Product News
03/01/2003
Laser pattern generator
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The Sigma7300 laser pattern generator's resolution and pattern accuracy are targeted to volume production at the 90nm and 65nm technology nodes. The Sigma7300 offers the resolution, pattern accuracy, fidelity and tuning capability to allow customers to write many of the critical layer masks that have traditionally been written with electron-beam pattern generators. The system works like a micro-stepper with a programmable mask. It is based on this company's spatial light modulator (SLM) technology. The SLM is an integrated circuit with a flat, mirror-like surface. Deep-ultraviolet light is reflected off the surface of the SLM to expose photoresist on a photomask blank, forming the pattern of the mask. The Sigma7300 features a modular platform with an ultraclean environment and a SMIF material interface. The tool uses a 248nm laser with 2kHz flash rate and a 0.82 numerical aperture. It employs many of the same resolution enhancement techniques that wafer steppers use in order to achieve maximum resolution and critical dimension control. A high-precision alignment system for writing the second layer of phase shift masks is also available.
Micronic Laser Systems AB, Taby, Sweden; ph 46/8-638-5200, [email protected], www.micronic.se.
Laser flip-chip placement
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This advanced laser flip-chip placement machine, LAPLACE, provides good process flexibility and enables flip-chip placement, solder reflow with underfill, or NCP/ACF curing all in one step. Laser heating also makes a fluxless assembly process possible. LAPLACE has high throughput owing to the integration of prealignment and underfill/ACF or NCP curing in the bondhead of the tool and simultaneous chip placement and laser heating. Compared with standard solder reflow or thermode bonding procedures, the LAPLACE system offers the additional advantage of reducing thermal and mechanical stress by heating with laser pulses for only a few msec. The laser light is coupled from the backside of the die directly into the silicon, where the generated heat is dissipated immediately onto the chip surface and the pad/bump interface. Using these process steps significantly reduces common alignment problems that arise from the differing thermal expansion behaviors of substrate and chip. LAPLACE consists of a flip-chip placer with dispensing option, a laser unit, a temperature control unit integrated into the flip-chip placer, and a die-eject feeder with flip unit. Also available are an optional reel-to-reel unit that has a tape width from 150–300mm, an SMT unit for capacitor or resistor attach with tape feeders, and a wafer-handling system. LAPLACE is capable of 3000 placements/hr.
Pac Tech USA, Santa Clara, CA; ph 408/588-1925, [email protected], www.pactech-usa.com.
Dicing system using laser cutter
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The LDS 200 series laser dicing system is a laser cutter that applies the water jet guided laser technique, especially adapted to cutting wafers. It can be used for chip dicing, edge grinding, hole drilling, slotting, grooving, inking, isolating, and marking. Materials cut are silicon, gallium arsenide, germanium, indium phosphate, and other semiconductor materials. Wafers are either fixed on a vacuum chuck or on laser-dicing tape. The tool can process wafers 1–8 in. in diameter. It is available in two versions: front-end, with wafer handler and wafer cassettes, and back-end, with frame handler and frame cassettes. The machines are Class 10 (front-end) or Class 1000 (back-end) cleanroom-compatible. The LDS is available with manual loading (LDS 200 M), with a cleaning station for wafer cleaning after the laser cutting (LDS 200 C), and with a cassette loading unit for cassette-to-cassette processing (LDS 200 A). In all versions, the wafers are aligned and the kerf is checked automatically.
Synova SA, Lausanne, Switzerland; ph 41/21-693-8371, [email protected], www.synova.ch.
300mm process coater/developer
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CLEAN TRACK LITHIUS is a state-of-the-art system that targets stable production at the 70nm technology node. It is capable of 150 wph throughput. LITHIUS offers flexible one-block and two-block configurations, depending on customer processing requirements. The tool allows for the integration of measurement modules into a metrology integration block. The system is designed to expand its capability of APC and e-diagnostics, and to increase productivity by introducing Ingenio TL CT to deal with e-manufacturing. Also, by adopting a modular block structure, the system can reduce the manufacturing and start-up time. Automatic adjustment and engineering support tools for LITHIUS modules reduce the time needed for calibration and the process variations caused by a manual adjustment process. LITHIUS was developed to meet challenges such as diversified devices, shorter lead-times, cost reductions, and optimized equipment performance. The capability of LITHIUS is maximized by the fusion of three concepts: improved processes, enhanced networks, and a short cycle time.
Tokyo Electron Ltd., Tokyo, Japan; ph 81/3/5561-7406, [email protected]; (in US) ph 512/424-1533, [email protected], www.tel.co.jp.
1???8 axis motion controller
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The SPii PCI can support up to eight axes of combined servo and stepper control and provide a constant 10KHz update for both the profile generator and controller, regardless of the number of axes supported. The controller communicates with the host via a powerful 32-bit PCI interface. The SPii PCI can be ..combined with its high-performance sister card, the SPiiPlus, for high-performance and cost-effective controllers. The heart of the SPii PCI is the second-generation servo processor (SPii), which provides a 120MHz RISC processor core with peripherals that meet the needs of demanding motion control applications, all contained within a single chip. The standard controller implements a PIV Filter, automatic Velocity Feedforward and Acceleration Feedforward.
ACS-Tech80 Inc., Maple Grove, MN; ph 763/493-4080, fax 763/493-4089, www.acs-tec80.com.
Equipment automation solution
iAutomate combines and leverages the flexibility of STATIONworks, this company's automation development toolkit, with the knowledge and experience obtained through numerous implementation projects. iAutomate is a complete equipment automation solution that ensures fast and consistent implementation with less development and more reuse of logic across the fab. Its embedded intelligence manages equipment run scenarios for 300mm FOUP, 200mm SMIF, and 200mm Open Cassette equipment configurations, thereby shortening the time a fab takes to "go-live."
Brooks-PRI Automation Inc., Chelmsford, MA; ph 978/262-2459, [email protected], www.brooks-pri.com.
Ultra-precision gantry
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The Ultra Precision Gantry incorporates air-bearing technology to permit virtually frictionless motion and dynamic performance. The systems feature a massive granite base and rigid steel risers to create a highly stable platform. A magnetically preloaded XY air-bearing system — with more than 1 meter of travel in each axis ..— is affixed to this rigid structure and provides the high-accuracy, multiaxis motion. The lightweight moving X-axis crossbeam has dynamic yaw control through use of specially engineered supports. The Ultra Precision Gantry uses zero-cogging brushless linear servo motors driven by sinusoidally commutating servo amplifiers. Noncontact design elements assure cleanroom compatibility and include optical encoders, brushless linear motors, and air-bearing guides that minimize particle generation for clean, low-maintenance operation. The result is a robust and responsive system that provides rapid move and settle rates as well as very smooth constant velocity scans.
Anorad Corp., Shirley, NY; ph 631/344-6560, [email protected], www.anorad.com.
Sputtering targets
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Sputtering targets are available in 62 different metals and alloys, as well as compounds such as borides, carbides, fluorides, nitrides, oxides, selenides, silicides, sulphides, and tellurides. ..In addition, the surfaces of flat sheets up to 80 ¥ 400mm can be heat-treated, remelted, or alloyed using a continuous thermal process. Thin layers of metals or oxides can also be melted onto the surface. This process is well suited to the creation of double-layer sheets and foils, or for ceramic superconductors on metallic or ceramic substrates, and for the creation of thin layers of solder on metals. Targets can be made to order, but a number are held in stock along with an extensive range of items suitable for evaporation.
Goodfellow Corp., Berwyn, PA; ph 800/821-2870, [email protected], www.goodfellow.com.
Aerosol particle counting
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Particle Measuring Systems presents the LASAIR II-110, a full-featured monitor for aerosol particle counting. As the first monitor to use a thermally chilled, solid state diode laser to count 0.1µm particles, it offers ..unequalled accuracy, reduced operating costs, reliability, and longevity. The LASAIR II stores 3000 samples, providing data collection and recipe features that make cleanroom certification faster and easier. It can be controlled from a desktop web-browser as it samples in the cleanroom, then downloads the data into Excel. Or users can dump the data directly into FacilityNet for advanced analyses and reports.
Particle Measuring Systems, Boulder, CO; ph 303/546-7336, [email protected], www.pmeasuring.com.
Cu removers
The CLk line of Cu removers, for bulk resist, ash/etch residues, and copper contamination, are specifically designed to solve the problems posed by the use of copper interconnects and sensitive low-k dielectrics, including porous low-k. CLk-888 stripper and etch/ash residue remover is the newest addition to the line, complementing CLk-820 and CLk-870 residue removers. CLk-888 does not require a dry strip step — maintaining the critical low-k properties of the dielectric. The CLk line of removers complements the existing line of BAKER REZI copper-compatible aqueous chemistries. The BAKER REZI products are >80% water, safe to handle, and easy to dispose.
J.T. Baker, Phillipsburg, NJ; ph 314/654-5233, e-mail [email protected].
Scanning electron microscope
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The JSM-6060 PC-SEM features a magnification range of 5–300,000¥, resolution of 3.5nm at 30kV, a fully eucentric goniometer stage for ...specimens up to 32mm in diameter and 50mm in height, and simple operation with easy-to-use graphic interface. Automatic features include focus, stigmator, contrast, and brightness to simplify operation. Optional features such as low-vacuum capability and a low-vacuum secondary electron detector are available.
JEOL USA Inc., Peabody, MA; ph 978/535-5900, [email protected], www.jeol.com.
Film inspection, MRAM, optical flatness systems
The Film Inspection Tool offers good defect detection capability on a wide variety of film types, including dielectrics and metals. The tool provides accurate defect discrimination that allows the user to reduce the cost of test wafers and shorten the feedback loop in process control. The WaferSight system, a new wafer flatness and shape production metrology tool, allows wafer and device manufacturers to meet ITRS metrology requirements down to the 35nm generation. The V300 Wafer Mapper uses patented technology that measures the most advanced magnetic structures used in MRAMs on wafers up to 300mm.
ADE Corp., Westwood, MA; ph 781/467-3867, [email protected], www.ade.com.
Direct-drive rotary tables for 300mm
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Designed for the next generation of die attach, flip chip, and advanced packaging SMT assembly equipment, RotoRing tables feature large ...14-in.-diameter, center opening to allow access to every die on 300mm wafers. Unlimited table rotation capability allows assembly equipment manufacturers to perform large-angle wafer alignment and die rotation on the wafer and to reduce die transfer time by rotating the wafer. Distributed RotoLinear motor modules provide high positional stiffness to maintain wafer alignment during fast cartesian wafer indexing. These tables feature 30 N*m torque, positional repeatability 3 arc-sec, and rotational accuracy 10 arc-sec.
IntelLiDrives Inc., Philadelphia, PA; ph 215/728-6804, [email protected], www.intellidrives.com.
High-resistivity silicon for RF-IC and MEMS
HiRes silicon is a new substrate for microwave and millimeter wave applications. HiRes wafers can replace existing RF wafer substrates without compromising important parameters and make "one chip" solutions possible. Radio Frequency (RF) capable semiconductor processes face hard design conditions for systems operating at GHz frequencies. HiRes silicon enables full integration of new emerging RF MEMS technologies with RF IC circuits. It is monocrystalline silicon grown by the Float Zone process with bulk resistivity from 8000-30,000 W-cm. HiRes silicon is well suited to the new technology platform where integration of RF and MOSFET is needed. It is available with p- and n-type dopant and has a narrow axial and radial resistivity tolerance.
Topsil Semiconductor Materials A/S, Frederikssund, Denmark; ph 45/ 4736-5600, [email protected], www.topsil.com.
High-temperature fluid pumps
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MPH Series pumps are engineered for low-flow, high-head, high-temperature applications. These close-coupled, sealless, magnetically ..driven pumps provide cost-effective and efficient fluid handling at temperatures up to 536°F with no cooling water required. Featuring a finned frame adapter for effective heat dissipation, MPH Pumps utilize rare earth Samarium Cobalt magnets. Six MPH models are available in 316SS, Alloy 20, or Hastelloy C construction. Using motors from 1 to 5 HP, the pumps handle flows to 150 gpm and heads to 190 ft. Metallic sealless mag-drive pumps and Texel fluoropolymer-lined sealless mag-drive pumps handle high-purity, toxic or noxious fluids.
Magnatex Pumps Inc., Houston, TX; ph 713/972-8666, [email protected], www.magnatexpumps.com.
Compact, diode pumped laser
The newly developed DC Series of air-cooled, diode pumped, harmonic solid-state Q-switched lasers offer a compact, "hands-free" system with long-term reliability. The DC Series was designed to address low-power applications in the infrared (1053/1064nm), Green (527/532nm), UV (351/355nm), and deep-UV (263/266nm) wavelengths; with output power from 50mW to 500mW @355nm, 20mW to 200mW @266nm, and 100mW to 1000mW @532nm. The series delivers superior TEM00 beam mode quality with M2 <1.1. Target applications include MALDI-TOF, LIDAR, semiconductor processing, interferometry, noncontact inspection, fluorescence, holography, micro-marking, and replacement of nitrogen lasers. The DC Series is available with Nd:YAG, Nd:YLF and/or Nd:YVO4 platforms, depending on application.
Photonics Industries Intl. Inc., Bohemia, NY; ph 631/218-2240, [email protected], www.photonix.com.