New Products
10/01/2000
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CVD cluster tool
The Planar fxP single-wafer cluster tool offers a complete dielectric roadmap to 0.1mm production on a single product platform. It uses proprietary Flowfill and Low K Flowfill technologies for standard and low-k IMD dielectrics, enabling logic and DRAM manufacturers to migrate easily to finer design rules and higher-speed devices without changing hardware. Planar fxP takes this company's production-proven CVD process hardware and adds extra functionality and productivity with a new wafer-transport module that uses a fast-action robot handler with dual end effectors, offering three axes of movement. Two vacuum cassette loadlocks provide the interface to the fab and can easily be integrated with SMIF or other automation systems. Control of the tool is achieved through the Windows NT-based GUI. A wafer orient station and cool-down module, integrated within the transport module, offer complete process control and compatibility with standard plastic cassettes. Six process module positions are available around the transfer module so that tool configuration can be specified to maximize throughput. The environmental impact of the new tool is minimized by a new plasma clean technology that reduces PFC emissions by more than 85%. Trikon Technologies Inc., Newport, UK; ph 44/1633-414013, e-mail [email protected], www.trikon.com.
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Bumped wafer inspection system
Adding to the bump defect and dimensional inspection capabilities of the existing WS-1000, the WS-2000 inspection system provides full surface defect detection. A new laser technology allows the WS-2000 to perform a full 3-D inspection at twice the previous throughput. By providing both 2-D and 3-D inspection capabilities on one system, the 2000 performs each type of critical inspection using the most appropriate method, eliminating the compromises in speed and accuracy found in conventional systems. Proprietary 3-D laser technology provides highly accurate measurement of many variables, including bump height and coplanarity. Such variables can contribute to connection failures but cannot be measured by 2-D technology, making 3-D measurement vital for maximum yield and throughput. The system's 3-D inspection module gathers thousands of 3-D data points in a fraction of a second to give complete coverage of the bump and wafer surface for true 3-D measurements. The 3-D laser system design enables the machine to inspect even the most reflective bumps and wafers. Robotic Vision Systems Inc., Canton, MA; ph 800/669-5234, fax 781/828-9852, www.vai.net/press.
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SOC test system
The Tiger, an extension of the Catalyst system-on-a-chip (SOC) tester family, provides 1024 digital pins and 1.6 Gbps data rates with integrated real-time analog instruments for SOC devices in disk drive, network switching, PC chip set, and advanced graphic applications. Tiger's timing system architecture combines custom high-density CMOS for flexibility, and high-performance SiGe for final timing generation, providing very high digital test speeds. The CMOS/SiGe combination creates an unmatched range from full timing flexibility for wide data buses to high speed differential for new multi-gigabit communications links. Flexible waveform capability allows multiple independent time domains with edge timing, wave shape, and period swithching on-the-fly at full data rates. The CMOS/SiGe approach thus permits Device Under Test (DUT)-cycle programming, where test waveforms are based on DUT timing needs and are not constrained by a tester's instruction cycle rate. Teradyne Inc., Boston, MA; ph 617/422-2567, fax 617/422-2530, e-mail [email protected], www.teradyne.com.
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Modular deposition systems
The 635 Series of modular deposition systems feature an upgradeable approach to both lift-off evaporative and sputter-based wafer coating, allowing users to begin with a base system and add capacity and capability as needed. The 635/SL (single load) system incorporates an innovative load-locked dome shuttle with a 45-in. source-to-substrate throw distance with a 37.5-in. dome. It lets the user manually load up to 25 wafers (150mm), close the differentially pumped load dock, and be back at process pressure in <5 min. (Conventional systems can keep operators waiting >20 min for optimal process pressure.) For higher wafer start requirements, the 635/DL (dual load) system features a second load lock, lift-off dome, and dedicated cryopump mounted alongside the base system. This allows simultaneous loading or unloading of one dome while the other is processing. The 635/RL (robotic load) features a Semi Class 10, fully robotic, cassette-to-cassette wafer-handling system for up to 100 wafer starts/hour (150mm). The 635 Series is offered in both right- and left-hand footprints, together with standalone ballroom and flush-mounted cleanroom wall arrangements. CHA Industries, Fremont, CA; ph 510/683-8554, fax 510/683-3848, www.chaindustries.com.
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Noncritical etch tools
The i900 Series noncritical etch tools combine the advanced logic of the 6500 Series plasma etchers with the production-proven platform of the 900 Series to increase the functionality, productivity, and flexibility of this company's etch solutions. It features a new graphical interface and touchscreen, as well as a PC-based operating system, and is capable of on-line and off-line data logging for analysis via CD, diskette, and on-screen diagnostics. Storage capacity is limited only by the user's hard drive potential. Other features of the system include unlimited plasma recipes, improved transport through newly designed motor drivers, and flexible software for future upgrades. Service and warranty standards for previous models apply across the board to the new platform. Tegal Corp., Petaluma, CA; ph 707/763-5600, fax 707/765-9311, e-mail [email protected], www.tegal.com.
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Ultrahigh-purity cylinder gas delivery
MegaBIP technology delivers consistent, ultrahigh-purity gas through a trouble-free purifying system contained inside a gas cylinder. By using a proprietary two-port valve arrangement, in combination with an internal check valve, the integrity of the purifier media is maintained at all times. A fully integrated non-return valve prevents any contaminants from being backfilled into the purifier, while a dual port fill/withdrawal arrangement ensures that the gas flows only one way through the purifier bed. This functionality is contained within a compact package and is completely transparent to the end user, relieving the customer of the burden of cylinder gas purity. In addition to consistency within the cylinder, MegaBIP technology provides greater cylinder-to-cylinder consistency. Use of these cylinders can also eliminate the cost and uncertainty associated with maintaining conventional in-line purifiers. Because the level of impurities can vary from one cylinder to the next, determining exactly when a purifier needs replacement can be a problem. Since the process purifier is fully integrated within the cylinder in the MegaBIP system, both the quality of the fill gas and the quantity of the purifier media are controlled. Air Products and Chemicals Inc., Allentown, PA; ph 610/481-5971, e-mail [email protected], www.airproducts.com.
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Non-volatile memory test
Kalos XW, for volume testing of non-volatile memory (NVM) components, doubles the test capacilty of the Kalos system, allowing independent testing of up to 32 sites with 48 pins/site or 16 sites with 96 pins/site in parallel. This translates into the ability to test up to 32 NOR Flash, 64 NAND Flash, or 128 serial NVM components in parallel. The Kalos test head allows a zero-footprint interface to probers and handlers with overhead docking capability, providing the greatest amount of test capacity per unit of floorspace in both wafer sort cleanrooms and in final package test areas. Kalos XW is also capable of mass parallel testing of flash devices while they are mechanically attached to a leadframe in an electrically isolated configuration. This "strip" or "panel" testing process has already been production-proven on the original Kalos tester, and the XW extends this capacity to test as many as 128 devices in parallel. Credence Systems Corp., Fremont, CA; ph 510/623-4774, fax 510/623-2524, e-mail [email protected], www.credence.com.
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Automated film metrology systems
The NanoSpec 9100 is currently the only available standalone system equipped with DUV to near-infrared spectroscopic ellipsometry, DUV to visible reflectrometry, and FTIR technology. NanoSpec 9200 features the latest generation of spectroscopic reflectometer, very good pattern recognition, auto-focus, and auto-positioning stage and robotic wafer-handling capabilities. It features auto-recipe deployment, thickness
efractive index/extinction coefficient mapping, and a database with statistical analysis capability. The 9200 offers a spectral range of 400-800nm or 190-760nm, and uses advanced dispersion models and an absolute reflectivity measurement technique to measure a majority of the single- and multilayer film stacks used in IC production. Throughput is >200 wafers/hour. NanoSpec 9300 is an automated, noncontact thin film metrology system designed for use in advanced 300mm wafer manufacturing. It features a DUV to near-infrared spectroscopic ellipsometer with a wavelength range of 190-1000nm, for highly precise measurement of new processes and materials such as very thin ONO film stacks, ARC films, and photoresists for 193nm lithography. Nanometrics Inc., Sunnyvale, CA; ph 408/746-1600 ext 101, fax 408/720-0196, e-mail [email protected], www.nanometrics.com.
Compact dry vacuum pump
The On-Tool Dry Pump is a compact dry vacuum pump that mounts directly to a process tool and offers up to 100 m3/hr pumping speed. The pump measures 12 x 12 x 22 in. and provides vertical or horizontal on-tool mounting. This allows it to fit into almost any semiconductor vacuum application or process and eliminates the need for large Roots pumps in the pump chase. All connections are placed on one side of the pump for easy installation. The pump's integrated, programmable, variable speed controller can maintain pumping speeds from 15 to 100 m3/hr. It is rugged and leak-tight, and eliminates costly plumbing and pump chase downside risks, such as leaks, contamination, and pumping speed losses. Pfeiffer Vacuum Inc., Nashua, NH; ph 603/578-6500, fax 603/578-6550, e-mail [email protected], www.pfeiffer-vacuum.com.
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Oxygen analyzer for RTP
The Dycor CG1100-RTP oxygen analyzer meets the requirements for use on rapid thermal processing (RTP) tools, using very fast heating cycles to perform high-temperature processes traditionally performed by slower-heating batch furnace technologies. The analyzer improves processing yields by detecting oxygen contamination at the parts-per-million level, and it maximizes throughput by ending the purge cycle as soon as the oxygen background is at an acceptable level. Features of the CG100-RTP include: a zirconium oxide sensor for accuracy and fast response; electronic flow control, allowing a range of operating pressures; a wide detection range (ppm to 100% oxygen); ease of integration into the tool controller and data acquisition system (RS-232 and RS-485 communication ports, analog 4-20mA outputs, and I/O alarms available); and an easily configurable hardware platform. AMETEK Process Instruments, Pittsburgh, PA; ph 412/828-9040, fax 412/826-0399, www.ametekpi.com.
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Chiller series
The Merlin Series chillers range in cooling capacity from 810 to 5045 watts. Features include an easy-view fluid reservoir, a reservoir drain for quick and clean fluid changes, an integrated fluid pressure reducer/flow controller, and a powerful, simple-to-use controller. Merlin offers several user interface features, including high and low temperature safeties, an audible alarm, computer control, and stability to ±0.1°C. NESLAB Instruments Inc., Portsmouth, NH; ph 603/436-9444, fax 603/436-8411, www.neslab.com.
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Tungsten effluent system
The HPS effluent management subsystem for tungsten CVD prevents the solidification of condensable byproducts and the chemical reaction that causes additional buildup. By combining heat from HPS Series 45 heaters and a nitrogen purge from the proprietary Virtual Wall, the subsystem reduces clogging and increases uptime and yield. A chemical reaction between tungsten hexafluoride (WF6) and water from the wet scrubber causes tungsten oxifluorides and tungsten oxides to form in the exhaust line. These byproducts clog the exhaust line and the scrubber inlet, requiring frequent exhaust maintenance. WF6 is also extremely toxic, causing safety issues in line maintenance. By heating the exhaust line from the pump, then installing a tungsten CVD-specific Virtual Wall at the scrubber inlet, byproduct sublimation is greatly reduced. MKS Instruments, Vacuum Products Group, Boulder, CO; ph 800/345-1967 or 303/449-9861, www.mksinst.com.
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UV water treatment systems
Designed for applications where multiple UV units are required, Aquafine skid systems combine several UV treatment chambers and electrical enclosures into one turnkey system. The compact design is particularly well suited to semiconductor ultrapure water systems where TOC levels in the 0.5 ppb range are required. The skid-mounted systems feature compact control cabinets that house the Aqualogic 2000 microprocessor controls, which provide continuous, detailed UV system feedback, including absolute real time UV intensity measurement for validation and audited production processes. The system can be configured from any desktop via the 4-20mA output signal. Total access to UV intensity, temperature, lamp status, running time, and cycle count is available via PC. Aquafine Corp., Valencia, CA; ph 661/257-4770, fax 661/257-2489, e-mail [email protected], www.aquafineuv.com.
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Wafer substrate bonding unit
The WSB2 wafer substrate bonding unit, for II-VI and III-V semiconductor wafers, is designed for temporary wax mounting of semiconductor materials. The bonder incorporates a new heat exchanger that leads to a significant reduction in cool-down times. The heat exchangers are sealed units and do not have an oil exhaust, so the bonding unit can be located in the same room as the lapping/polishing machine. The WSB2 also features a flexible diaphragm within the bonding jig. This diaphragm ensures that the wafer is pressed into the wax layer in a controlled manner, providing a uniform, parallel cushion to protect the wafer and its devices; it keeps the sample and device architecture from coming into contact with the support disc. This achieves elimination of cleavage, repeatability of bond thickness, and very high dimensional accuracy. Available as a single or three-station unit for whole or part wafers up to 6 in., the WSB2 incorporates both vacuum and pressure wax bonding capabilities. Logitech Product Group, Westlake, OH; ph 800/321-5834, fax 440/871-8188, e-mail [email protected], www.logitech-us.com.
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Automated VOC monitor
The airmoVOC1010 is the first ultracompact, parts per trillion-capable GC/FID that is specifically designed for continuous, unattended monitoring of volatile organic compounds (VOCs). The sophisticated gas chromatograph (GC) offers an alternative to other on-line and off-line VOC monitoring protocols. Components are separated on a temperature-programmed "capillary column and detected on a flame ionization detector (FID). The 19-in. rack-mountable system is fully automatic, from sampling to reporting. The monitor employs PC-based data-handling and instrument-control software. Typical applications include monitoring of ambient air for ozone precursors, hazardous air pollutants, and fugitive emissions. Trace Analytical, Menlo Park, CA; ph 650/364-6895, fax 650/364-6897, www.traceanalytical.com.
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Fiber-coupled laser diode system
The F-Package System is a stand-alone, microprocessor-controlled, large-core, optical-fiber-delivered laser diode system in wavelengths from 650-980nm. Suitable for materials processing applications such as soldering and epoxy curing, the F-Package eliminates the need for a separate thermal management platform and a lab-style power supply. The module consists of a fiber-coupled, single-stripe laser diode (rated from 0.2-2.5W, depending on the configuration) mounted on an active air-cooled heat sink, with an optional thermoelectric cooler capable of regulating laser diode case temperature from 10-40°C, along with all necessary laser diode and TEC drive and control electronics. Measuring 120 x 260 x 360mm and weighing 4.0 kg, the system is portable and plugs into a standard wall socket. Coherent Inc., Semiconductor Group, Santa Clara, CA; ph 408/764-4677, fax 408/764-4329, e-mail [email protected],www. cohr.com/diodes.
Continuous-flow processing for VFM applications
The MicroCure CF5100 is a continuous-flow model of variable frequency microwave (VFM) curing system. It can process a continuous flow of parts without the need to close doors or separate parts into batches, allowing faster processing of smart cards, flexible circuits, and other products that are manufactured in sheets or formats such as reel-to-reel or reel-to-singulation. The CF5100 features a system of microwave chokes that completely contain microwaves within the curing area, permitting it to stay open to a conveyorized flow of parts. This allows faster processing while eliminating the uneven heating and costly preparation of large reels associated with batch curing in conventional ovens. Lambda Technologies/Macrotron, Munich, Germany; ph 49/89-45111-145, fax 49/89-45111-105, e-mail [email protected].
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Liquid dispensing system
The Micro Dispenser, part of the DS Series of liquid dispensing systems, is designed to dispense conductive materials and microelectronic liquid encapsulants for semiconductor packaging applications. It offers complete control for lab processes, batch production, and volume manufacturing, and it is available in both stand-alone (Micro I) and in-line (Micro II) versions. The Micro I has an 18 x 18 in. heated work area with vacuum and dual substrate locking fixtures, while the Micro II can be equipped with three zones for pre-, post-, and work-area heat. The system has a dispense rate of 28 K/dph and features X/Y/Z accuracy below ±0.0015 in. and X/Y/Z repeatability below ±0.0006 in. Z-height repeatability is maintained at ±0.0006 in. using a touch probe, allowing for precise needle positioning. Both dispensers operate on a QNX real-time "true" multi-tasking operating system using proprietary dispensing software displayed in a Windows format. The Micro II is also available with a magazine loader and unloader for automated applications. GPD, Grand Junction, CO; ph 970/245-0408, fax 970/245-9674, e-mail [email protected], www.gpd-global.com.
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PFA bellows pump
The PFS2 is a new version of the AstiPure PFA bellows pump for slurry applications. Designed primarily for the semiconductor industry, it features a rounded spires bellow and can be used in CMP processes with flow rates up to 100 l/min. Unlike other pump systems, where a diaphragm rupture often occurs on the inflection ring, there is no inflection point on the PFS2 bellow when it is moving. It works only in elongation, making the risk of bellow rupture extremely low. Because the pumps are made entirely of high-tech thermoplastic materials, there is almost no ionic contamination. Saint-Gobain Performance Plastics, Wayne, NJ; ph 714/630-5818, fax 714/688-2614, www.furon-asti.com.
Gas cylinder weighing scale
Model CWS 321 gas cylinder weighing scale, for gas cabinet and gas cylinder applications in semiconductor production, is accurate to within 0.10% of full scale, with long-term stability of 0.5% FS/1 year, which optimizes gas usage and reduces replacement costs and production downtime. The scale platform is available with a load capacity of 60 lbs (30 kg) or 300 lbs (135 kg). Its low profile (0.97 in.) and small footprint (9.25 x 9.25 in.) provides easy loading and off-loading of the cylinders with minimal lifting. Due to a multiple strain gauge design, off-center loading is 0.10% FS, assuring virtually no loss of accuracy. An additional RFI shield is combined with the high-resistance strain gauge to ensure low susceptibility to output noise and RFI error. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, fax 978/264-0292, e-mail [email protected], www.setra.com.
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CO2 blasting unit
The CO2 MiniBlast SDI-5 can use any form of dry ice, including blocks, pellets, and nuggets. It cleans coater cups, teos valves, ammonium nitride, etch parts, and implant parts without the use of solvents and without damage to the substrate. Recent modifications to the design of the blasting gun barrels allow users to change from one form of dry ice to another without needing to change barrels. This gives the SDI-5 great versatility in cleaning by allowing the user to easily select the best media for each application. Pellets are preferable when eliminating thick, hard-to-remove contaminants; granulated particles generated from the block or nuggets are preferable on thinner coatings. Dry ice disappears on impact with the targeted surface. CAE Alpheus Inc., Rancho Cucamonga, CA; ph 909/481-6444, fax 909/481-9724, www.dryiceblasting.com.
Electrical modeling software
Wirebond Electrical Modeling Software is designed to work as decision support software to assist VLSI design engineers, packaging engineers, and wirebond engineers to make first order design-related decisions in a very short time. As the industry moves toward high-density, high-frequency, high-I/O, and fine-pitch devices, wirebonds are getting closer, causing signal integrity problems. Mutual inductance and inductive coupling significantly affect the signal integrity of the device. Measurement of inductance is a complex process, involving sophisticated fixturing and de-embedding processes. Also, inductance measurement through simulatiion involves 3-D modeling of the wire loops and complex analysis. This new software can be used to make firsthand decisions. It has a library of loop shapes for different kinds of packages, including BGA and CSP loops. It gives graphical comparison of self, mutual and loop inductances as functions of chip height, cavity depression, loop height, wire angles, wire length, spacing betweem wires, and wire diameter. The software also meets JEDEC wire modeling standards. APT Interactive, Bangalore, India; ph 091/80-665-7277, fax 091/80-663-9214, e-mail [email protected], www.aptinteractive.com.
Moisture analyzers
The V Series FTIR-based analyzers measure trace H2O contamination in corrosive gases. They can reach the lower detection limit of 10 ppb of H2O in matrices of HCl, HBr, and NF3. Results are attained in real time, with measurement intervals <1 min. Rather than traditional purging of the instrument, the spectrometer compartment is evacuated to 10-5 torr to eliminate background atmospheric moisture. This can reduce set-up times from two weeks (for a high-quality purge) to 24 hours. MIDAC, Irvine, CA; ph 949/660-8558, fax 949/660-9334, e-mail [email protected], www.midac.com.
In situ temperature monitoring/analysis
APTOS 2 (active plasma thermal optical system) is designed for in situ wafer temperature uniformity measurement in plasma processes, including etch, plasma strip, and CVD. It collects real-time data and analyzes multiple process and equipment variables to determine specific effects on wafer temperature at any time during the process sequence. APTOS includes temperature measurement wafers instrumented with embedded fiber-optic sensors, an optoelectronic interface, and a data analysis system. The system provides in situ multipoint temperature measurement to within 2mm of the wafer edge under high-density plasmas from -60 to 420°C. Measurement accuracy is ± 1°C below 130°C, ±2°C from 130 to 200°C, and ±3°C from 200 to 420°C. APTI (arrays of peak temperature indicators) wafers provide permanent, accurate peak wafer temperature indication for plasma etch processes. Temperature sensor arrays, located as close as 3mm from the wafer edge, are embedded in the wafer and sealed under sapphire windows. They autoload and process like product wafers without system downtime or risk of arcing or chamber contamination. SensArray Corp., Santa Clara, CA; ph 408/330-5600, e-mail [email protected], www.sensarray.com.
High-performance vision system
The acuReader III is a high-performance vision system that identifies wafers and components through the semiconductor manufacturing process. It provides a comprehensive semiconductor ID solution, combining this company's OCR software technology — the most widely used technology for reading alphanumeric characters on wafers — with enhanced ID capabilities for reading 2D data matrix codes on 300mm wafers, leadframes, substrates, and other components. Chipmakers can now achieve complete part traceability through a variety of processes, such as wafer sorting and handling, wafer inspection, microlithography, bonding, and marking. The system features a comprehensive library of software tools for reading OCR, 2D data matrix, and bar code symbologies, and a Wizard-based interface that guides the user step-by-step through the process of setting up ID applications, automatically configuring the correct parameters as it goes. Cognex Corp., Natick, MA; ph 508/650-3140, e-mail [email protected], www.cognex.com.
Dielectric film processing
The Producer S system delivers the same productivity and throughput as the first-generation Producer system, with a 22% reduction in length for optimized use of cleanroom space. Based on this company's revolutionary platform architecture, it combines the benefits of TwinChamber handling with the advantages of single-wafer process technology in a simple and reliable system design. Producer S supports a wide range of dielectric film applications and allows easy extendibility to 300mm processing. It also incorporates the environmentally friendly Remote Clean technology, which virtually eliminates PFC emissions. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647, www.appliedmaterials.com.