Product News
04/01/2003
Overlay metrology for 65nm node
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Archer AIM leverages a new grating-style technology to reduce the measurement uncertainty associated with traditional overlay metrology for sub-100nm design rules. By providing data that correlate precisely to in-device overlay performance, Archer AIM enables lithographers to manage processes with a higher degree of confidence, thereby achieving tighter overlay control. New overlay challenges associated with sub-100nm design rules are driving the need for tools that take into account new parameters, such as feature size pattern placement (device correlation) and mark fidelity (process robustness). Archer AIM's new grating-style targets are denser than traditional box-in-box targets, resulting in the collection of more process information for improved correlation to in-device overlay performance. Another advantage of Archer targets is that they can be customized (segmented) for each layer to meet specific customer requirements. Because of their grating design, Archer targets are also more robust to CMP processing, especially with new materials, since the targets have less open area within which these advanced processes can cause target degradation. Archer AIM, based on the Archer platform, has throughput >150 300mm wafers/hr. KLA-Tencor, San Jose, CA; ph 408/875-5473, [email protected], www.kla-tencor.com.
300mm wafer transport
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300mm plastic Film Frame is designed to be used with this company's Film Frame Cassette and Single Film Frame Shipper. Together, the products serve as a lightweight option to transport 300mm silicon wafers that are mounted on film frame. Film Frame is designed to protect and transport ICs throughout assembly processes. This new Semi-compatible product is made of an engineered polymer that provides superior stiffness and mechanical integrity for reliable operations during the wafer tape mounting processes. The lightweight plastic reduces many of the problems that exist with metal frames, such as particle generation, weight and cost. The material and construction result in a film frame that is 50% lighter than standard products, improving ergonomics and safety. Entegris Inc., Chaska, MN; ph 952/556-8051, [email protected], www.entegris.com.
Display metrology software
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ProMetric 7.0 software provides display manufacturers with a tool to replace subjective visual inspection methods, now commonly used throughout the industry, with automated techniques that are both objective and repeatable. ProMetric 7.0 contains a suite of standard algorithms to enable automated identification of Mura Defects, such as pixel, blemish and line defects, and can deliver quantitative data on luminance, irradiance and chromaticity characteristics. The software is intended for producers and component suppliers of emitting, reflecting and projected displays, such as LCDs, OLEDs, and PDPs. It is compatible with all of this company's PM Series light and color measurement systems. Other new features in ProMetric 7.0 are a powerful Image Processing Toolbox that enables users to develop custom routines, and a comprehensive set of ActiveX functions to allow for full testing automation. ProMetric 7.0 also introduces a more sophisticated stray light correction calibration method that improves accuracy when performing contrast ratio measurements of displays, area illumination measurement, and illumination system beam pattern analysis. In addition, exposure control has been enhanced to provide more flexibility when performing user defined measurements with custom filters. Radiant Imaging Inc., Duvall, WA; ph 425/844-0152, [email protected], www.radimg.com.
DARC 193nm film
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DARC 193 dielectric anti-reflective coating film, for the fabrication of sub-100nm chips, is designed to overcome the challenges of 193nm lithography by providing the photoresist compatibility and precise critical dimension (CD) control required for integration with advanced devices. The new film addresses two of the major challenges chipmakers face in implementing 193nm lithography: photoresist poisoning and CD variation. Formulated without nitrogen, DARC 193 minimizes photoresist poisoning, enabling compatibility with new 193nm chemistries. Providing tight CD control, the film is optically tuned to achieve <1% reflectivity across the wafer. The film's good adhesion to advanced low-k dielectrics allows easy integration in dual damascene designs. The DARC 193 film is available on this company's 200mm Producer system and 300mm Producer SE platform. The systems' single-wafer architecture provides high-quality, homogeneous films with high productivity and flexibility. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647 or 408/748-5227, www.appliedmaterials.com.
Etch residue removers
ACT BNE-8500 and ACT BNE-8000 quickly and effectively remove etch residue in semiconductor applications with minimal impact on the critical dimensions of vias, metal lines, and trenches, owing to low oxide and metal etch rates. While ACT BNE-8500 is a more aggressive cleaner than its ACT BNE-8000 counterpart, both products are compatible with low-k films, facilitate rapid removal of stubborn etch residue, and are designed for single-wafer processing applications. ACT BNE 8500 is designed for single-wafer applications and ACT BNE-8000 is designed for batch spray solvent tool processing. Ashland Specialty Chemical Co., Dublin, OH; ph 614/790-6031, [email protected], www.ashland.com.
PVD tungsten system for sub-100nm
The Endura PVD CleanW system is designed for critical sub-100nm polysilicon/metal gate and bit line applications. It enables chipmakers to increase the speed of their DRAMs, including DDR, Flash and SRAM devices, using a single chamber to deposit a very thin, low-resistivity tungsten nitride/tungsten (WN/W) film stack as the transistor gate material. After RTP annealing, the film stack has a resistivity of less than 15 microW-cm, which reduces device design complexity and allows tighter packing density. Throughput is >60 wafers/.hr, typical operational lifetime is >20,000 wafers, and typical target lifetime is up to 400kW-hrs (>35,000 wafers). Applied Materials Inc., Santa Clara, CA; ph 408/563-0647 or 408/748-5227, www.appliedmaterials.com.
Process control system
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The Remote Monitor Unit (RMU) incorporates a secure web server, a communications gateway, and data acquisition/monitor into one device. The RMU connects control systems to Ethernet-based networks, allowing the user to remotely monitor, control, log, and share process information using many different Internet applications. The RMU is housed in a compact robust package and easily integrates into existing process control systems for instant web connectivity, without modifying the application. It houses a large library of standard industrial PLC communication protocols and simple-to-use web graphic configuration software, allowing the user to quickly develop control and monitoring applications that meet individual requirements. The RMU provides built-in security to safeguard the user's application data from unauthorized Internet access. MKS Instruments, Andover, MA; ph 408/235-7620 or 978/975-2350 ext 5541, [email protected], www.mksinst.com.
Wafer-processing components
Secure & Pure rotolined wafer-processing components and equipment, customized to meet space and process requirements, are processed in a state-of-the-art cleanroom environment and exhibit very good adhesion to metal substrates. They provide an ultrasmooth surface and are adaptable to unique shapes and sizes. Secure & Pure products are suitable for wafer carriers, etch and rinse tanks, and solid tool components. Material options include PFA, ECTFE, ETFE, PVDF, PP, and PE. Edlon Inc., Avondale, PA; ph 800/753-3566, [email protected], www.edlon.com.
Scanning probe microscopes
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The XE-Series scanning probe microscopes (SPMs) deliver good scan accuracy and scan speed, and advanced probe tip characterization and de-convolution. Distortion-free SPM data acquisition is achieved by a novel x-y-z ..scan system whose design incorporates an advanced guided flexure scanner with low inertia, minimal run-out, superior orthogonality and axis-independent performance. The design eliminates the cross-talk, nonlinearity, creep and hysteresis inherent in conventional piezoelectric tube scanners that are employed by most commercial SPMs. The XE-Series SPMs include models to accommodate sample sizes up to 300mm, and are available with an extensive list of standard and advanced scan modes. Ambios Technology Inc., Santa Cruz, CA; ph 831/429-4200, [email protected], www.ambiostech.com.
Compact dry pump
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The ACP28 compact 27 m3/h (16 cfm) dry pump is a reliable, dependable, cost-effective alternative to scroll pumps. It is a contact-free ..pump (no particle generation), with stable performance over time and with predictable preventive maintenance requirements. The ACP28 dry pump is useful for evacuation of load-locks, inspection instruments chambers, process monitoring, and degassing chambers. Two versions of the ACP28 with corrosive gas pumping capability are also available. Alcatel Vacuum Technology, Annecy, France; ph 33/0450-6577-77, [email protected], www. alcatelvacuum.com.
CMP pad conditioners
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DIABOND pad conditioners are diamond surface disks with a controlled microstructure, used to resurface polymer pads that carry slurry for CMP of advanced silicon wafers and ..magnetic heads. With a 100% increase in pad life over typical nickel-plated conditioners, DIABOND conditioners exhibit extreme resistance to wear and the corrosive chemicals used in both the copper and tungsten processes for high-speed chips. A CVD diamond film bonds the uniformly distributed diamond grit to a substrate, resulting in removal rate uniformity, which greatly reduces set-up time, calibration labor and test wafers typically required for change-outs. CMP conditioners can be custom-manufactured to meet individual requirements and specifications. Diamond grits are offered in a variety of sizes and densities. Morgan Advanced Ceramics, New Bedford, MA; ph 508/998-9012, www.morganadvancedceramics.com.
Ultralow-voltage CD-SEM
Yosemite is the first CD-SEM that is capable of measuring below 200eV in full automation. This ultralow-voltage application is required for sensitive materials such as 193nm resist, which can shrink as much as 5nm under the 500eV beam of a standard CD-SEM. Product development included complete e-beam modeling to create a design allowing for measurements as low as 100eV and ensuring good long-term stability and collection efficiency. Extensive customer involvement in the development provided the foundation for a simple user interface. Schlumberger Verification Systems, Concord, MA; ph 978/318-4041, [email protected], www.slb.com, www.ultralowvoltage.com.
Gallium arsenide etchants
These chemical etchants are designed for etching gallium arsenide and ternary GaAs based materials. When used at room temperature, they provide isotropic or anisotropic etching of GaAs in a clean, controllable fashion. Gallium arsenide etchants are compatible with silicon dioxide etch masks over a range of pH values. Transene Co., Danvers, MA; ph 978/777-7860, [email protected], www.transene.com.
Lead screw assemblies
Used in motion control and actuation applications, including wafer cleaning, wafer and package handling, testing, measurement, and inspection, these lead screw assemblies are customer-tested to more than 1 million cycles. They exhibit very long life, offering a high degree of accuracy and dependability. The screws are manufactured with a proprietary TFE coating, eliminating the need for external lubrication and maintenance. Self-compensating anti-backlash nuts are available, making the assemblies suitable for applications requiring maximum reliability and reduced preventive maintenance. Kerk Motion Products, Hollis, NH; ph 603/465-7227, www.kerkmotion.com.
Cleanroom robot
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The LR Mate 200iB cleanroom robot has six degrees of freedom, a cleanliness rating of Class 10 per Federal Standard 209E (ISO Class 4) in optimal conditions, and Class 100 (ISO Class 5) in all other conditions. It is suitable for such industries as semiconductors, laboratory automation, optical/magnetic media, flat panel displays, and others where particle emissions must be tightly controlled. The LR Mate 200iB can handle an equally wide range of applications, including assembly, packing, packaging, dispensing, testing and sampling. Compared to previous models, this next-generation mini-robot offers an increase in maximum payload from 3–5 kg and a 33% increase in wrist moment. The new robot uses the new R-J3iB Mate mini-robot controller. As a result, it is the fastest robot in its class for the standard 25-300-25mm round-trip burst evaluation cycle. FANUC Robotics America Inc., Rochester Hills, MI; ph 248/377-7739, [email protected], www.fanucrobotics.com.
Litho data analysis software
Klarity ProDATA version 1.4 advanced lithography data analysis software includes new functions and capabilities. With a simple point-.and-click, users can instantaneously view a wafer map of SEM images to study across-wafer variation of CDs when accessing either NT-v4.01-based, or earlier Mac-based, KLA-Tencor CD SEM data. When fitting CD data, the new "MackCD" fitting function creates a more lithographically intelligent fit with improved noise filtering. Sidewall angle and resist loss data, including SpectraCD scatterometry data, can now be fitted using a new polynomial function. KLA-Tencor, San Jose, CA; ph 408/875-3000, [email protected].
Fab productivity software
Software for personal digital assistants (PDAs) can help reduce tool downtime and improve productivity by accelerating digital mass flow controller (MFC) troubleshooting. Atomizer software for PDAs enables engineers to monitor and control any Qualiflow digital MFC. With Atomizer, engineers can perform functions on Qualiflow digital controllers far more frequently because lightweight PDAs can be carried around the fab constantly, unlike laptops. Furthermore, in infrared mode, PDAs with Atomizer do not require a physical connection to the tool, making information on MFCs available almost instantly. Atomizer can be switched between digital and analog modes. Qualiflow, Montpellier, France; ph 33/4-67-9947-47, [email protected].
CMP polishing pad
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The FBP3100 CMP polishing pad enhances polishing performance for critical CMP applications. Targeted for volume production processes, it delivers low defectivity results ..while maintaining topographical control. The polishing pad offers tight thickness control and good dishing and erosion performance. End-point detection is integrated with the pad to increase performance and provide a predictable polishing environment. In addition, the FBP3100 incorporates a standard XY groove pattern, which can be customized for specific application needs. Slurry flow on the FBP3100 can be decreased without affecting the removal rate or within-wafer nonuniformity percent in tungsten polishing applications, allowing users to reduce overall COO for the polishing step. Rodel Inc., Phoenix, AZ; ph 602/431-0500, www.rodel.com.