Semicon Europa Products & Preview
03/01/2003
Launched in 1975, Semicon Europa showcases semiconductor equipment, materials, and services in Europe. This year, the event will be held at the New Munich Trade Fair Centre, Munich, Germany. Some of the new products at the show are described below.
In addition to the exhibit, the show will provide a full range of technical and management conferences that address various needs of the industry.
For an up-to-date schedule of programs and events, exhibitor list, or more information, visit www.semi.org.
300mm wafer bonding system
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The GEMINI system provides a fully automated production wafer bonder to the advanced packaging as well as MEMS ..(200mm bridge tool) production markets. It automatically aligns and bonds wafers up to 300mm and integrates essential process steps such as optical alignment and wafer bonding for high-volume production wafer bonding processes. With its 300mm capability, the GEMINI can perform aligned wafer bonding for stacking wafers. The wafers are handled automatically by a robotic autoload cassette-to-cassette system between the alignment and multiple high-vacuum bond chambers.
EV Group, Scharding, Austria; ph 43/7712-5311-4001, [email protected], www.EVGroup.com.
Furnaces for ALCVD applications
The new A4ALD family of the Advance 400 Series furnaces are dedicated to 150, 200 and 300mm batch ALCVD applications. The new furnaces are suited for ALCVD processing of up to 100 wafers in a batch. The furnaces have a high-throughput configuration of two dual-boat reactors in one system. The reactor section is designed for Al2O3, Ta2O5 and HfO2 ALCVD processing and is also equipped with plasma capacity for the generation of radicals. The main targeted application for these systems is MIM capacitors. Throughput is >30 wph for a 100-cycle process.
ASM International, Bilthoven, Netherlands; ph 31/30-229-8411, www.asm.com.
Drying technology for wet process systems
AeroSonic drying technology for 200mm and 300mm wafers can be integrated into wet process systems or used as a stand-alone dryer. AeroSonic technology dries high-aspect-ratio structures and fragile substrates without breakage while eliminating water spots with near particle-neutral performance at 100nm. The ability to dry double the number of substrates in a half-pitch cassette nearly doubles the substrate throughput per cycle. The AeroSonic process is motionless, eliminating potential wafer breakage and the resulting equipment downtime.
SEZ Zurich, Switzerland; ph 41/1-308-3948, www.sez.com.
High-vacuum transducer
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The HPS Series 909 mini ion transducer is an integrated hot cathode sensor and electronics control package. The 909 is a good measurement tool for high-vacuum applications, including pressure measurement of high-vacuum chambers and control or start-up of high-vacuum systems. The transducer includes a de-gas ..function, digital communications, analog output, and a setpoint. The compact, Bayard-Alpert-type transducer will measure vacuum from 10-10 to 10-2 torr. The electron bombardment de-gas function is pressure-controlled, automatically stopping and restarting at preset pressures.
MKS Instruments Inc., HPS Products, Boulder, CO; ph 800/345-1967 or 303/449-9861, www.mksinst.com.
Deep oxide etching ICP tool
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After the introduction of the "I-Speeder" AMS 200 SE (silicon etcher), its ultrahigh etch rate tool, this company now offers the AMS 200 DE (dielectric etcher), a best-adapted hardware ..and process solution to meet the typical etch requirements of SiO2, quartz, and other glass-like materials. Selectivity is high (up to 30:1) to photoresist mask, with high SiO2 etch rate (>0.5µm/min); high SiO2 etch rate up to 1µm/min with photoresist mask selectivity of 1:1; uniformity <2%; vertical profile angles of 90°; and smooth sidewalls. The system meets SiO2 etch depth requirements from 6–10µm (shallow etch) to >40µm (deep etch). Alcatel Micro Machining Systems, Annecy, France; [email protected].. alcatel.fr, www.alcatelvacuum.com.
Specialty valves and control products
Dymatrix specialty valves and control products provide high-performance solutions for CMP processes and ultrapure water and chemical applications. PV Series pinch valves provide cycle life of more than 2 million cycles, eliminating stress and particle cohesion. Sizes range from 0.25–1 in. in manual and pneumatic styles, with a variety of tube and thread connections. The MPV Series multiport valves utilize a straight-through design to minimize pressure loss, maintain high Cv values, and allow for stress-free slurry operation in applications that include CMP polishing and rinsing.
Asahi/America Inc., Malden, MA; ph 781/321-5409, [email protected], www.asahi-america.com.
Exhibit Dates & Hours
Tuesday, April 1 10:00–5:00
Wednesday, April 2 10:00–5:00
Thursday, April 3 10:00–4:00
Standards Meetings
Monday–-Thursday, March 31–April 3