Product News
04/01/2000
300mm single-wafer handling
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FOUP (Front Opening Unified Pod) for ONE 300 is a solution for handling 300mm single test wafers. It is a production-integrated, single-wafer carrier for the conditioning and management of monitor wafers and mini-batches in 300mm fabs, addressing storage, handling, and transportation with 100% compatibility with batch production. This compatibility is made possible by a front-opening container and a new single-wafer interface, allowing equipment designed to receive FOUPs also to handle single-wafer pods. Individual micro-environmental boxes prevent cross and backside contamination, improve storage density, and prevent contamination from extensive wafer sorting. FOUP for ONE is made from noncontaminating polycarbonate-based material that dissipates electrostatic charge. It incorporates a front-side RF tag to facilitate single-wafer tracking. The unit has transparent backside flanges for easy visual inspection, and top and bottom kinematic couplings to allow up to seven pods to be stacked. An inert gas purge option guarantees an airborne molecular contamination-free environment. INCAM Solutions, Grenoble, France; ph 33/476-8893-65, fax 33/476-8851-39, e-mail [email protected].
Step-and-repeat exposure system
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The NSR-SF100 i-line stepper achieves linewidths of <0.4µm over an exposure field of 25 x 33mm. It is field-size compatible with this company's wide-field scanners while offering superior cost performance for the mix-and-match combination. Throughput is 120 wafers/hour (200mm) and ~80 wafers/hour (300mm). The tool is convertible in the field from 200 to 300mm production, and it can be used for noncritical layers in production, even for devices featuring layers with linewidths of 0.13µm. Lens reduction ratio is 1:4, matching this company's high-end KrF excimer laser scanners, as well as the NSR-S103A i-line scanner. Nikon Corp., Langen, Germany; ph 49/6103-973-522, e-mail [email protected], www.npeurope.com.
Single-wafer spin processor
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Spin Processor MP-2000 is a single-wafer system developed for <0.13µm cleaning/etching technologies. A new cup design allows very high process flexibility running complex sequences in only one chamber for cleaning, etching with in situ cleaning possibilities, different types of rinsing, and advanced drying technologies. Up to four process chambers can be run in parallel with such processes as standard RCA, advanced DIW-O3 and diluted cleans, all kinds of HF/BHF, and backside etching, including bevel etch. Special drying technology permits watermark-free processes, even without the use of chemicals (IPA). A 200mm version of the tool is currently available, and a 300mm version will be available in 4Q2000. Dainippon Screen/Macrotron Systems, Munich, Germany; ph 49/89-45111-113, fax 49/89-45111-105, e-mail [email protected].
CVD system for flat panel displays
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The AKT 5500 CVD system deposits semiconducting and insulating films used in creating the transistors that control the pixels of thin film transistor active matrix liquid crystal displays. With a substrate size capability of ~700 x 900mm, the AKT 5500 can process approximately 50% more 15-in. FPDs and 100% more 17-21-in. FPDs than the previous generation of CVD systems. The tool's central platform has been expanded to accommodate five process chambers. Substrate temperature uniformity has been optimized through new heating modules in the pre-heat and process chambers, and a modified chamber design further improves deposition uniformity. Other improvements include a second-generation remote plasma clean technology for periodic process chamber cleaning, to improve deposition repeatability and increase hardware lifetime and reliability. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647 or 408/748-5227, www.appliedmaterials.com.
PROCESS EQUIPMENT
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RTP tool
The AST3000 rapid thermal processing system is an advanced 200/300mm tool designed for 0.18-0.10µm applications. It is capable of spike anneals with ramp rates over 300°C/sec. With a proprietary wafer rotation design, the 3000 delivers temperature uniformity better than ±2°C. Steag Electronic Systems Inc., Tempe, AZ; ph 480/777-0021, fax 480/777-0025, [email protected].
UHV sputtering sources
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Torus UHV sputtering sources are highly suitable for applications that require ultrapure thin films. They are "true UHV" devices, compatible with vacuum systems that are designed to reach base pressures below 10-10 Torr. They have no O-rings, and the magnet assembly is removable without breaking vacuum to allow for 350°C chamber bakeout. The sources are equipped with rare earth magnet arrays that can be adjusted in situ, allowing the user to sputter both magnetic and nonmagnetic target materials by optimizing the magnetic field over the target's surface. Optional features include gas distribution rings and sputtering chimneys. Kurt J. Lesker Co., Clairton, PA; ph 800/245-1656 or 412/233-4200, fax 412/233-4275, e-mail sales@ lesker.com, www.lesker.com.
Liquid precursor delivery and evaporation
The TriJet liquid precursor delivery and evaporation system is modularly integrated into the Tricent MOCVD system for the deposition of multicomponent ferroelectric materials (e.g., SBT, PZT) and high-k materials for capacitor and gate dielectrics (e.g., BST, ZrO2, HfO2). Its repeatable performance is primarily based on a contactless evaporation of the precursor materials, completely avoiding residual material on a hot (evaporating) surface. Aixtron AG, Aachen, Germany; ph 49/241-8909-474, fax 49/241-8909-40, e-mail [email protected], www.aixtron.com.
PACKAGING/ASSEMBLY/TEST
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Advanced assembly platform
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The GSMxs platform is intended for advanced assembly applications, such as fine-pitch flip chip. It has a clean-running linear motor that helps to deliver speed, accuracy, and repeatability in a footprint <2 sq m, approximately half as large as its predecessor platform, the GSMx. The GSMxs generates <600 particles/cu m (>0.5µm), so it is Class 1000 cleanroom compatible. The compact design has a four-spindle head, Vision-on-the-Fly, and the new MegaView camera. It also has the field-proven, dual-drive Y-axis, 1µm linear encoders, and Variable Reluctance Motor technology that minimizes thermal shift for very high stability. The new platform is highly suitable for assembling packages such as FCIP, CBGA, PBGA, and CCGA, as well as hybrid, microwave, and standard surface mount applications. Universal Instruments, Endicott, NY; ph 607/786-8104 or 800/432-2607, fax 607/754-7517, e-mail [email protected].
GASES/GAS HANDLING
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Pure digital MFC
IntelliFlow T DFC is a pure digital mass flow controller, for etch and low-flow CVD applications, which features fast, uniform settling times on all gases, reducing process sequence time and improving system throughput. It has the industry's first dual-range capability, which eliminates the need for multiple gas lines to accommodate high and low flows of the same gas, increasing gas panel flexibility. Embedded Diagnostics software allows the user to check MFC functionality without removing the IntelliFlow T DFC from the process tool. Millipore Microelectronics Gas Process Div., Allen, TX; e-mail [email protected], www.millipore.com.
Multipoint insertion mass flow elements
The CE-compliant K-Bar 2000 incorporates the latest thermal convection mass flow technology, including a fast and powerful microprocessor and sensor bridge circuit that measures both the gas velocity and temperature using only the two sensor elements on the "FD" Fast Dual MetalClad sensor. Kurz Instruments Inc., Monterey, CA; ph 800/424-7356 or 831/646-5911, fax 831/646-8901, e-mail [email protected], www.kurz-instruments.com.
Digital mass flow controller
The AFC 90MD digital mass flow controller combines advanced µP control software and thin film deposition zero-drift solid-state sensors that offer a considerable reduction in response time by comparison with standard MFCs. This allows shorter cycles in single-wafer processing. Platinum thin layer deposition replaces wound wires for a significant improvement in response time and performance. Qualiflow, Montpellier, France; ph 33/467-9947-42, fax 33/467-9947-48, e-mail [email protected], www.qualiflow.com.
Gas purifier
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The DYAD Dual Bed Autoregen Purification System is designed for high flow rates and high percentage contaminant loads (100 ppm), while providing continuous service. It removes non-methane hydrocarbons and water to <100 ppb and is a low-cost method of purifying CO2, clean dry air, and inert gases for semiconductor and disk drive applications. These applications include air bearings and optics for lithography, and snow cleaning for wafer and disk drive cleaning. The purification medium is a combination of highly porous molecular sieves that trap hydrocarbon molecules present in the gas stream. A dual-bed system is used to maintain continuous flow. DYAD does not require power or heat and has no moving parts during purification. It is constructed of 316L stainless steel and accommodates flow rates up to 600 slm (1200 cfh) at pressure up to 300 psig. Aeronex Inc., San Diego, CA; ph 800/511-9761 or 858/452-0124, e-mail [email protected], www.aeronex.com.
Surface mount gas-system components
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These surface mount valves, regulators, and transducers result in a very clean, compact device for semiconductor manufacturing applications. Surface mount technology provides benefits to the designer of gas systems by allowing a compact, flexible, modular design to replace or augment current conventional face seal designs. The new technology (for both 200mm and 300mm fabs) reduces or eliminates welds and fittings, reducing overall real estate by as much as 50% compared to face seal connection designs. It may also eliminate HAZ concerns for system integrity. The SM 930 valve; SM SQ Micro point-of-use regulator; SM 955 high-purity, high-flow manifold valve; SM 917 compact, low internal volume diaphragm valve; and SM Exact series transducer all meet PR3 specification for Semi surface mount modular designs. Several seal styles have been incorporated into the surface mount format, including "C" and "W" seals. All these components use the proprietary VeriClean alloy. Parker Hannifin Corp./Veriflo Div., Richmond, CA; ph 510/412-1150, fax 510/232-7396, www.veriflo.com.
Wall-mounted CO2 analyzer
The CEA 266 is a wall-mounted infrared gas analyzer contained in a water- and dust-tight NEMA 4X enclosure with digital display readout. Ranges of 0-2000 ppm, 0-5000 ppm, 0-1%, 0-2%, 0-5%, 0-10%, or 0-20% are available. The sample gas is continuously drawn into the unit through a built-in air pump. A self-draining water trap and dust filter are also provided. The unit includes 0-5 VDC and 4-20 mA outputs and two user-adjustable alarms and contact relays. CEA Instruments Inc., Emerson, NJ; ph 201/967-5660, fax 201/967-8450, e-mail [email protected].
CHEMICALS/CHEMICAL HANDLING
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Pressure relief valves
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These pressure relief valves protect equipment and systems against overpressures or sudden pressure surges. Available in PVC, PP, PVDF, and PTFE, they can handle highly corrosive or ultrapure liquids. They are available in sizes from 0.5-4 in. and can be set to relieve pressure from 5-100 psi. When system pressure exceeds the set pressure of the valve, the force of the excess pressure causes the valve to open and relieve the pressure. When system pressure returns to normal, the valve closes and automatically resets itself. Several steel springs are supplied so that users can select the spring that will provide the desired set pressure. The Pressure Relief series offers a redundant U-Cup seal to protect the spring chamber. Their in-line design and reparability make the valves easy to maintain; they offer fewer flow restrictions and provide very good flow capacity. All metal parts are made from stainless steel. Asahi America Inc., 781/321-5409, fax 800/426-7058, e-mail [email protected], www.asahi-america.com.
Advanced polymer remover
PRx-417 is a noncorrosive polymer remover that is formulated for sub-0.5µm IC processes incorporating damascene etch technology with low-k films and 100% copper interconnect. Complete polymer removal with no copper staining, corrosion, or CD loss enables process engineers to improve die yield. To bridge the gap between the current aluminum and copper clean processes, PRx-417 is designed to resolve existing process problems with high-density aluminum and via etch, while achieving the requirements of next-generation products with copper and 0.18µm design rules incorporating damascene trench-via techniques. Silicon Valley Chemlabs Inc., Sunnyvale, CA; ph 408/732-4700, fax 408/732-0733, e-mail [email protected].
FAILURE ANALYSIS
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Backside silicon thinning
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Chip UnZip 2.0 is an upgrade of the field-proven milling system, which removes backside silicon, without damage, to as little as 80µm of remaining silicon in order to permit imaging of chip-level defects in advanced devices. All milling functions are based on Windows 98. Intuitive icons simplify setup of the automated milling process. A built-in laser zeros the milling table for faster setup and greater dimensional accuracy. Computer-directed probes provide feedback that guides the milling operation. BGAs, TBGAs, flip chips, LOCs, and devices with Au- or Al-coated die faces can be imaged for defect localization. Hypervision Inc., Fremont, CA; ph 510/651-7768, fax 510/651-1415, e-mail [email protected], www.hypervisioninc.com.
LITHOGRAPHY
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KrF excimer laser
With a highly line-narrowed bandwidth of 0.5 pm at FWHM and 1.4 pm at 95% energy, the ELS-6010 KrF excimer laser allows full imaging performance from steppers or scanners using lenses with NA >0.75. At 20W maximum average output power, it supports the highest-throughput lithography systems. Operating at high-frequency pulse repetition rate meansthat more pulses can be delivered in a single exposure, improving the dose stability at the wafer for improved CD control and higher yield. The ELS-6010 also incorporates advances in the high-voltage power supply, the laser discharge chamber, and the wavelength stabilization module; a faster charge time in the power supply improves laser communication with the scanner. Cymer Inc., San Diego, CA; ph 858/385-7139, fax 858/385-6035, e-mail [email protected].