New Products
08/01/2000
Low-energy ion implant
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The GSDIII/LED (low energy decel) ion implantation system covers the full range of low-energy, high-dose applications, allowing ultrashallow junction formation at 180nm and beyond. It combines the proven GSD series platform with a new high-transmission beam line in a low-energy system. The system offers reliable performance from 80keV down to 200eV, covering traditional high-current applications as well as ultrashallow junction processes for advanced device development. Commonality with the GSD platform includes the end station and wafer handling, control system architecture, ion source technology, the charge control system, dose control methodology, the user interface, and the gas delivery system. High productivity results from the fastest available batch wafer-handling architecture, which minimizes overhead time, including 5-sec repositioning time for quad implants. Integrated real-time dose control further improves productivity by increasing beam utilization while providing tight process control. Advanced xenon-based plasma charge neutralization ensures alignment with the accelerated SIA Roadmap by providing the safest charging protection for devices with ultrathin gate oxides. Axcelis Technologies Inc., Beverly, MA; ph 978/232-4000, fax 978/232-4275, [email protected].
Universal CMP system
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Momentum is a highly flexible, dry-in/dry-out CMP system that lets manufacturers transition seamlessly from oxide to tungsten to shallow-trench isolation (STI) or copper processing. It integrates three advanced components. The Next polishing technique synergistically combines the stability of an advanced solid platen with the superior flexibility of orbital system architecture. The APT (Adaptive Planarization Technology) wafer carrier provides significant wafer profile control, giving very good post-polish within wafer uniformity to a 3mm edge exclusion in STI and copper applications. Intelligent In-line Inspection (i3) closed-loop control simplifies lot changes through automatic adjustments based on first-wafer polish results. The fully integrated NOVA 840 metrology unit captures wafer data; this is sent to the Momentum control system, where predictive modeling software evaluates and makes necessary changes to the process for subsequent wafer polishes. This means one-step automated processing of any size wafer lot. SpeedFam-IPEC Inc., Chandler, AZ; ph 480/705-2119, e-mail [email protected], www.sfamipec.com.
High-speed defect detection system
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Compass is the first patterned wafer inspection system to detect critical defects in devices with design rules <100nm at the high speeds needed for volume production. It features OmniView multi-perspective laser scanning technology that compiles information from six scattering directions to ensure the robust detection of a wide variety of defect types across all process layers. The system's very high scanning speed gives throughputs up to 60 wafers/hr, depending on the selected scan mode. As the wafers are scanned, Compass' On-The-Fly (OTF) grouping capability automatically sorts all detected defects into coarse bins, separating critical from nuisance defects for tighter excursion control. OTF grouping also allows optimal use of the leading-edge SEMVision cX defect review system for rapid, automatic classification and identification of the defects' source. A variable sensitivity feature on the Compass enables users to adjust the system's sensitivity and throughput for different materials, patterns, layers, and production requirements. Applied Materials Inc., Santa Clara, CA; ph 408/748-5227, www.appliedmaterials.com.
PECVD system for dielectric films
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VECTOR is a new plasma-enhanced chemical vapor deposition (PECVD) system for dielectric films. A low-cost 200/300mm bridge tool, it is designed to deliver a fully integrated low-k dielectric structure at 0.1mm design rules with a throughput of 120 wafers/hour. Leveraging field-proven, multistation sequential deposition technology, the new tool provides very good film uniformity (typically 1% across the wafer) and repeatability (typically 1% from wafer to wafer). VECTOR deposits a wide range of dielectric thick and thin films and is optimized to deposit this company's latest generation of CORAL low-k films, which are extendible to <0.1mm. Novellus Systems Inc., San Jose, CA; ph 408/943-9700, fax 408/570-2635, e-mail [email protected], www.novellus.com.
300/200mm RTP tool
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The 3000 Steam system is a 300/200mm rapid thermal processing (RTP) tool deigned for volume production of devices down to 0.1mm. It incorporates an externally generated steam capability with concentrations ranging from 1% to 90%. This capability builds upon the proven technology platform of the STEAMpulse RTP tool, which successfully addresses shallow trench isolation, selective oxidation, and gate oxidation applications. The 3000 also features ripple emissivity-independent temperature control capability, which provides repeatable results regardless of varying wafer backside conditions and allows for superior uniformity with a total components of variance (TCV) of ±2°C. The system includes a special slip-free ring design that entirely surrounds the wafer to eliminate edge effects, reducing wafer slip defects during high-temperature processing. A dual-arm robot ensures high throughput rates for very good results in production environments. STEAG Electronic Systems Inc., Tempe, AZ; ph 480/777-0021, fax 480/777-0025, e-mail [email protected].
Benchtop stylus profiler
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The Dektak 8 is a small-footprint, benchtop stylus profiler that allows multiple measurements to be programmed over the entire surface of 200mm wafers. Optional 3-D imaging, low-force scanning, and 1mm vertical range make the instrument a flexible R&D tool for a wide range of applications, including step heights, roughness and waviness, thin film stress, and MEMs. Veeco Metrology Group, Plainview, NY; ph 805/967-2700 ext 295, fax 805/967-7717, e-mail [email protected].
Multi-application die bonding platform
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Based on the field-proven 2008 die bonder, the Die Bonder 2008xP is an expandable platform that handles a wide range of applications, from metal leadframes, substrates, and films to singulated BGAs. Fast modules, especially the pick-and-place, allow 8000 UPH for matrix leadframes. For high-end applications, the bonder features an advanced vision system incorporating optical bond centering and optical dispense centering, which locate and center the bond pad. The result is high process stability and a die placement accuracy of 8.3µm at 1o. ESEC Group, Cham, Switzerland; ph 41/749-5111 or 602/893-6990, e-mail [email protected], www.esec.com.
Process control for copper electrodeposition
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The Real Time Analyzer (RTA) is an automated, on-line, and in-tank process control system for monitoring electroplating processes. RTA analytical techniques are based on proprietary electrochemical technology using AC and DC voltammetry. The instrument precisely controls all critical components in copper damascene electrodeposition to ensure highly reliable manufacturing. Specific applications are immediately available to support commercial processes from Enthone OMI, Shipley Ronal, and Technic. Technic Inc., Providence, RI; ph 401/781-6100, fax 401/781-2890, e-mail [email protected].
Process Equipment
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FIB copper milling process
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Developed with leading semiconductor manufacturers, CoppeRx is a focused ion beam (FIB) copper milling process for advanced circuit edit. Combined with gas chemistry, it delivers uniform milling rates regardless of how the copper interconnect is produced. Previously, FIB milling was unsuitable for copper because it milled unevenly. Typical multilayer copper parts use the top layer(s) for power and ground buses that cover most of the chip below. To gain access to lower-level structures for circuit edit, engineers must first clear away relatively large areas of copper. Smooth milling, as provided by CoppeRx, is critical in creating a flat bottom crater without milling randomly into lower-level structures. FEI Co., Hillsboro, OR; ph 503/844-2695, e-mail [email protected], www.feic.com.
Plasma impedance monitor
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The SmartPIM is an in-line plasma monitoring device that fingerprints the plasma chamber through simultaneous measurement and display of current, voltage, and phase of the first five Fourier components. It can deliver a dynamic range of up to 140 dB, allowing engineers to achieve consistent process repeatability. Because SmartPIM features a sensor head that is transparent to RF — with no reflected or absorbed power — it eliminates the need to requalify the plasma process. The device also installs easily on existing process tools, offering users almost a plug-and-play capability. Users can collect data on a laptop PC or integrate into existing data management structures. Scientific Systems USA Inc., San Jose, CA; ph 408/995-5975, fax 408/938-3929, e-mail [email protected].
Hardware/Accessories
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Precise shaker system
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The STACIS Test Bed System is a precise shaker system that allows manufacturers of vibration-sensitive tools to induce and mimic real-world, fab-like vibration conditions in their wafer-processing equipment before it is shipped to the customer. Actually recorded siesmic data, retrieved from customer sites, can be "played back" in the system to replicate exactly the vibration environment at the customer site in three degrees of freedom. The system has an operating frequency range of 0.1-100 Hz, representing the range with which wafer-processing toolmakers are concerned. In addition, STACIS provides both linear and precise duplication of a customer's environment as it employs a closed-loop active feedback system. Technical Manufacturing Corp., Peabody, MA; ph 800/542-9725, www.techmfg.com.
High-precision miniature guideways
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These miniature profile guideways are designed for use in such applications as semiconductor production, printed circuit board assembly, metrology, optics positioning, and analytical process equipment. The Minirail series is a family of robust, two-row miniature guideways made from corrosion-resistant, through-hardened stainless steel. An advanced ball-retainer design simplifies assembly and maintenance, reducing cost and increasing application versatility. Schneeberger Inc., Bedford, MA; ph 800/854-6333 or 781/271-0140, e-mail [email protected], www.schneeberger.com.
Contamination Control
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Cleanroom vertical carousel
Designed for Class 1 to 10,000 environments, the Cleanroom Vertical Carousel is a system of rotating shelves that deliver items quickly and directly to the user, providing safe and easy inventory access. It can be used in new facilities or retrofitted to existing facilities to increase storage capacity and ergonomic work flow. The system provides a cleanroom space for buffer storage and work-in-process applications. Whether in or adjacent to a cleanroom, or stationed independently for minienvironment applications, the carousel can reach reliability levels close to 100%. It can have multiple automatic doors for pass-through operation, and the ability to link multiple work areas with different cleanliness levels using one safe system. The carousel and load port provide 300mm wafer storage and retrieval of both FOSB and FOUP carriers. Remstar International Inc., Westbrook, ME; ph 800/639-5805, fax 207/854-1610, www.remstar.com.
Packaging/Assembly/Test
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Die attach adhesives
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Ablebond 2000 series electrically conductive die attach adhesives are designed for plastic ball grid array (PBGA) packaging and matrix-style BGA designs. The materials can withstand higher-temperature reflow for lead-less electronic assembly, with optimized adhesion, stress, and moisture absorption. Engineered with a low modulus, the adhesives are suitable for a wide range of die sizes, from 150 x 150 mil square to 1000 x 1000 mil square. Also, the 2000 series adhesives exhibit very low bleed on solder mask surfaces — a critical requirement for fine-pitch BGA applications — and offer very good dispensing characteristics and fast cure capability. Ablestik, Rancho Dominguez, CA; ph 310/764-4600, fax 310/764-2545, www.ablestik.com.
Die stacking system
The Dual Die stacking system stacks die on top of each other. Based on the DSH 5000 handler, the dual head and dual film frame input system stacks die 60 to 80 high to within 10mm accuracy and can handle various die sizes and wafer thicknesses. Die as thin as 125mm can be stacked into a fixture. The system also unstacks the die for an inspection operation before loading into a shipping media. Chipscale Robotics Inc., San Jose, CA; ph 510/490-4104, fax 510/490-5068, e-mail [email protected], www.chipscalerobotics.com.
Ball placement system
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The PowerPlace line is a completely automated ball attach process that includes the VAi 6300 ball placement system, reflow oven, cleaner, and material-handling equipment. The 6300 ball placement system processes semiconductor packages with a very low cost of ownership. It supports a wide variety of BGA formats, including single devices in boats or trays and strip devices in magazines, with the ability to process chip scale packages, plastic BGAs, ceramic BGAs, tape BGAs, and connector package types. RVSI Vanguard, Tucson, AZ; ph 520/297-2621, e-mail [email protected], www.vai.net.
Gold wire bonder
The AB339 Eagle gold wire bonder delivers 35µm pad pitch capability, as well as a throughput increase of 28% over the existing AB339 model. Other features include a high-speed linear XY table, a high-accuracy linear indexer, a lightweight high-speed bonder head, and an enhanced bond quality motor. ASM Pacific Technology Ltd., Hong Kong; ph 31/30-229-8540 or 408/451-0804, www.asm.com.
Automatic rework system
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The M-9100AV rework system automatically places and solders quad flat packages, ball grid arrays, and chip scale packages. It automatically calculates alignment, places the component, and solders it. Unlike split-visionsystems, M-9100AV requires minimal training and no calibration, and it does not rely on the operator's eyesight or ability to align components visually — the system's software does the work. This software also provides complete control over temperature, airflow, and duration during the solder process. Solder profiles are graphically displayed in real time for easy monitoring. A large area IR board heater prevents board warp. Manncorp, Huntingdon Valley, PA; ph 215/364-6100, e-mail [email protected], www.manncorp.net.
Combination flip chip/die bonder
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The CDB50-ST is a combination machine consisting of this company's "ST" technology. It can bond flip chips as well as die facing up in the same pass, achieving sub-mm placement accuracies (application dependent). The technology uses an optical bond head in conjunction with a proprietary bonding scheme. The tool can pick up die as small as 200mm from gel packs or waffle packs. For eutectic bonding applications, it can be equipped with an environmentally controlled reflow oven as an integral part of the machine for faster throughput. The CDB50-ST can be delivered as a fully automatic magazine-to-magazine system or with manual substrate or boat loading. RD Automation, Piscataway, NJ; ph 732/572-4800, fax 732/572-4808, www.rdautomation.com.
Metrology
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Ultrashallow junction measurement
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The BX-10 Source/Drain and Ultrashallow Junction metrology system measures the ultrashallow junctions that are critical to the performance of <0.18µm devices. It makes possible in-line measurement of annealed dopant layers on product wafers. The laser-based tool allows noncontact, nondestructive junction depth measurements that were previously possible only by slow or destructive methods. The rapid process feedback eliminates the time lag associated with traditional analytical lab or end-of-line electrical test methods. Proprietary Carrier Illumination technology determines the junction depth by inducing the formation of excess carriers in the implanted region, then measuring the change in reflectance from the activated junction. This method permits characterization of junction depth uniformity on a µm-scale or wafer-scale region. The system has 300mm extendibility. Boxer Cross Inc., Menlo Park, CA; ph 650/470-0330, fax 650/470-0335, e-mail [email protected], www.boxercross.com.
Thin film deposition monitoring/control
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The STM-1000 thin film deposition monitor has a highly visible graphic touch-panel display that presents direct or average data from up to six quartz crystal sensing heads. Film thickness is measured 10 times/sec and displayed to 1Å resolution, while deposition rate is measured to better than 0.1Å/sec. A companion in-vacuum oscillator provides extended crystal life for the most demanding requirements. The STC-2000 thin film deposition controller is a compact unit that controls up to three deposition sources from its multisensor inputs. It provides control for either sequential multilayer or simultaneous co-deposition applications. Sycon Instruments Inc., East Syracuse, NY; ph 315/463-5297, e-mail [email protected].
Film measurement and visualization
AcuMap II is a high-speed, whole wafer mapping system that maps dielectric films and is compatible with 100-200mm wafers. It employs an optical imaging system that provides high-density resolution of wafer thickness and allows process characterization of the entire wafer. This visualization is highly suitable for new equipment or process characterization, development, and optimization in such applications as CMP, etch, and CVD. AcuMap II methodology provides very good process monitoring and has been successfully integrated into an in-line process for the production of precision SOI wafers. ADE Corp., Westwood, MA; ph 781/467-3500, www.ade.com.
Chemicals/Chemical Handling
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Liquid flow sensor
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Intended for use in semiconductor liquid flow applications where high purity and particle-free operation is essential, Series 106 Flo-Sensors can measure extremely low flow rates from 15 ml/min to 50 l/min with ±1% accuracy. Response time is <1 sec. Model 106 has only Teflon and sapphire as wetted surfaces. The sensors can accurately measure DI water, as well as most highly corrosive liquids. McMillan Co., Georgetown, TX; ph 800/861-0231 or 512/863-0231, e-mail [email protected], www.mcmillancompany.com.
Failure Analysis
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Highly light-sensitive CCD cameras
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VersArray cooled CCD cameras provide the sensitivity needed to capture emissions from even the faintest defect imaged through the backside of an IC. They achieve new standards in low-light detection with a CCD that provides superior quantum efficiency and extremely low-noise readout. Combined with the option of either thermoelectric or cryogenic cooling, VersArray can detect emissions that were previously captured only by photon-counting detectors. VersArray also offers a very good signal-to-noise ratio and high resolution — >1.7 megapixels. Roper Scientific Inc., Tucson, AZ; ph 520/889-9933, fax 520/573-1944, e-mail [email protected], www.roperscientific.com.
Gases/Gas Handling
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PPB oxygen analyzer
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The GPR-16HP analyzer combines the proven design of its multirange trace oxygen platform with the newly developed, high-sensitivity Pico-Ion sensor, which can detect oxygen changes below 1 ppb. The sensor is maintenance-free and has a 90% FS response time of <20 sec; it recovers from exposure to high concentrations of oxygen in <10 min. An integrated bypass loop allows the sensor to be isolated for mobile cart applications, standby, maintenance, or storage. Linearity is provided over all four selectable ranges of analysis: 0-100 ppb, 0-1 ppm, 0-10 ppm, and 0-100 ppm. Expected sensor life is 18-24 months, power requirements are 100/110/220/240 VAC, and an integral temperature-control heater maintains system stability and an accuracy of ±2% FS. The analyzer is CSA/NRTL approved and CE certified. Advanced Instruments Inc., Pomona, CA; ph 909/392-6900, fax 909/392-3665, e-mail [email protected], www.aii2.com.
Precision gas flow restrictors
These gas flow restrictors can simplify gas delivery systems. A knife-edge orifice inside a leak-tight, stainless steel enclosure results in a very precise and repeatable flow from any fixed pressure source. Applications include splitting the flow of a mass flow controller (MFC) into two or more outlets with flow rates having precise ratios. The restrictors can also be used to replace needle valves with a tamper-proof flow controller or to create a hard-wired MFC equivalent using pressure-based flow control. VCR-compatible and surface mount models are available. Universal Microsystems, Santa Clara, CA; ph 408/727-3902, fax 408/727-4452, www.temfilter.com.
Vacuum Equipment
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Turbo pumps for analytical instruments
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The Navigator turbo pump family offers an advanced solution for mass spectrometry applications. The on-board controller plugs directly into the main line, resulting in a highly compact and cost-effective package, as well as simplified system integration and servicing. Dual-flow technology offers the performance of two turbo pumps in a single compact design — including the Navigator on-board controller. The monolithic rotor design offers very good vacuum performance with proven reliability for LC/MS and ICP/MS applications. An optional vacuum gauge can be integrated into the system. The 150 DryVar is an integrated turbo pump specifically designed for building portable and compact mass spectrometers. It can discharge at atmospheric pressure and can reach a base pressure in the 10-8 mbar range, without an additional roughing or backing pump. Varian Inc., Lexington, MA; ph 925/942-4889, e-mail [email protected], www.varianinc.com.
Vacuum measurement/control
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The MC 300 can measure vacuum ranges from atmosphere to 10-10 torr. Sensors include thermocouple, cold cathode, and convection for a wide range of applications. The series also features a large LED display; built-in self diagnostics; selectable units in torr, microns, mBar, or Pascal; gas compensation, argon N2; four process relays with individually assignable set points; recorder outputs for each sensor; an operator lockout switch; and an optional digital communication interface. Televac, Huntingdon Valley, PA; ph 215/938-4444, fax 215/947-7464, e-mail [email protected], www.televac.com.
Materials
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Photodefinable polyimide
Meeting or exceeding the lithographic requirements of all contemporary semiconductor target applications, HD-8000 photodefinable polyimide is a positive tone system engineered to be imaged with i-line phototools and developed on standard positive resist developer tracks using common TMAH developers. It has a fully aromatic polyimide backbone structure with corresponding high-performance thermal and mechanical properties. Inherent resistance to dry etch processing chemicals makes HD-8000 ideal for single mask, stress buffer passivation on DRAMs, SRAMs, logic devices, and microprocessors. HD MicroSystems, Wilmington, DE; ph 302/892-0548, fax 302/892-0597, e-mail [email protected], www.hdmicrosystems.com.
Lithography
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ArF 193nm excimer laser
The G40A is an advanced 193nm, 4kHz, ArF excimer laser that provides an ultrahigh repetition rate (4000 pulses/sec) and ultranarrow bandwidth, and an original gas mixture to ensure low energy fluctuation. A 193nm coherent light source allows highly accurate measurement and inspection. The density of the laser has been lowered while the pulse width has been widened (or stretched) to maintain the energy of each pulse — a technology known as "pulse stretching." The new mixed gas, with Xe added, doubles the energy stability and more than doubles gas life, from 20 million to 50 million pulses. Komatsu Ltd., Santa Clara, CA; ph 408/855-8387.
Bare reticle stocker
The Guardian BRS (bare reticle stocker) is a fully automated reticle storage system that has the highest available storage density per footprint. Its design provides maximum bare reticle isolation, protection, and system security. Various system sizes, reticle capacities, and reticle carrier I/O modules are available to meet individual fab requirements. PRI Automation, Billerica, MA; ph 978/670-4270 ext 3378, www.pria.com.
Laser thermal annealing system
The LA-100, an innovative combination of projection optics and laser thermal annealing in a single tool, is designed to break through process barriers associated with advanced contact and junction formation at design rules of <0.13µm. The laser process allows for ultrashallow junctions with above-solid solubility activation, hyper-abrupt junctions that exceed those of a 0.5 KeV implant, 5x reduction in contact resistance and a reduction in poly gate resistance through differential silicide thicknesses in the source/drain and gate, and limited out-diffusion in the halo implant, allowing for precise channel engineering. Ultratech Stepper Inc., San Jose, CA; ph 408/321-8835, fax 408/577-3379, e-mail [email protected].
Software
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Wafer visualization software
Device Toolbox is an "off-line" software application that helps engineers visualize and quantify changes in wafer shape, thickness, and flatness. Using both measured and differential (before-after) data, it allows users to develop, diagnose, and maintain thermal, photolithography, backgrind, and backside etch processes; it runs independently of ADE tools. The thickness and shape data created by any ADE, ASC or ASC-2000 measurement system is transformed into one-, two-, or three-dimensional maps of "as-measured" or differential information for one wafer or an entire lot. ADE Corp., Westwood, MA; ph 617/831-8089, e-mail [email protected], www.ade.com.
Automated test tool
The GPT300 is an automated test tool for verification of parallel communication as outlined in Semi E84. The specified parallel communications are used in 300mm fabs for carrier (FOUP) handoff between automated material-handling systems (AMHS) and production equipment. The GPT300 provides standard E84 signals, cabling, a Hokuyo optical data transmission device, and proprietary test software. It can simulate either equipment or AMHS and allows for verification of either normal operation or error recovery. GW Associates Inc., Sunnyvale, CA; ph 408/745-1844 ext 103, e-mail [email protected], www.gwainc.com.