Literature
04/01/2000
Chemicals and services brochure
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This eight-page brochure contains information on chemicals and services for wafer fabrication processes. Highlighted are cleaning chemistries like the BAKER REZI series, an aqueous post-ash residue remover; BakerClean JTB FEOL cleaner; and BakerClean pCMP cleaners for post-CMP particle removal. Also described are a reusable container system that eliminates triple rinsing by handling, dispensing, and delivering large volumes of chemicals in reusable containers; a stripper recovery program that allows recycling and the elimination of disposal and regulatory compliance costs; and an applications support system that helps customers with technical problems and cleaning chemistry choice. J.T. Baker, a division of Mallinckrodt Baker Inc., Phillipsburg, NJ; ph 800/582-2537, 908/859-2151 ext. 9204, www.jtbaker.com.
Thermal system components brochure
Pump and gas line heating systems that are suitable for CVD and metal etch processes, where they reduce condensation and particle buildup, are featured in this brochure. Characteristics of the systems include even heating up to 200°C for uniform temperature profiles over the entire heated line; electronic equipment and software that accommodate changing process requirements; cleanroom-compatible silicone rubber construction; system components that meet a combination of UL, CE, NEC, and Semi S2-93 safety specs; environmental safety; and optional 94-VO flame retardant materials. The brochure outlines individual components of the system and gives specs for each, including modular pump line heaters, modular gas line heaters, integrated control systems, and Watview and Anawin software. It also offers tips on line measurement for component selection and temperature control zone grouping, as well as charts on vapor pressure, particle generation defects, and vapor phase. Watlow Electric Manufacturing Co., St. Louis, MO; ph 800/492-8569, 314/878-4600, fax 877/893-1005, e-mail [email protected], www.watlow.com.
Wafer-level backside inspection note
This 10-page application note details backside inspection of wafers using an emission microscope. Both steps of the process are described: bulk silicon removal from the backside of the wafer over the area of the target chip and front-side probing with ultra-low-force probe needles during emission imaging from the backside. Topics discussed include the thinning process; ultra-low-force probe cards; wafer deflection and bending stress; wafer reinforcement; and wafer skins process. Hypervision Inc., Fremont, CA; ph 510/651-7768, fax 510/651-1415, www.hypervisioninc.com.