New Products
11/01/2000
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Step-and-repeat scanning system
The NSR-S205C step-and-repeat scanning system is a fifth-generation lens-based "scanner" that can mass-produce devices of 150-130nm. It uses a KrF excimer laser and an ultrahigh NA (0.75) projection lens that realizes a resolution of 150nm or better. Overlay accuracy is <30nm and throughput is 140 wafers/hour (200mm). The system is also suitable for use with 300mm wafers, with throughput of 84 wafers/hour. A change of wafer size can be accommodated in the field. Using a modified illumination technology such as SHRINC, a resolution of 130nm or better can be achieved for next-generation DRAM and MPU applications. The 4:1 reduction system has a 25 x 33mm exposure field. A new body design minimizes vibration and improves temperature control. Nikon Precision Inc., Belmont, CA; ph 650/508-4674, e-mail [email protected], www.npeurope.com.
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Innovative RTP tool
The LEVITOR 4000 is a new rapid thermal processing (RTP) tool that uses gas-bearing principles to suspend a wafer 0.1mm between the surfaces of two large refractory material blocks, which are heated to the desired process temperature. Since the thick, heated blocks operate as a thermal flywheel, overall heating efficiency is high, and because the block material has very good thermal conduction, uniform heating of the wafer is guaranteed. The 4000 requires only 5% of the energy used by conventional lamp systems, and since it has no lamps to replace, its cost of ownership is low. There is no sensitivity to emissivity on either the front or backside of the wafer, resulting in reduced use of test and setup wafers. Heat transfer is achieved primarily by conduction, not radiation, and the tool gives very good temperature uniformity because of the large mass of the blocks, with no possibility of overshooting the set point. The 4000 has fast, reproducible heat-up and cool-down rates >300°C/sec. It does not contact the wafer surface. Wafer rotation is possible in either direction, with speeds up to several hundred rpm. ASM International N.V., Bilthoven, Netherlands; ph 31/30-229-8540, www.asm.com; in the US, ph 602/470-5829, e-mail [email protected].
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High-speed linear wafer track
The Acrobat is a fully configurable, high-speed, linear lithography processing track that is capable of stand-alone operation or direct interface with a stepper. It is designed for vapor priming, coating, baking, and developing processes. The heart of the Acrobat is a gentle but fast central wafer/substrate handling system with a self-centering, dual-wafer, vacuumless gripper unit that can handle wafer diameters of 5-8 in. A special handler allows processing of thin wafers. The vacuumless design reduces particle contamination and potential metal ion migration from standard robot paddles. A special software program allows users to input their process times and preferred sequence of events, and the configuration software maintains the optimum mix of up to three spin process modules and up to four stacks, with a total of 16 hot/cool plates. One stack can be configured as a vapor prime module, increasing equipment utilization rates and overall equipment effectiveness. B.L.E. Laboratory Equipment GmbH, Radolfzell, Germany; ph 49/77-3299-190, fax 49/77-3299-1911, e-mail [email protected], www.blelab.de.
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Laser probe system for flip chips
The IDS 2500 is a high-precision timing measurement tool for design verification and failure analysis of leading-edge flip-chip packaged ICs. It uses innovative phase interferometer detector (PID) technology to speed access to critical waveforms that are needed to de-bug high-end flip chip logic devices. Designed for <0.18mm processing, it enables manufacturers of complex devices — including MPUs, NPUs, and ASICs — to reduce time to market. The new tool speeds the analysis of first silicon by combining faster acquisition time and greater signal strength with the proprietary PID, which adjusts the laser scanning microscope (LSM) and makes it easier to use. PID, the new LSM technique, uses a "reference beam" and a probe beam to measure the interference between the two reflected signals. This phase interference method improves responsiveness and accuracy by taking advantage of measurement physics and increasing the overall number of waveforms/hour the tool can provide. Signal strength has improved 2x, allowing IC waveforms to be acquired faster. Proven on 0.18mm processing, new 2ms duty cycle capabilities enable the system to de-bug complex ICs that require a long test loop length. Schlumberger Semiconductor Solutions, San Jose, CA; ph 408/586-6474, e-mail [email protected], www.slb.com.
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Copper electroplating to 0.05mm
The Jet Electrochemical Deposition tool (JECD) is designed to deposit copper patterns on semiconductor devices with feature sizes of 0.05mm resolution and aspect ratios of about 28:1. In addition, a proprietary seed layer has been developed for interconnects <0.10mm, allowing much faster void-free copper filling of the smallest features. JECD's deposition rates are very high. Jets Technology, Santa Clara, CA; ph 408/980-1700 or 650/494-0268, e-mail [email protected], www. theinformationnet.com.
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300mm lithography for flip chips
The Saturn Spectrum 300 wafer stepper offers 300mm lithography capabilities for the flip chip (bump) processing arena. It builds on this company's 1x litho system, which — with its broadband lens — allows for automatic selection of exposure spectrum (i-line, gh-line, or ghi-line). The tool has a low numerical aperture lens design, tailored to provide maximum DOF for bump applications, and it is available in a variety of field sizes. High illumination intensity results in high throughput with high dose exposures, while the Machine Vision System allows for alignment to any unique feature on the wafer. The system, together with the Saturn Spectrum 3, can accommodate all wafer sizes from 100-300mm and can process both thin (1-10mm) and thick (10-100mm) resists on the same stepper. The systems are equipped with imaging resolution down to 2.0mm and are expected to support all flip-chip-related lithography processing requirements for several years. Ultratech Stepper Inc., San Jose, CA; ph 408/321-8835, fax 408/577-3379, e-mail [email protected], www.ultratech.com.
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Reticle inspection tool
TeraScan 570 is a high-throughput DUV wavelength inspection platform designed to capture pattern defects generated during advanced reticle manufacturing at the 0.13mm node and below. It provides a fourfold increase in throughput compared with its predecessor 300-Series tools and can detect defects as small as 100nm. The TeraScan 570, intended to inspect reticles for 248 and 193nm lithography applications, uses a multiple parallel sensor array illuminated by a nonlinear, crystal frequency doubled, argon-ion laser to deliver DUV wavelength inspection. The tool incorporates an image computer that allows it to achieve a 200 million pixel/sec inspection rate and permits the use of proprietary algorithms to provide both die-to-die and die-to-database inspection with better than 100nm sensitivity. Parallel optical fibers carry gigabits of data per second internal to the system for maximum throughput. More than a dozen active control loops provide nanometer mechanical stability and an active force cancellation system maintains near-perfect quiet on the floating 2000-kg granite optical bench. The 570 also supports existing defect data communications links to installed defect repair and defect review systems. KLA-Tencor, San Jose, CA; ph 408/875-7039, e-mail [email protected], www.kla-tencor.com.
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Automation control for 300mm
Autocalibration technology completely eliminates the time-consuming and subjective robot point teaching required during tool installation, configuration, and maintenance. Calibration can be performed in minutes at the touch of a button for faster machine commissioning, more reliable operation, reduced need for skilled technicians, and reduced costs. This company's fully integrated, notebook-sized BXi motion and machine controller can control almost all wafer-handling equipment without using valuable floor space. Its network-based architecture is easily scalable and allows machines to be monitored remotely anywhere in the world. Berkeley Process Control Inc., Richmond, CA; ph 510/236-3333, fax 510/236-1186, e-mail [email protected], www.berkeleyprocess.com.
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Turbopump with integrated controller
The TPH 2101 turbopump provides high-capacity pumping — 1900 l/sec for n2 —and is highly suitable for such processes as HDP CVD and reactive ion etching. It is the latest in a line of turbopumps that allow users to customize vacuum processes with "plug and play" capability by adding pump peripherals for specific vacuum applications. The integrated controller permits easy cable connection to peripheral devices that control venting and interlocking backing pump control, and heat, temperature management, or cooling functions. Users connect to the pump only those peripherals required by their operations, lowering cost of ownership. Pfeiffer Vacuum Inc., Nashua, NH; ph 408/946-9733, fax 408/263-7826, e-mail [email protected], www.pfeiffer-vacuum.com.
Measurement and automation software
LabVIEW 6i, with Internet-ready capabilities, increases the productivity of chipmakers. Users can deploy applications to colleagues with the new LabVIEW Player browser plug-in, publish data to the Web, and share data throughout an enterprise. In addition to its Internet capabilities, 6i offers measurement intelligence to build test and measurement applications in fewer steps than in previous LabVIEW versions. LabVIEW can be used in R&D labs, cleanrooms, test environments, manufacturing floors, and in the field, to optimize product life cycle and reduce manufacturing costs. National Instruments, Austin, TX; ph 800/258-7022, fax 512/683-8411, e-mail [email protected], www.ni.com/labview.
Conductive, ultrapure silicon carbide
Low Resistivity PerformanceSiC CVD silicon carbide provides purity, stiffness, chemical and oxidation resistance, the ability to withstand thermal shock, and dimensional stability combined with low electrical resistance. It material can satisfy any application that requires electrical conductivity, wear resistance, and thermal shock resistance. These applications would involve heating elements, susceptors, chambers, sputter targets, processing chambers gas distribution plates, edge rings, heaters, electrostatic chucks, and all types of electrodes. The material is theoretically dense and intrinsically pure, has a high degree of chemical and process inertness, and has a bulk electrical resistivity of 0.012 ohm-cm. Performance Materials Inc., Hudson, NH; ph 800/700-1283, fax 603/598-9126, web site www.performancematerial.com.
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Plasma workstation
The HPR-100 plasma workstation features an inductively coupled plasma (ICP) cell fully integrated with both mass spectrometer ion mass/energy and Langmuir probe analyzers for characterization of diverse process and surface interactions. The ICP cell — complete with RF generator, matching network, and four-stream flow control module — is close-coupled to the EQP and ESPION plasma probes for detailed analyses, including energy-resolved mass spectra and mass-resolved energy distributions of both positive and negative ions, electron energy distribution functions, plasma potentials and densities, radicals, and functional groups. Designed for the researcher and operating with a wide range of gas species, pressures, and plasma powers, the HPR-100 allows optimization of all control and process parameters for precise and fundamental investigative studies of plasma activity and of interaction with organic, metallic, and composite substrates. Hiden Analytical Ltd., Warrington, UK; ph 44/1925-445-225, fax 44/1925-416-518, e-mail [email protected], www.hiden.co.uk.
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Enhanced in-line dispensing systems
The 3700/5700 dispensing system incorporates new piston pump and weight calibration technology that enables mid-range and low-volume manufacturers to increase speed and accuracy in underfill and encapsulation for semiconductor packaging. The automated weight calibration system ensures greater precision in process control and more efficient use of materials. Operators can perform setup more quickly and reliably with a software interface that also allows real-time programming of parameters such as target weight and tolerance check process calibration. A new multi-piston pump further enhances speed and precision with an easy-to-clean, "no drip" design and a repeatability factor better than ±1%. The pump requires no recharge time, reducing dispensing cycle times. The 3700 and 5700 systems feature contact or noncontact heated chucks. They can handle a variety of substrates and boards for specific applications and can accommodate components in Auer boats, JEDEC trays, ceramic substrates, leadframes, and circuit boards. Ball screws and servo motors (with closed-loop encoders) on all three axes ensure accurate dispensing. Speedline CAMALOT, Franklin, MA; ph 508/520-0083 or 978/521-7309, email [email protected], www.speedlinetechnologies.com.
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High-power UV laser
The Vanguard all-solid-state laser provides >4W of quasi-cw output at 355nm. It is the first high-power, commercial laser to use Saturable Bragg Reflector (SBR) technology, under license from Lucent Technologies. This simple and robust mode-locking mechanism results in a pulsed, high-repetition rate output, well-suited to applications currently using cw gas lasers. Vanguard is a frequency-tripled Nd:YVO4 laser with a pulsed repetition rate of 80MHz and pulse duration of 10 picosec. It is based on the proven FCbar diode-pumping design and is intended for demanding OEM applications, featuring TEM00 output (m2 <1.2), very good beam-pointing characteristics, and rugged industrial packaging. Spectra-Physics, Mountain View, CA; ph 650/966-5546, e-mail [email protected], www.spectra-physics.com.
Line-narrowed excimer laser
The EX50LN is a line-narrowed excimer laser with linewidths <1pm FWHM at 193nm and 248nm. It is packaged in a single, compact, lightweight, tabletop unit. The laser can also operate with <5pm linewidth. Output energy is >7mJ in the <1pm mode and 15mJ in the <5pm mode at 248nm. Several repetition rate versions are available, from a 125Hz air-cooled up to a 1000Hz water-cooled unit. The tool uses a total metal/ceramic design to give very long optics and gas lifetimes, up to 90 days with KrF without gas exchange. Gas refill is accomplished using the onboard vacuum pump from a Windows 9x/2000/NTTM-based software package that controls all laser functions. The EX50LN is suitable for metrology or high-spectral-brightness applications where a full-scale industrial line-narrowed excimer laser is not needed. Pointing stability is better than 20mRadians/C. Gam Laser Inc., Orlando, FL; ph 407/851-8999, fax 407/850-0700, www.gamlaser.com.
Solvents, acids and blends
These ultrapure PPT grade solvents, acids and blends are designed for such applications as photoresist, resist strippers, edge bead removers, drying agents, etchants, and cleaners. Available are acetic acid, IPA, PGMEA, DPGME, EEP, NMP cyclopentanone and other keytones. Technic France, La Plaine Saint Denis, France; ph 33/14-946-5100, fax 33/14-820-5530, e-mail [email protected].
157nm broadband reflective coating
ARC 1570 broadband reflective coating is optimized to deliver superior reflectance, 84-86%, at 157nm (at normal incidence), while also providing very good reflectance, 88-90%, throughout the UV and visible spectral regions. The high-efficiency coating can be optimized for other angles of incidence and is available on customer-supplied materials or as a complete mirror by selecting a standard substrate. ARC 1570 is available in single piece or in high-volume OEM quantities. Applications include semiconductor metrology tools and laser exposure systems that require 157nm optimization for next-generation lithography. Acton Research Corp., Acton, MA; ph 978/263-3584, fax 978/264-0859, e-mail mail@acton-research.
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Gas detection system
Designed for OEM aplications such as pre- and post-process monitoring on wafer-fabricating tools and emission monitoring on wet scrubber systems, the STX-HT Smart Gas Detection System immediately alerts operating personnel to unacceptably high gas concentratiion levels, as well as conditions that compromise monitoring integrity. It consists of an STX transmitter/controller linked to a model HT gas sensor. Gas concentration information is displayed on a local digital readout and output as a 4-20 mA analog signal. Concentrations that exceed user-programmed action levels activate local alarm LEDs, as well as dedicated concentration alarm relays. The STX-HT is available for many toxic and corrosive gases. PureAire Monitoring Systems Inc., Rolling Meadows, IL; ph 888/788-8050 or fax 847/788-8080, e-mail [email protected], www.pureairemonitoring.com.
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FT-IR sampling accessories
Smart Accessories are built with a special housing so that when they are snapped into place in the Nexus or Avatar sample compartment, they form a sealed environment. Some benefits of the system include: easy installation with automatic accessory recognition that allows quick set-up and analyzing; optics that are permanently aligned; an enclosed, sealed design that allows for rugged analysis while protecting the optics and mirrors from contamination and eliminating the need for adjustments; automatic diagnostic checks and spectral quality checks; and interactive multimedia tutorials to maximize performance. Spectra-Tech Inc., Shelton, CT; ph 203/926-8998, fax 203/926-8909, www.spectra-tech.com.
Vibration control
The MOD-2 system actively eliminates low-frequency vibration in mid-size setups. SEM users often have difficulty retrofitting a SEM with a vibration solution. The MOD-2 Sandwich is composed of X MOD-2 elements (as many as necessary for the weight load-150kg/element), and a bottom and top plate casing system. The sandwich is then essentially a full, active vibration-isolation platform that is only about 14 cm (6 in.) in height. The SEM is simply lifted and the sandwich platform is slid underneath. Also available is a special device for lifting SEMs, so that they can be raised to the required height without having to be disconnected. Halcyonics GmbH, Goettingen, Germany; ph 49/551-999-0620, fax 49/551-999-06210, e-mail [email protected], www.halcyonics.de.
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Manifold pressure controller
The model GC12-4CH is a very fast (as short as 50msec), high-precision, four-channel pressure gauge and control device. The device includes four independent pressure meters, control valves, and bleed valves with an integral field-programmable PID loop controller. Communication is a choice of either analog (0V-5V, 10V or 4mA-20mA) or digital. Pressure control ranges from negative to 100 psig with +0.25 percent accuracy and 0.1 percent stability. The process connections are customer-specified. Alicat Scientific Inc., Tucson, AZ; ph 520/290-6060, fax 520/290-0109, www.alicatscientific.com.
Laser pattern generators
The Omega6000 line of laser pattern generators offers leading-edge photomask-making capability for technology nodes to 0.15mm. It operates at 413nm wavelength and prints on i-line resists. The pattern generators include the Micronic Maestro, which consists of a family of job management and data pre-processing systems. It incorporates JobQueue functionality, which allows the efficient job management of one or several Omega6000 tools, further optimizing tool utilization in the mask shop. Upgrades within the Omega6000 line are available, allowing mask shops to extend their capability when their order mix develops. Also, second layer alignment capability for phase-shift masks is offered as an option, and data path expansion options are available for production of extremely dense data without throughput loss. Micronic Laser Systems AB, Täby, Sweden; ph 46/8638-5210, www.bit.se.
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Software for electroplating control
DynaComm II is 32-bit Windows-based software that operates under any of the current platforms available (95/98/NT/CE). Employing either the simple point-and-click or touchscreen technology common for Windows applications, it provides an electroplating process control program for this company's PRO-Series and DC rectifiers. DynaComm II consists of an operator interface for parameter entry and display, and a control server to control and monitor the rectifiers. These two applications use a Windows socket connection to interchange data using the Internet protocol. This two-part design allows DynaComm II to be installed on a single computer for a stand-alone application or to be installed on separate computers. This design also allows any application program that will support the Internet protocol to be connected to the control server. Dynatronix Inc., Amery, WI; ph 715/268-8118, fax 715/268-8183.
BARCs for dual damascene
This complete line of bottom antireflective coatings (BARCs) for dual damascene processing features solutions for DUV, 193nm, and i-line processing. They are engineered for via-first filling, offer very low defects, and are compatible with both low- and high-activation energy photoresists. Via filling is easily controlled by adjustment to process conditions. The product line includes: AZ KrF-17B 80 coating for DUV processing; AZ ArF-2P coating for 193nm processing; and AZ HERB for i-line processing. AZ Electronic Materials/Clariant Corp., Somerville, NJ; ph 908/429-3538, e-mail [email protected], www.azresist.com.
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ICAP series spectrometers
The IRIS Advantage ICAP (inductively coupled argon plasma) series spectrometers provide users with the speed and performance of a simultaneous ICAP plus the full wavelength accuracy and flexibility of a sequential ICAP. This combination ensures high productivity and optimum analytical data. A proprietary CID (charge injection device) detector supplies continuous wavelength coverage, with all spectral information available at a single glance. The IRIS ICAP series extends the wavelength range down to 165nm, allowing the determination of Al at the sensitive 167.081nm line and the determination of N using the 174.490nm line. This is accomplished while retaining the ability to measure K at 766.490nm. TJA Solutions, Franklin, MA; ph 800/229-4087 or 508/520-1880, fax 508/520-1732, e-mail [email protected], www.tjasolutions.com.