Maximize your time on the exhibit floor with a good final manufacturing plan
07/01/2003
Seasoned attendees of Semicon shows, particularly Semicon West with its split venue, know that a good plan of attack can increase your effectiveness on the exhibit floor. You need to do a lot of homework before heading out to Semicon West Final Manufacturing — the official show name for test, assembly, and packaging (TAP) exhibits — at the San Jose Convention Center in California.
You will find previews about many of the TAP products to be exhibited in San Jose, and what to expect, here in Solid State Technology's WestWorld. Our list of featured show products (beginning on p. 19) includes enhanced DC/RF parametric test capability from Keithley Instruments; clean process ovens from Despatch Industries; a new series of ovens specifically for flip-chip applications from Radiant Technology; and from EV Group, technology for temporary bonding and debonding ultrathin wafers prior to backside processing.
For TAP process development work, you will find at the show a small batch vacuum-soldering system from Centrotherm Technologies; and a tabletop vacuum solder reflow station from SST International.
Unveiled at the show
If Semicon West Final Manufacturing 2003 is like previous years, some of the hot new products will stay under wraps until opening day. True to Semicon West form, the introductions will be products and technical solutions — many of them just out of the lab — that address today's perplexing problems in TAP. As editors, we do our best to snoop out hints before the show about the pending hot announcements.
It is a safe guess that technical solutions that address the packaging impact of copper low-k interconnect will be high on the list of new announcements. More so than last year, some booths will be full of technical solutions, with the obligatory SEM images, that facilitate direct wire bonding or bumping to copper.
The corollary to this will be announcements and exhibits on the TAP metrology side that advance package reliability evaluation, particularly addressing improved mechanical strength of dielectrics and interfacial adhesion in bonding. Today's many new package formats and advances, such as copper interconnect, low-k dielectrics, direct chip attach, and area array interconnect have more than proportionally increased the need to scrutinize packaged-device reliability.
For assembly and packaging, flip-chip underfill materials continue to be an advancing technical front. Expect announcements about new capabilities for lower costs, improved underfill flow, faster dispense and cure, better interface adhesion, lower moisture absorption, higher operating temperature ranges, higher reliability, and underfill technology solutions that help maintain underlying low-k dielectric integrity.
Also, continuing a theme from previous San Jose shows, expect to see more technical solutions for lead-free bumping and associated materials (typically, these are also displayed in booths full of SEMs). Wafer bumping continues to be the gating technology for flip-chip packaging, and eutectic Sn-Pb bumping is the technology to which alternatives are benchmarked. The challenges to the continued proliferation of Sn-Pb bumping include manufacturing cost; bumping costs must continually be decreased through process simplification while preserving reliability and yield. Sn-Pb bumping is also judged on density and pitch (look for new announcements in bump pitch capabilities at the show), manufacturability, availability, and compatibility with copper low-k interconnect.
Don't miss wire bonding
No matter what your technical responsibility is back at your manufacturing plant, be sure to include visits to suppliers of wire-bonding technology. Rumors are that you can expect to see wire-bonding speed and accuracy reaching "tsunamic" levels (that's a specific product hint, see ESEC). Despite projections several years back that wire bonding would be waning right about now, be assured that it is alive, well, and wire bonds are still the leading leads by a long shot (various market studies put bumped wafer-level, chip-scale packaging well under 10%, even if it is adopted for DRAM in the near future).
Clearly, wire bonding is TAP's "lithography" in the sense that the technology front of both wire bonding and front-end's lithography are measured in pitch capabilities; look for one wire bonder supplier to exhibit innovative capillary capability that uses thick wires in ultrafine-pitch applications of 50µm and below (hint, see Kulicke & Soffa).
The bottom line
Most likely, the bottom line behind everything that you target for observation and discussion at Semicon West Final Manufacturing will ultimately be about your company's "bottom line." Semiconductor manufacturing is at the point where some package costs may greatly exceed die cost.
Key to cost issues, last year we saw the launch of the Semiconductor Test Consortium (STC), an effort endorsed by Intel and others to provide ATE users with a universal platform into which virtually any ATE supplier and others can integrate compatible IP to create a highly customized test system. This year at Semicon West, expect to see one of the early results of STC in the form of a 10-year life test platform (hint, visit the booth of Advantest America, the company that launched STC).
PRODUCTS
Die attach adhesives
ABLEBOND 2000 packaging adhesives are designed for lead-free packaging. The electrically conductive die attach adhesives are designed specifically for plastic ball grid aray (PBGA) packaging and matrix-style BGA designs. These materials can withstand high-temperature reflow for lead-free electronic assembly owing to very low moisture absorption and optimized adhesion and stress. Engineered with a low modulus, the adhesives are suitable for a wide range of die sizes, up to 500 ¥ 500 mil square. In addition, the 2000 series adhesives exhibit very low bleed on solder mask surfaces. Ablestik, Rancho Dominguez, CA; ph 310/764-4600, [email protected], www.ablestik.com.
Test platform technology
OPENSTAR test platform technology will provide end-users with a universal platform into which almost any automated test equipment supplier, focused stimulus/measurement module developer, or third-party software developer can integrate compatible IP to create a highly customized test solution. The platform, with a life >10 years, provides IDMs, foundries, and test houses with a streamlined test solution that will reduce the cost of testing complex logic and mixed-signal devices, and most types of SOC devices. Advantest America Inc., Santa Clara, CA; ph 408/844-7805, [email protected].
Die sort system
The Swissline 9021 sorts multiple die categories from wafers up to 300mm. A good or bad die can be identified using inkdot recognition or electronic wafer mapping conforming to SECS/HSMS. The system sorts die into tapes (3 tracks standard) or trays (5 trays standard), has multipass capability for up to 225 bins, and a sequence-wise picking option. A high-speed chip-flipper processes bumped flip-chip die. The 9021 features tool-less, recipe-driven wafer-size changes in <5 min and simultaneous processing of two wafers. Alphasem AG, Berg, Switzerland; ph 41/71-637-6217, [email protected].
Radio frequency tester
The radio frequency tester (RFT) is a high-reliability, low-cost rf-only test system designed and built to address high-volume rf test requirements at low cost. This company has also developed rf test techniques and methods that shorten the test development time while maintaining the required test coverage and accuracy. This combination provides the chipmaker with shorter test development cycles. The RFT is designed for low-pincount, high-performance rf devices and can perform both continuous wave and pulsed measurement. Amkor Technology, Chandler, AZ; ph 480/821-5000 ext 5860, [email protected].
Valve for jetting underfill
The DispenseJet DJ-2100 series valve for jetting underfill achieves precise fluid delivery control at production speeds. Jetting underfill enables users to produce "wet-out zones" —areas where fluid wets the substrate away from the edge of the component after dispensing — of less than 350µm. More than 2000 units/.hour can be processed on a 5mm ¥ 5mm die. Dense designs on printed circuit boards, flex circuits, and stacked packages benefit from the speed and control that jetting delivers. Asymtek, Carlsbad, CA; ph 760/431-1919, www.asymtek.com.
Miniature sensors
The VS4 series of opposed-mode self-contained miniature sensors are designed for precision sensing in tight spaces. Horizontal mounting capability and very small size make the VS4 well suited for applications previously accessible only by remote or fiber optic methods. The sensors use an optically correct lens that, through a periscope-like concept, redirects the visible red sensing beam 90° off the internal circuit board, sending light out of the narrow side of the sensor. Banner Engineering Corp., Minneapolis, MN; ph 763/544-3164, [email protected].
Software for out-of-spec products
The module for this company's FACTORYworks, 300works, and PROMIS manufacturing execution software suites is called OCAPS (out-of-control action plans). OCAPS enables users to manage and accelerate the processing of out-of-spec product, and provides a structured, auditable workflow environment to guide users through an out-of-control problem-solving process. OCAPS reduces the average time-to-solution of an out-of-control condition by providing immediate corrective actions in a pre-defined window. Brooks Automation, Chelmsford, MA; ph 617/367-.0100, www. brooks.com.
Nitrogen wafer-bumping system
The Paragon 70 reflow oven is outfitted with an automated flux coating system and a wafer-handling system. It provides an integrated solution for cost-effective nitrogen wafer bumping, reducing the line and process integration tasks previously handled by end-users. The SCS812 coating system handles 200 and 300mm wafers from a FOUP, uniformly coats them with flux, and loads them onto the in-line reflow oven. BTU International, North Billerica, MA; ph 978/667-4111, [email protected], www.btu.co.
High-quality soldering in vacuums
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The VLO40 vacuum soldering system is a freestanding bench-type vacuum soldering system that offers easy access, loading, and programming. The VLO40 was developed for R&D and small-batch applications that require high quality solder processing under vacuum conditions. The system provides short pumping cycles, two view ports, and the capability to mount light sources, microscopes, or cameras directly onto the lid. The heating and cooling platens offer very rigid construction and improved uniformity from the cooling water injection system and high-power, cross-wire heating system. Process atmospheres available are nitrogen, forming gas and formic acid. Centrotherm Technologies, Danvers, MA; ph 978/777-9859, www.centrothermtech.com.
Digital CMOS machine vision camera
Smaller, lighter and faster than conventional CCD-based high-resolution cameras, the CDC-200 is suitably sized for use in space-constrained environments. It can accommodate mixed-resolution applications using a configurable region of interest (ROI) acquisition feature. This allows users to optimize vision application performance by defining an ROI anywhere within the possible field of view. The CDC-200 can deliver high-resolution SXGA images (1280x1024) at up to 26 frames/sec, a standard VGA image (640x480) at up to 100 frames/sec, or a 320x240 image at up to 340 frames/sec. Cognex Corp., Natick, MA; ph 508/650-3000, [email protected], www.cognex.com.
Digital frame grabbers
The X64-CL series high-performance camera link digital frame grabbers can acquire images from two unsynchronized cameras simultaneously, transfer images at a rate up to 528Mbytes/sec, and provide "trigger to image" reliability. The trigger-to-image capabilities both pinpoint errors and compensate for them. Once a problem is detected, the application is immediately informed, and appropriate action is taken to return the system to normal operation. Coreco Imaging, Melrose, MA; ph 514/333-1301, [email protected], www.imaging.com.
Single-chip die attach tool
GAMMA is designed for high-precision, single-die applications and is based on the field-proven 2200apm platform. It is suitable for processing very small and very large chips and for any kind of matrix application — MLF applications, for instance — even on warped substrates. Depending on the required precision and chip size, GAMMA can process up to 4000 units/hr. The adhesive can be applied via stamping or dispensing. GAMMA achieves a positioning accuracy of 25µm 3s (cpk >1.67). It can process wafers up to 200mm in diameter and offers a wafer-changing system that handles up to 25 wafers. Datacon Semiconductor Equipment GmbH, Radfeld, Austria; ph 215/245-3050, [email protected].
Clean process ovens
Clean process ovens offer a 350°C maximum operating temperature while maintaining Class 100 conditions throughout the entire process cycle. The LCD stackable clean process oven and the LCD 2-14 reach-in clean room oven are suitable for high-temperature polyimide curing applications. Recirculated airflow is 100% HEPA filtered to maintain Class 100 conditions throughout the entire process cycle — even during the LCD 2-14's 5°C/min ramp rates, reducing overall cycle time. Both ovens are Semi S2 and CE compliant for universal acceptance and are configured for multiple voltages and 50/60 Hz. Despatch Industries, Minneapolis, MN; ph 800/828-9903, www..despatch.com.
Epoxy adhesive
EPO-TEK T6117 is a single-component, thermally conductive epoxy adhesive designed for high-volume dispensing techniques. For use in larger die-size attach and substrate attach applications, it can be cured at 180°C in 15 min, with very low stress. T6117's properties include ionic purity, high shear strengths, high radius of curvature, low voiding on cure, and low moisture absorption. The rheology provides for low viscosity with high thixotropy. T6117 has a working life >4 days and contains no solvents. Epoxy Technology Inc., Billerica, MA; ph 978/667-3805, [email protected], www.EPOTEK.com.
Die bonder
The 2008hS die bonder is designed for high-speed, high-volume die attach. A new pick-and-place with constant force bondhead provides high speed, even for very small die. The tool offers the flexibility to handle a wide range of leadframes — from single-row TSOP to high-density QFN. Short conversion time boosts equipment uptime for frequent product changeovers. An ergonomically designed GUI, with multilanguage capability, guides the operator through the set-up procedure. ESEC, Tempe, AZ; ph 480/893-6990, [email protected].
2-D and 3-D inspection
The µCT-F.O.X. system is designed for detailed 3-D inspection and analysis of complex electronic devices. It includes functional 2-D and 3-D modules in a single system, and visualizes the innermost components and precise structural modeling of a device. This system combines the flexibility, functionality, and ergonomics of a standard microfocus x-ray system with the ability to generate 3-D imagery. Cracks, voids, delamination, and other anomalies can be depicted in their actual 3-D position. The system is suited for sensor, MEMS/.MOEMS, and complex electromechanical components inspection applications. FeinFocus, Stamford, CT; ph 203/969-2161, www.feinfocus.com.
Programmable zoom and focus
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ClearVU Vision Alignment is a programmable zoom-and-focus feature on the manufacturer's semi-automated and inline dispensers for high-precision HDI and chip packaging applications. ..ClearVU allows an operator to zoom in on miniature fiducials 0.010 in. square or smaller, thereby improving alignment accuracy prior to commencement of the dispense program. The unit also features a multilevel programmable focus, allowing an operator to verify a fiducial on the substrate level, then switch to verify a component feature on a completely different level of the product or assembly. GPD Global, Grand Junction, CO; ph 970/245-0408, [email protected], www.gpd-.global.com.
40GHz test system
The frequency performance of the S630DC/RF fully automated DC/RF test
system has just been increased to 40GHz. The applications software has
also been enhanced to allow low-cost functional testing of wireless
devices. The system's process monitoring capability has been improved
to measure gate dielectrics with an equivalent oxide thickness (EOT) of
<10 angstroms with high accuracy. The system is fully compliant
with all 300mm standards and compatible with automatic probe card
changers. Keithley Instruments, Cleveland, OH;
[email protected], www.keithley.com.
Vibration-free platform
The Model 2212 vibration-free platform is portable and has a guaranteed flatness of ±0.004 in. over 24¥24 in. It is designed to enhance the performance of atomic force microscopes, micro hardness testers, profilometers, balances, audio components, and other precision tabletop equipment. This platform is available in four table sizes up to 24¥36 in., with load capacities ranging up to 450 lb. The Model 2212 is Class 100 cleanroom-compatible, with Class 10 available as an option. Kinetic Systems Inc., Boston, MA; ph 617/522-8700, www.kineticsystems.com.
Controlled inner chamfer capillary
The CIC capillary permits the use of thicker wires in fine-pitch and ultrafine-pitch applications, improving yields and bonding performance. The CIC (controlled inner chamfer) capillary contains most of the additional gold generated from a free air fall during bonding in its inner chamfer. By reducing the production of large ball diameters, the CIC capillary enables the use of thicker wire bonding for UFP applications (50µm and below). Kulicke & Soffa Industries, Willow Grove, PA; ph 215/784-6795, www.kns.com.
On-line truing device
Designed for QFN, BGA, and LTCC package singulation, the 250DSI saw incorporates an in-process blade-truing device that returns worn and tapered diamond blades to their original square profile. The abrading system delivers an on-line solution for maintaining the rotational integrity of single- and multiple-blade gangs, eliminates OD variation from blade to blade, and prevents unnecessary removal of the blade assembly from the saw. Manufacturing Technology Inc., Ventura, CA; ph 805/644-9681 ext 159, [email protected].
Plasma treatment system
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The XTRAK-IFP plasma treatment system incorporates ion-free plasma technology for treatment of devices without exposure to direct ..plasma glow discharge. The system is designed for both high-speed, in-line manufacturing operations and stand-alone configurations where one plasma station supports an island or group of equipment. The system's open-carrier architecture accommodates a wide variety of products, including strips, process carriers, and larger/heavier components. The XTRAK platform easily integrates with wirebond, die attach, dispense, mold, and marking equipment. March Plasma Systems, Concord, CA; ph 760/930-3324, www.marchplasma.com.
High-power burn-in systems
The flexibility of the HPB-5/HPB-5A systems allows for the testing of 384 high-power devices with individual temperature control or larger numbers of low-power devices when individual temperature control is not required. The systems provide burn-in with test for VLSI devices (35 or 100W maximum). The devices are loaded into sockets on burn-in boards for easy insertion into the system. Micro Control Co., Minneapolis, MN; ph 763/786-8750, [email protected].
Front and backside wafer probe
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A double-sided probing station can probe the backside and front side of the wafer simultaneously, front side only, or back side only. The station is ..designed for emission microscopy, optical device characterization, and MEMS analysis. The 8000 series probe stations are designed for 200mm wafers, the 9000 series stations for 300mm wafers. Existing probe stations can be returned to the manufacturer to be retrofitted to accommodate the wafer carrier frame. The Micromanipulator Co. Inc., Carson City, NV; ph 775/882-2400, www.micromanipulator.com.
Surface roughness tester
The SJ-301 Surftest surface roughness tester can use standard Compact Flash memory cards to store measuring conditions, measured data, and statistical results. Functionality can be extended by using the optional SurfPak software for lab-like analysis. The SJ-301 boasts differential inductance detection, a dedicated processor including SPC functions, a large display, and built-in high-speed thermal printer. Comprehensive measurements can be taken in any location. Mitutoyo America Corp., Aurora, IL; ph 630/820-9666, www.mitutoyo.com.
Microstepping drives
The 6200 series high-performance microstepping drives are designed for mounting in a bookshelf or coldplate configuration, and suited for single- or multi-axis applications where space is limited. These drives feature adjustable resolutions up to 51,200 steps
evolution; microstep resolution and current ranges are DIP switch selectable. Idle current reduction helps to reduce motor heating when at idle and conserves system energy. Pacific Scientific, a div. of Danaher Motion, Rockford, IL; ph 612/237-4443, [email protected], www.danahermotion.com.
Flip-chip reflow ovens
The Trilogy I: WaferBump oven produces reliable, low-voiding solder bumps on wafers through conduction heating. Infrared lamps heat the bottom side of a high-density mesh transport belt that conducts heat into the bumped wafers. The Trilogy II improves flip-chip assembly yields through IR conductive and convective heating. The Trilogy III applies the yield-enhancing characteristics of low-velocity forced convection to solder ball attach processes on BGA and CSP substrates. Radiant Technology Corp., Fullerton, CA; ph 714/991-0200, [email protected], www..radianttech.com.
Fiber optic laser encoder
The RLE fiber optic laser encoder saves OEMs space and complexity in precision manufacturing and processing systems. The interferometer launches two laser beams from one remote source via fiber optics. Fiber-optic delivery avoids beam benders and complex beam paths, minimizing components, costs, and complexity while allowing a reduction in packaging space (especially for micromachine applications). Providing axis lengths of up to one meter when using plane mirrors, RLE is suitable for x-y stages, wafer-inspection machines, and other precision motion systems. Renishaw Inc., Hofffman Estates, IL; ph 847/286-9953, [email protected], www.renishaw.com.
Safety light curtains
The 14mm resolution version of the MicroSafe series safety light curtain is available in protected heights from 150–1800mm, and offers a sensing range to 5m. These safety light curtains are available in standard (MC4700), segmented (MCF4700), or jointed (MCJ4700) versions. Options include low-electrostatic-discharge models and a DeviceNet interface. Scientific Technologies Inc., Fremont, CA; ph 612/237-4443, [email protected], www.st.com.
High-accuracy linear encoder
The new, compact BL55 Laserscale high-accuracy linear encoder takes advantage of new hologram-scale technology. Recently developed optical integrated circuit (OIC) technology has significantly reduced the size of the reader head, creating a more compact encoder assembly. The BL55 can be ordered with Neoceram glass, which offers a temperature coefficient of -0.7¥10-6/°C. Signal period is 0.4µm; interpolation error is practically nonexistent. The BL55 offers linearity of ±0.5µm on travel lengths to 220mm. Sony Precision Technology America Inc., Lake Forest, CA; ph 949/770-8400, [email protected], www.sonypt.com.
Tabletop vacuum solder reflow station
The Model 1200 tabletop vacuum solder reflow station is designed for process development and low-volume production of flux-free and void-free soldered joints in microelectronic packages and components. A ramping temperature controller is combined with customized PLCs to provide automatic process control. The aluminum process chamber is accessed via a manually locking lid for rapid entry and sealing. Control of the processing chamber is integrated with the temperature through automatically actuated solenoid valves. SST International, Downey, CA; ph 562/803-3361, www.sstinternational.com.
Packaging platform
The Pyxis packaging platform integrates rf devices with their surrounding circuitry while providing cost and size savings for more feature-rich, low-cost, wireless electronic products. The platform builds on proven microBGA technology and integrates various other technologies, such as flip chip, integrated passives in silicon and on polyimide, as well as novel EMI shielding techniques. Tessera Inc., San Jose, CA; ph 408/952-4342, [email protected].