleen-Change assemblies. Pall Corp., East Hills, NY; ph 516/484-5400, www.pall.com.
Overlay technology option
The diffraction-based overlay (DBO) technology option for the 9300 advanced 300mm metrology system is based on the spectroscopic method, rather than traditional imaging overlay technologies. The DBO technology is claimed to achieve the precision and accuracy measurement needed to meet requirements of the ITRS roadmap through the 45nm node. By using spectroscopy, total measurement uncertainty of the DBO technology is claimed to be about 6¥ smaller than traditional overlay technologies. Nanometrics Inc., Milpitas, CA; ph 408/435-9600, [email protected], www.nanometrics.com.
e-Diagnostic enhancement
eMatrix adds an added dimension to e-Diagnostic and advanced process control (APC) systems that currently rely solely on equipment data. eMetrix is for seamless and accessible integration of the manufacturer's integrated process monitors (IPMs), third-party sensors, and tool data through a single network interface to the tool. In addition, eMatrix allows multiple host connections to the tool, and manages data traffic to reduce demands on system bandwidth. It can also be used without in situ sensors as a low-cost means of providing multiple host access to equipment data. INFICON, East Syracuse, NY; ph 315/434-1100, [email protected], www.inficon.com.
Piping and fusion system
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The SYGEF Plus piping system and IR 315 Plus fusion machine is for ultra-pure water applications. The large-sized piping system is .. designed to meet requirements for 300mm wafer processing. Chipmakers can install a single 250mm- or 315mm-dia. pipe instead of two 225mm-dia. pipes, reducing overall installation costs. SYGEF Plus is available in PVDF pipe, valves, and fittings in sizes of 250, 280, and 315mm. The IR 315 fusion machine includes a computerized program that directs the operator at each step of the joining process to minimize errors and enhance weld repeatability. George Fischer Inc., Tustin, CA; ph 714/998-9255, [email protected], www.us.piping.georgefischer.com.
Expanded robot teacher
EZTeach technology now offers extended functionality, including apparatus, algorithms, teaching wizards, and fully developed diagnostic scripts, thereby simplifying the robot teaching process, optimizing operator interface, and reducing the time needed to program material-handling robots. Robot-programming processes that typically require two hours are claimed to take only about 15 min. Genmark Automation, Milpitas, CA; ph 408/678-8552, [email protected], www.genmarkautomation.com.
Electric pinch valve for CMP
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This advanced PV series of pinch valves has been expanded to include the PV-EL, which is designed for CMP slurry applications. The PV-EL provides good resistance to wear from ..slurry abrasions, and can provide flow control as low as 10cc/min, even with a diaphragm-style pump. The valve is available in sizes 0.25–1 in., in manual and pneumatic (air to sprint) styles, and can accommodate almost any end connection. Asahi/America Inc., Malden, MA; ph 877/242-7244, [email protected], www.asahi-america.com.
Excimer laser
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The compact 500Hz, OPTexPro excimer laser with solid state pulser is for applications that include mask and wafer inspection, and surface analysis. Design features such as air cooling, a maintenance-free solid state pulser, and .. stable energy discharge pre-ionization combine to produce good beam-pointing stability and homogeneity, while also extending gas and tube lifetimes. The OPTexPro is available at 157, 193, 248, 308, and 351nm. Lambda Physik, Fort Lauderdale, FL; ph 954/486-1500, [email protected], www.lambdaphysik.com.
PVDF powder coating
Kynar Flex 2850PC, a new grade of PVDF designed for powder-coating applications, contains no additives. Complex components coated with Kynar Flex 2859PC resin meet semiconductor and cleanroom requirements, and possess good chemical and abrasion resistance, low permeation, and inherent flame resistance. Coatings possess a smooth, high-gloss finish that enhances the low extraction characteristics of Kynar resins and reduces micro-organic deposits and growth. ATOFINA Chemicals Inc., Philadelphia, PA; ph 215/419-7535, www.atofinachemicals.com.
Low-cost minibatch furnace
The MBF minibatch furnace is a single-chamber process tool for 200mm and 300mm wafer processes. The MBF platform is a low-cost system for new applications where small lots are processed, especially in foundry manufacturing. Good process uniformity and repeatability make the MBF suitable for producing next-generation devices on large 300mm wafers, and the small batch sizes offer a hedge against catastrophic loss. The MBF is a fully integrated platform that incorporates a single 26-wafer process chamber, power supply, vacuum pump, and automated wafer handling. WaferMasters Inc., San Jose, CA; ph 408/451-0859, www.wafermasters.com.