Product News
05/01/2003
Laser dicer won't damage ultra-thin wafers
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The Xise300D laser-dicing machine is a fully automated system that cleanly cuts silicon without damaging the die even for wafers as thin as 30µm. Using a water-free cutting process, the Xise300D system includes options that allow automated handling of bare wafers, wafers on tape frame, and 300mm handling options. In addition to chip-free and crack-free cutting of wafers up to 300mm, the Xise300D enablers layer-specific scribing. Using specialized laser sources and laser control techniques, the system can be configured to allow pre-scribing of low-k and brittle materials before wafer saw processing, or to selectively remove polymer and thin layers from wafer sources for many applications. Xsil Ltd., Dublin, Ireland; ph 35/31-245-7500, www.xsil.com.
Air-bearing positioning stage keeps reticles clean
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The DynamYX RS air bearing positioning stage is for reticle positioning in next-generation semiconductor manufacturing inspection systems. The DynamYX RS is a dual-axis air-bearing stage platform that occupies a smaller footprint than traditional open -frame architectures. It also provides greater flexibility in the optical system design and easier access to optical elements for upgrades and maintenance. The isolated location of the stage's reticle holder keeps the reticle away from possible sources of particulate generation. Part of a five-product family of precision air-bearing stages designed for high throughput semiconductor inspection and processing applications, the DynamYX RS provides a high level of static and dynamic positioning performance because it is a rigid, low mass single plane xy air bearing rather than a stacked, dual axis xy stage configuration. Additional features and benefits can be gained with optional integrated accessories, including a zero-dither theta offset axis built into the composite reticle holder, an integrated vertical "z" stage capable of both long-travel coarse adjustment and fine, in-process (autofocus) adjustments, and an interferometer mirror which can be integrated directly into the reticle holder to accommodate direct position tracking along the scanning axis. Newport Corp., Irvine, CA; ph 800/222-6440, [email protected], www.newport.com
Air sampler for lithographers detects <10ppt
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The Vantara continuous air sampling system gives lithographers the power to detect and measure molecular contaminants at <10 parts per trillion (ppt), a capability essential to understanding and preventing optics contamination in 193nm and 157nm lithography. Very low concentrations of certain organic contaminants show up on deep UV optical elements as damaging films, which cause transmission loss, illumination nonuniformity, and light scattering. Ultimately, these contaminants diminish exposure tool productivity, image quality, and optics lifetime. The Vantara system provides an accurate and convenient way of collecting ultra-low levels of condensable-organic species from molecular weights of C6 to C30. The system incorporates a sampling device and analytical method to separate, quantify, and identify individual organic components at a detection limit of <10ppt, or approximately 0.001µgm/m3. Because it collects air samples continuously, Vantara provides lithographers with a cumulative view of contamination exposure history. Extraction Systems, Franklin, MA; ph 508/553-3900, [email protected].
Controllers meet needs of nanotechnology applications
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Digital piezo nanoPositioning/ nanoScanning controllers are for applications such as scanning microscopy, metrology, microlithography, mask alignment, surface profiling, material science, nanotechnology, and cell tracking. The E-710.SCN controllers are available in 3-, 4-, and 6-channel versions, and address the growing linearity and speed requirements of current nanotechnology operations. Conventional PID (proportional integral derivative) piezo servo motion controllers exhibit phase lag and tracking errors due to the nonlinear nature of PZT material and the inherent limitations of the PID controller concept. The E-710.SCN controllers use a different, smart digital controller model, which reduces nonlinearity and phase lag to indiscernible levels, even with high-frequency dynamic actuation under load. The effect is claimed to be an improvement in linearity (usable bandwidth) of two orders of magnitude, resulting in significantly increased throughput. Polytec PI, Inc., Auburn, MA; ph 508/832-3456, www.polytecpi.com.
System reduces scribe costs
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The AccuScribe-SS40 is a laser-based sapphire wafer-scribing system that is an alternative to diamond-scribing technology. The system features throughput of >3 wafers/hr, reportedly ..reducing scribe costs. AccuScribe scribe tips require little maintenance and virtually no consumable parts, compared to diamond scribe tips that quickly degrade and demand frequent maintenance due to the hardness of sapphire. In addition, the accuracy and repeatability inherent in laser processing produces a consistently higher yield while reducing operating cost. The AccuScribe-SS40 processes 350¥350µm dies on 50mm wafers at a rate of >3 wafers/hr. Channel depth is 25µm and channel width is <8µm, easily falling within a 30µm street. Over a run of 500 wafers, it maintains a scribe depth and width of ±10%. New Wave Research, Fremont, CA; ph 510/249-1550, [email protected], www.new-wave.com.
Surface profiler has 0.1Å resolution
The Talysurf CCI 3000 noncontact three-dimensional profiler boasts 0.1Å resolution over 100µm gauge range. The system offers high stability and 0.03Å repeatability, making it suitable for MEMS, semiconductor, data storage, and other ultra-high-precision industries. The CCI 3000 uses a patented algorithm to find the coherence peak position of an interference pattern produced by a selectable bandwidth light source, a method that provides both high resolution and sensitivity to returning light. All surfaces having reflectivity between 0.3% and 100% can be measured. Components up to 300mm ¥ 300mm in size and specimen areas up to 7.2mm ¥ 7.2mm can be measured without stitching. Taylor Hobson, Leicester, UK; ph 847/290-8090, www.taylor-.hobson.com.
Fault detector improves efficiency
iProcess-FDC software monitors fab-wide process and tool health by providing data visualization, virtual sensor modeling, and univariate and multivariate analysis. The system enables process and equipment engineers to proactively monitor and analyze process disruptions, and rapidly refine tool and process operations. IProcess-FDC enables process engineers to detect process problems before they have a major impact on costs and productivity. Brooks Automation,Chelmsford, MA; ph 978/262-2400, www.brooks.com.
Atomic absorption spectrometer
The Mark II version of the M series dual atomizer range of atomic absorption spectrometer retains the same small footprint, high-efficiency echelle optical system, and dual atomizer concept of the original M series product. What has changed is that the left and right sample compartments have been redesigned so a user can fit and align the sampling accessories more easily and accurately. Also, the automatic six data coded lamp carousel has been upgraded to improve reliability and lamp installation and removal. Thermo Electron Corp., Madison, WI; ph 608/276-6347, www.thermo.com.
Software enables quick response
The ChemControl configurable control system replaces traditional custom software solutions with standard software that allows users to rapidly make onsite changes without specialized programming skills. System owners can respond instantly to process changes and fab expansions. The control system, which consists of a programmable logic controller, a supervisory control and data acquisition monitoring system, and an industrial communication network, serves as a communications backbone for each chemical and slurry distribution system. BOC Edwards, Wilmington, MA; ph 800/848-9800, [email protected], www.bocedwards.com.
AFM can image in many environments
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The Digital Instruments EnviroScope atomic force microscope (AFM) system is for a wide range of applications and combines a hermetically sealed sample chamber with modular environmental controls to provide atomic force microscopy scanning under nonambient vacuum, gas, and liquid environments. The scanner head is based on the low-noise Dimension AFM head, and includes a piezoelectric tube scanner, a laser, and a quadrature optical detector. Veeco Instruments, Santa Barbara, CA; ph 805/967-1400, www.veeco.com.
MES solution for TAP operations
InSite Semiconductor TAP Edition is an MES (manufacturing execution system) specifically designed for global semiconductor TAP manufacturing. InSite is for use in single and multi-site production environments, and enables semiconductor manufacturers to accelerate time to market, reduce support and implementation costs, and ensure consistent product quality across production sites. The software can be quickly tailored for multiple, unique factory environments while standardizing on a single MES. A third-generation MES engine manages all production information in real-time. Camstar Systems Inc., Campbell, CA; ph 408/559-5700, www.camstar.com.
Die bonder boasts low cost-of-ownership
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The model 6500 high-accuracy eutectic die bonder combines high accuracy and speed with a compact footprint, producing a low cost ...of ownership for precision assembly operations. With a eutectic placement accuracy of <1.5µm, 3s, and a cycle time of <7sec/placement, the die bonder can automate assembly for the most advanced operations, including p-side down laser diode attachment, silicon bench (V-groove) placement, high-density RF power transistors, and ultra-fine-pitch hybrid assemblies. The model 6500 has a <1m2 footprint, but has a large bond area of 300mm ¥ 150mm. The bonder can be customized for any type of presentation media, such as automated waffle pack loaders, tape and reel feeders, or automated gel-pack loaders. Palomar Technologies, Vista, CA; ph 760/931-3440, www.palomartechnologies.com.
Tough surface roughness tester
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The SJ-201PR handheld surface tester can glide softly to the measuring surface. With an optional nosepiece or user-specified fixture, the tester is claimed to be nearly indestructible on the shop floor. Detector repairs are virtually eliminated. To operate, the display unit, including the detector/drive, is placed on the surface to be measured; pressing the start/stop key initiates detector traverse. The detector, which is positioned 3mm above the surface, glides to the part and begins the measurement. Resulting parameter values are then shown on a large LCD screen. Mitutoyo America Corp., Aurora, IL; ph 630/820-9666, [email protected], www.mitutoyo.com.
Sensors for use in small spaces
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The CSM 1/KT 3/LUT 2 mini sensors can identify color, contrast, and luminescence in the smallest of places. The CSM 1 color sensor identifies, sorts, and checks objects on the basis of their color, which is quickly and easily taught-in. Thereafter, switching frequencies of up to 1.5kHz allow color detection even at high throughput rates. The KT 3 contrast sensor uses a two-point teach-in on marks and backgrounds, high contrast resolutions, and integrated switching threshold adaption for highly reflective target objects. Instead of a minimum optical contrast or color, the LUT 2 luminescence sensor detects visible and invisible markings that luminesce thanks to the self-contained UV light. All three new sensors are mechanically and electrically compatible. SICK Inc., Minneapolis, MN; ph 952/941-6780, www.sickusa.com.
Software cuts 300mm tool integration time
CIM300Expert software allows easy conversion of equipment software, with or without a GEM interface, to full 300mm compliance in as little as six to eight weeks, thereby reducing time to market and programming costs. Integration services provided by the software manufacturer can further cut the time to one month. This time reduction is made possible by the addition of software modules that handle the 200mm and 300mm graphical user interface (GUI), equipment frontend module (EFEM), and 300mm local and remote mode logic, all while requiring no detailed knowledge of the 300mm Semi standards. Cimetrix, Salt Lake City, UT; ph 801/256-6500, www.cimetrix.com.
Wafer carriers provide full handling
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New wafer and reticle carrier products include 300mm front-opening unified pods (FOUPS), 200mm standard mechanical interface (SMIF) pods, 150mm SMIF pods, 150mm single- and multiple-reticle SMIF pods, and 200mm single-reticle SMIF pods. Offerings are from a new manufacturer, which acquired a line of carriers and which plans accelerated development of the next generation of materials integrity solutions. Entegris, Chaska, MN; ph 925/556-3131, www.entegris.com.
Furnace controller adds functionality
The PC-MUX replaces Thermco's TMX 9000, 10,000, and 12,000 series MUX controllers, as well as SEMY's UNIX-based MUX systems for Thermco furnaces. The PC-MUX software provides complete recipe and configuration editing, process status, and alarm and trace data viewing. The Winders platform allows easy networking and offers improved system access. Adding JGA's optional Web and wireless communications capabilities provides Internet/ Intranet-based remote access. Data capture speeds are much faster than with previous systems, and back-up and restore operations are claimed to be easy and automatic. Jon Goldman Associates, Orange, CA; ph 714/283-5889, [email protected], wwwJGA-inc.com.
Optical components for UV range
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This optical component product line has been expanded into the UV portion of the spectrum and includes UV right-angle prisms, windows, and neutral density filters. Tech Spec UV fused silica right-angle prisms are available in two grades; high-tolerance prisms are ideal for beam steering and other laser-based applications. Prisms are available in variety of sizes, and all are uncoated. Tech Spec precision UV fused silica optical windows are available in 10–25mm dia. Tech Spec UV fused silica ND filters are ideal for a wide range of UV sources. Edmund Industrial Optics, Barrington, NJ; ph 856/573-6250, [email protected], www.edmundoptics.com.