Product News
01/01/2003
Metrology for copper CMP
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The Nano CLP-9010 copper laser profiler nondestructively monitors the metal loss between an isolated copper feature and the surrounding dielectric region. The measurement module is a high-throughput, small-spot-size laser profiler that can be easily integrated within a metal CMP system. Unlike reflectance-only methods, the laser profiling technology is immune to previous level patterning noise that can cause unreliable end-pointing of the polishing process. Integration of the Nano CLP-9010 gives users control over the copper CMP process because it ensures that the process can be continuously monitored, improving both wafer yield and cost efficiency. The Nano CLP-9010 module uses a differential interferometer and this company's production-proven spectroscopic reflectometry for direct measurement of the surface profile of copper features. The differential interferometer projects two small laser spots on the sample surface, and the phase shift between the spots due to the height difference is measured. The spectroscopic reflectometer measures the optical properties associated with the adjacent dielectric film stack. The data are then combined to yield the height profile of the measured features. The exact amount of metal loss is calculated from the height profile. Nanometrics Inc., Milpitas, CA; ph 408/435-9600 ext 264, [email protected], www.nanometrics.com.
Step-and-scan system
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The TWINSCAN AT:1200B step-and-scan system is a high numerical aperture (NA) 193nm system designed to extend ArF imaging technology for volume production of devices with features as small as 80nm. The third-generation ArF system is based on the TWINSCAN platform. TWINSCAN is known for its dual-stage technology, which allows the exposure of one wafer and the simultaneous alignment and measurement of the next, enabling continuous patterning. The AT:1200B combines the imaging power of a variable 0.60–0.85 NA Carl Zeiss StarLith 4¥ reduction lens with AERIAL II illuminator technology. In addition to these imaging capabilities, the system incorporates enhanced, on-board metrology, which provides accurate overlay and focus control for improved process control in leading-edge designs. The system extends the boundaries of low k1 imaging (0.35 k1 factor achieved with 0.85 NA and 80nm resolution) and offers flexible pupil shaping for advanced illumination control and process window enhancement. The AT:1200B has throughput of 103 wph (300mm) or 150 wph (200mm), resolution of 80nm, field size of 26 ¥ 33mm, overlay (single machine) 12nm or (matched machine) 20nm, and a 20W ArF laser. ASML, Veldhoven, Netherlands; ph 31/402-682-602, [email protected], www.asml.com.
Etch tool process control
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Ingenio is an advanced process control (APC) system for real-time data collection and analysis. It is currently available for the Unity (200mm) and Telius (300mm) etch systems. Ingenio TL ES is a tool-level system that offers real-time collection of tool data and analysis. It provides the foundation for this company's etch applications to provide fault detection and classification, tool-level wafer-to-wafer control, and module-level run-to-run control. The system also provides interfaces for fab-level run-to-run control and e-diagnostics applications. Ingenio TL gives customers the ability to monitor process variation; it improves overall etch equipment efficiency by reducing pilot and send-ahead wafers. The Ingenio family is open and scalable, with tight integration to existing factory-level applications. Ingenio TL is available as a standard option for all this company's etch platforms. Tokyo Electron Ltd., Tokyo, Japan; ph 81/3-5561-7406 or 512/424-1533 (US), [email protected], [email protected], www.tel.co.jp.
Optical diagnostic platform
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The Optonics EmiScope product line is a solution for design debug and failure analysis in advanced ICs. The EmiScope is a noninvasive, passive optical diagnostic platform that gives product developers node-level visibility of timing information for backside measurement of flip-chip packages and complex multilayer devices. It utilizes innovation in optoelectronic waveform acquisition and high-bandwidth timing analysis to detect increasingly small and fast signals. It delivers multi-GHz bandwidth and picosecond accuracy. With its efficient design and high-speed acquisition and data-processing capabilities, the EmiScope eases the difficult and time-consuming process of gathering timing data and finding faulty areas on advanced semiconductor devices. The EmiScope supports advanced technology measurement needs and is extensible to sub-0.1µm design rules and sub-1V operation. It is also compatible with — and optimized for — SOI-based devices. Optonics Inc., Mountain View, CA; ph 650/810-2209, [email protected], www.optonics.com.
Ultrathin-film metrology
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Theta 300 provides nondestructive characterization of all types of ultrathin films, including complex new gate dielectrics. It measures, nondestructively: thickness of single and multiple layers from atomic monolayers to 10nm; ..depth profiles; composition of the layers in three dimensions, including elemental and chemical state information; full wafer maps of composition and thickness; concentration of contaminants; and surface composition. The tool handles full wafers, up to 300mm, packaged devices, and small samples. Theta 300 is based upon Parallel Angle Resolved X-ray Photoelectron Spectroscopy, a new technology developed by this company that is also available in a non-wafer handling version, Theta Probe. Thermo VG Scientific, East Grinstead,UK; ph 01342-327211, [email protected] tific.com, www.thermovgscientific.com.
Gas delivery system
The SpectraSure gas cabinet features a flow-through process gas path that eliminates the requirement for multiple vacuum venturi systems. The system's "5-plus" panel design reduces dry-down time and minimizes dead spaces in the process flow path, allowing users to get processes running quickly. SpectraSure gas delivery systems, featuring the iGSC controller, are designed to meet present and future special gas delivery needs. The 5-plus manifold design's "plus" configuration ensures compliance with industry standard codes such as CE and UFC, and Semi S2-0200. BOC Edwards, Wilmington, MA; ph 800/848-9800, [email protected], www.bocedwards.com.
Alignment accuracy measurement system
The EVG40 top-to-bottom side alignment accuracy measurement system is the alternative, destruction-free solution for alignment accuracy measurement of double-sided structured wafers. It accurately measures any substrate material up to 200mm using high-resolution CCD cameras for top and bottom side microscopes. Proving the alignment accuracy of top-to-bottom side aligners is required in the production of MEMS and other technologies that involve double-side photolithography. The EVG40 measurement method offers reliable, increased functions and incorporates a 180° rotation in the measurement process. EV Group, St. Florian, Austria; ph 43/7712 5311-0, [email protected], www.EVGroup.com.
Ultrahigh-resolution analytical FESEM
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The SUPRA range of field emission scanning electron microscopes (FESEM) combine ultrahigh-resolution imaging and analysis in one ..instrument. Semiconductor, nanoscale technology and material analysis applications benefit from resolution of 1.7nm @ 1kV and 4.0nm @ 0.1 kV. Improvements to the SUPRA range include a 100% higher beam current and extended variable pressure (VP) range. The LEO SUPRA with the GEMINI column combines four instruments in one: ultrahigh-resolution FESEM over the complete voltage range, FESEM for handling large awkwardly shaped specimens, fully analytical FESEM, and FESEM with VP technology to investigate nonconducting specimens without prior preparation. LEO Electron Microscopy Group, Oberkochen, Germany; ph 49/7364-946137, [email protected], www.leo-em.com.
PZT nanopositioning/scanning stages
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HERA stages are long-travel, precision-guided PZT nanopositioning stages that provide a linear travel range of up to 600µm and optional sub-nm-resolution capacitive position feedback in a package as small as 40 ¥ 40 ¥ 15mm. HERA systems are suitable for advanced applications such as nanometrology, scanning microscopy, optics and mask alignment. Typical applications are metrology, semiconductor ..inspection, CD measurement microlithography, mask alignment, and high-resolution microscopy. Designed for industrial OEM applications, the systems feature a zero-maintenance friction-free flexure guiding system, new solid-state PZT drives with 100% ceramic insulation, and an optional digital controller with automatic tracking-error elimination. Polytec PI Inc., Auburn, MA; ph 714/850-1835, [email protected], www.polytecpi.com.
Monitoring molecular surface contamination
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The FlowThru AiM monitor samples cleanroom air to detect trace level depositions of molecular contamination on critical surfaces. The FlowThru system draws a sample through Teflon tubing, then passes the sample across ...selective surfaces such as SiO2, copper, silver or PermAlloy. Surface Acoustic Wave (SAW) technology is then used to measure real-time mass deposition, with a sensitivity of 0.02ng/cm2. The FlowThru AiM is particularly powerful for detecting depositions of nonvolatile organic or acidic residues on critical surfaces, such as hydrocarbon contamination of optics, or microscopic corrosion of metallic surfaces. It can also be used to evaluate chemical filter penetration or the contamination of process gases. Particle Measuring Systems, Boulder, CO; ph 303/.546-7336, [email protected], www..pmeasuring.com.
Multi-variate fault detection
iProcess-FDC is a new software product for monitoring factory-wide process and tool health through both the internet and intranets. iProcess-FDC (fault detection and classification) provides data visualization, virtual sensor modeling, and uni-variate and multi-variate analysis, allowing process and equipment engineers to monitor and analyze process disruptions and rapidly refine tool and process operations. iProcess-FDC's easy-to-use interface enables engineers of all experience levels to deploy fault detection and health monitoring quickly, enhancing their ability to react to process disruptions. Brooks-PRI Automation Inc., Chelmsford, MA; ph 978/262-2459, [email protected], www.brooks-pri.com.
Compact, diode pumped lasers
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The DC Series air-cooled, diode pumped, harmonic, solid-state Q-switched lasers offer a compact "hands-free" system designed to address low-power applications in the infrared (1053/1064nm), green (527/532nm), UV (351/355nm), and Deep UV (263/266nm) wavelengths; with output power from 50mW–500mW @355nm, 20mW–200mW @266nm, and 100mW–1000mW @532nm. The lasers deliver superior TEM00 beam mode quality with M2 <1.1. Target applications include MALDI-TOF, LIDAR, semiconductor ..processing, interferometry, noncontact inspection, fluorescence, holography, micro-marking, and replacement of nitrogen lasers. The DC Series is available with Nd:YAG, Nd:YLF and/or Nd:YVO4 platforms, depending on application. Photonics Industries International, Bohemia, NY; ph 631/218-2240,[email protected], www.photonix.com.
Communications software
GWconX300 software is used to implement communications links on wafer-fabrication equipment, using the new Semi standard protocols required for all 300mm and advanced 200mm factory-automation systems. It provides run-time software libraries designed for incorporation with the embedded control software of any type of 300mm equipment. GWconX300 also provides tools for rapid development and integration of connectivity software. Key features include automated handling of intercompatibility between new Semi standards; field-configurable adjustments that ensure compatibility of equipment with older legacy host computers; automatic process, syntax checks, and replies to all messages mandated by the specified Semi standard; and hooks for synchronization with the Semi E84 standard, ensuring a smooth handshake between production equipment and the AMHS. Asyst Technologies Inc., Fremont, CA; ph 510/661-5000, [email protected], www.asyst.com.
Motorized micropositioner
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This micropositioner provides high-precision motion control, in three dimensions, by remote control. Model XYZ-500 MIMT is motorized and may be controlled either by computer or joystick. It addresses a ...wide spectrum of analytical, test, instrumentation and production equipment applications: automating the positioning of probes, test heads, lasers, optics, and numerous other system components. The XYZ-500 MIMT controls motion in the X, Y and Z axes and provides 0.5 in. of travel in each dimension. It uses three high-precision stepping motors that are attachedto precise gearheads driving high thread-count screws. As a result, ultra-fine motion control can be achieved, with resolutions from 0.48µm/step down to 0.0105µm/step, depending upon the gearbox ratio that is ordered. The new positioner has a base footprint of 1.5 ¥ 2 in., and an overall size of<2 ¥ 5.3 ¥ 4.7 in. Quater R&D, Clackamas, OR; ph 503/247-7131, [email protected], www.quater-research.com.