Product News
02/01/2003
Automated macro defect inspection
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WaferView is an automated after-develop wafer inspection system for 200mm and 300mm wafers. It offers chipmakers full automation of macro defect inspection by inspecting 100% of the wafer surface at throughputs >100 wafers/hour. The WaferView system also offers chipmakers a new industry standard for defect capture rate and accurate classification. Full-color technology and proprietary image-processing capability combine to detect 95% of photolithography defects and correctly classify them 85% of the time. In operation, the captured full-color image is compared with that of a "golden" wafer with no defects. When a difference is detected, its image is compared with a library of known classified defects. In addition, the instrument can "learn" a virtually unlimited number of new defect classes, so that customers can define defects based on their existing classification system. The system is aimed at increasing overall fab profitability by identifying defects and improving dispositioning decisions, allowing correction of yield-robbing problems before they result in scrap. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, [email protected], www.rudolphtech.com.
Drying technology for wet process systems
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AeroSonic drying technology for 200mm and 300mm wafers can be integrated into wet process systems or used as a stand-alone dryer. It is designed to bring productivity gains through shortened cycle times, increased uptime, and the ability to dry half-pitch cassettes. AeroSonic technology also dries high-aspect-ratio structures and fragile substrates without breakage while eliminating water spots with near particle-neutral performance at 100nm. The technology shortens cycle-time and increases throughput by dynamically varying process parameters during the cycle and controlling the transition time between process set points. The ability to dry double the number of substrates in a half-pitch cassette nearly doubles the substrate throughput/cycle. The AeroSonic process is motionless; this eliminates the potential for wafer breakage and the resulting equipment downtime. The new drying technology complements this company's immersion products (wet benches), which include the recently introduced A3 300mm immersion tool. The design of the new line of dryers can be used in applications that include silicon wafers, III-V material wafers, MEMS devices, glass substrates for flat-panel technology, and other fragile substrates. The technology uses isopropyl alcohol (IPA) to draw water away from the surface of the substrate, eliminating water spots even with high-aspect-ratio structures. By adjusting the amount of aerosol IPA delivered to the surface of the substrate, the AeroSonic process can dry half-pitch cassettes and structures such as deep trench wafers. MTBF is >3000 hours. SEZ America, Phoenix, AZ; ph 602/453-5058,[email protected], www.sez.com.
Deep oxide etching ICP tool
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This tool is a new version of the AMS 200 ICP etching tool, specifically designed for deep oxide etching in MEMS & MOEMS applications. After the introduction of the "I-Speeder" AMS 200 SE (Silicon Etcher), its ultrahigh etch rate tool, this company now offers the AMS 200 DE (Dielectric Etcher), a best-adapted hardware and process solution to meet the typical etch requirements of SiO2, quartz and other glass-like materials. The following results have been achieved: very high selectivity (up to 30:1) to photoresist mask, with high SiO2 etch rate (>0.5µm/min); high SiO2 etch rate up to 1µm/min with photoresist mask selectivity of 1:1; uniformity <2%; vertical profile angles of 90°; and smooth sidewalls. The system can meet SiO2 etch depth requirements varying from 6–10µm (shallow etch) to more than 40µm (deep etch). Alcatel Micro Machining Systems, Annecy, France; [email protected], www.alcatelvacuum.com.
X-ray inspection system
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The VJ-1000 LP X-ray inspection system is a high-resolution x-ray inspection system designed to provide a cost-effective solution for the semiconductor packaging and surface mount assembly markets. The system provides high-resolution images of BGAs, Micro BGAs, and other chip scale packages with a 4-in. image intensifier, digital x-ray control, and 25–200¥ magnification for precise inspection. The VJ-1000 LP can accommodate PCBs up to 18 ¥ 27 in. for maximum flexibility. The system's Nexus 200 software provides Windows NT-based image analysis and CAD-based programming. All systems include a 20 Gig hard drive and a CD writer for instant image and data archival. All systems are network compatible. V.J. Technologies Inc., Bohemia, NY; ph 631/589-8800 or 800/858-9729, fax 631/589-8992, www.vjt.com/electronix.
Critical dimension and overlay measurement
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The MicroLine 500 measurement system automatically measures overlay patterns and linewidths on cassettes of wafers using a robotic wafer loader. It measures features 0.5–40µm at 100¥ and 10–800µm at 5¥. Measurement repeatability is 2–5nm (1 sigma). A motorized x-y stage provides better than 25µm stage positional accuracy/8 in. of travel. An automatic wafer handler with prealigner, motorizednosepiece, and pattern recognition provides ..full automation. The MicroLine 500 automatically loads wafers, detects alignment features, and performs measurements without operator assistance. A vibration isolation platform is standard. Application programs included with the system are written using this company's Measurement Control Language (MCL). This text-based language controls all functions of the MicroLine 500. Program files are easy to read and allow users to modify existing programs or create their own programs to control the system's operation. MicroLine 500 processes measurement results to determine the average, maximum, minimum, spread, standard deviation, and other statistical results from selected sets of data. Micro-Metric Inc., San Jose, CA; ph 408/452-8505 or 800/490-3333, [email protected], www.micro-metric.com.
Wafer geometry and nanotopography metrology
NanoPro NP1 is a single-tool solution for wafer geometry and nanotopography metrology. Designed to address 200mm and 300mm volume production requirements, NanoPro NP1 enables silicon wafer, silicon-on-insulator (SOI) wafer, and chip manufacturers to lower wafer production costs and improve yields for ≤100nm device applications. Combining wafer shape, thickness, flatness, and nanotopography metrology in a single scan, it can monitor SOI and bare wafers inline at multiple points during the wafer production process, including grinding, etching, and rough and final polish. It also provides frontside and backside topography analysis and high spatial sampling resolution, needed to reduce wafer-edge exclusions. KLA-Tencor Corp., San Jose, CA; ph 408/875-5473, [email protected], www.kla-tencor.com.
193nm ArF excimer laser
The NanoLith 7000 is a next-generation, high-performance 193nm ArF excimer laser. It offers 20 watts average output power at 4 kHz repetition rate and is designed to support high scan speeds for maximum productivity and wafer throughput. With its highly line-narrowed bandwidth, targeted to be ≤0.5 pm at FWHM and ≤1.3 pm at 95% energy integral, the NanoLith 7000 allows high-contrast imaging from lithography scanners using lenses with a numerical aperture over 0.75. Built-in laser metrology provides pulse-to-pulse data acquisition and feedback control to minimize transient wavelength instabilities, thereby enhancing exposure latitude and CD control. Cymer Inc., San Diego, CA; ph 858/385-6327, [email protected], www.cymer.com.
UHV gate valves
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UHV SoftShut gate valves, for PVD and other ultrahigh-vacuum (UHV) applications, feature a patented track-guided SoftShut gate mechanism and metal body seals, providing ..quiet, low-particle operation up to 100,000 cycles between maintenance. They are suitable for use in the pressure range 2 bar (1500 torr) to 10-11 mbar (10-11 torr). The SoftShut mechanism provides fast linear gate motion to position the gate, then precisely controlled vertical motion for sealing, virtually eliminating mechanical shock and minimizing particle generation over the entire cycle life. SoftShut bodies can be baked to 250°C and actuators at 200 or 230°C for the pneumatic or manual versions. Heated sealing plates and high-temperature limit switches are available. Thermo Vacuum Generators, San Jose, CA; ph 408/965-6523, [email protected], www.softshut.com.
Automation for MEMS packaging
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The MRSI-5005 Advanced Packaging Assembly Work Cell is configured for automated assembly of MEMS (Micro-Electro-Mechanical Systems) and MOEMS (Micro-OpticalElectro-Mechanical Systems) packaging. Interconnect technologies include eutectic die .. attach, epoxy die attach, and flip chip. MRSI-5005's features are specifically designed to address the requirements and challenges of MEMS and MOEMS assembly. For example, "feature touch" force control, combined with closed-loop force feedback, provides the ability to handle the devices without damage to internal micro structures. The thermally and mechanically stable machine platform delivers 5µm placement accuracy in a clean environment, which is required for a high-yield assembly process for these devices. Advanced vision provides the ability and flexibility to perform local top surface alignments, as well as alignment to bottom features. Material presentation methods include waffle pack, Gel-Pak, and wafer. Newport Corp., North Billerica, MA;
Vibration-free platform
Model 2212 is a portable vibration-control system with an ultraflat tabletop. With a guaranteed flatness of ±0.004 in. over 24 ¥ 24 in., it is designed to enhance the performance of atomic force microscopes, microhardness testers, profilometers, balances, etc. Combining the economy and portability of a breadboard with the self-leveling, active-air system of a vibration-isolation workstation, the platform provides very good vertical vibration control and low natural frequency. Model 2212 is available in four table sizes up to 24 ¥ 36 in., with load capacities ranging up to 450 lbs. It is Class 100 cleanroom-compatible, with Class 10 available as an option. Kinetic Systems Inc., Boston, MA; ph 617/522-8700, www.kineticsystems.com.
High-speed controllers
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These two instruments are designed for fast process applications. Both controllers feature a high-speed sampling rate of 0.025 sec, or 40 times/sec, greatly suppressing overshoot. The high-speed sampling function is suitable for extremely fast processes such as RTP, wire bonding, lamp annealing, or flip chip bonding, as well as mass flow. The HA ..Series, available in 1/4 and 1/8 DIN sizes, is a panel-mounted controller with a large bright LED display for easy viewing. A maximum of two PID loops of control is provided in a single unit. Users can select from single loop, dual loop, or cascade control modes. A multi-memory area stores up to 16 sets of parameters, allowing the unit to serve as a 32-segment ramp/soak controller. Modbus, Profibus, and DeviceNet communications are available. Additional functions include power feed forward and independent dual digital communication ports. The same features and high sampling speed are offered in the SRX modular DIN rail mounted controller. The SRX controls up to two loops/unit, but up to 31 modules may be joined to form a system. RKC Instruments, South Bend, IN; ph 574/273-6099, [email protected], www.rkcinst.com.
Machine vision applications
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IllumiCam employs patented and patent-pending holographic/diffractive hybrid optical technology to provide both intense and accurate field of view illumination. The technology uses holographic optics ..placed in a ring format to collect, shape and vector the light from a series of LEDs to specific sites to be inspected. The optical system provides unprecedented control over the illumination uniformity and provides computer control over selective multiple wavelength LEDs, diode lasers, and standard light sources. Applications include critical dimension inspection (CDI), machine vision alignment, and inline semiconductor inspection. IllumiCam allows simultaneous illumination of a work piece being aligned andillumination for photo-cure bonding within the same operation. NanoVia LP, Londonderry, NH; ph 603/421-0713, [email protected], www.nanovia.com.
Six-degrees-of-freedom micropositioning and alignment
The HexaLight is a compact, parallel-kinematics micropositioning system providing six degrees of freedom and micrometer-range precision. Compared with its (higher-load) predecessor, the new M-840 is distinguished by significantly higher positioning speeds ..(50\mm/sec and 300 mrad/sec) achieved by reducing the load rating from 200 kg to 20 kg (the 200 kg system is still available). Parallel-kinematics designs operate with an extremely small moved mass (as low as 1/50th that of stacked systems). This reduced inertia, and the identical dynamical properties for all servo-controlled axes allow for faster and more precise response to control inputs. The versatility of the M-840 is based on its virtual-pivot-point capability (a vector-based 6D hexapod motion controller is part of the system), allowing for rotations around any point in space. Polytec PI, Auburn, MA; ph 508/832-3456 or 714/850-1835, [email protected], www.polytecpi.com.
Rotary stage
The ADRT Series Direct-Drive Rotary Stage provides superior angular positioning and velocity control. Applications range from indexing to high-speed laser machining to precision wafer inspection. ADRT uses a slotless, ironless design to give ultrasmooth performance and ease of tuning when compared to iron core and variable-reluctance motor designs. This motor has the advantages of a brushless direct-drive motor — no brushes to wear, no gear trains to maintain, and high acceleration and high speeds. Low inertia and zero backlash make the ADRT well suited to applications requiring frequent directional changes. Aerotech Inc., Pittsburgh, PA;ph 412/963-7470, [email protected], www...aerotech.com.
Stepper for bump manufacturing
The Saturn Spectrum 3e is designed for high-volume bump manufacturing for wafers up to 200mm. Its proprietary broadband 1¥ optical system allows processing of both g-line or i-line photosensitive films. Dynamic focus capability enables exposure of both thin and thick films. The PatMax MVS alignment system eliminates the need for dedicated targets and facilitates easy equipment insertion in any new or existing bump fab line. The high wafer-plane irradiance, along with superior resolution and greater DOF, makes this stepper highly suitable for volume bump applications.Ultratech Stepper, San Jose, CA; ph 408/321-8835, [email protected], www..ultratech.com.
Multi-variate fault detection
iProcess-FDC is a new software product for monitoring factory-wide process and tool health through both the internet and intranets. iProcess-FDC (fault detection and classification) provides data visualization, virtual sensor modeling, and uni-variate and multi-variate analysis, allowing process and equipment engineers to monitor and analyze process disruptions and rapidly refine tool and process operations. iProcess-FDC's easy-to-use interface enables engineers of all experience levels to deploy fault detection and health monitoring quickly. Brooks-PRI Automation Inc., Chelmsford, MA;ph 978/262-2459, [email protected], www.brooks-pri.com.