Product News
03/01/2000
SEM with 3-D imaging
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The VeraSEM 3D metrology scanning electron microscope (SEM) is an in-line, production-worthy critical dimension (CD) SEM system that provides three-dimensional imaging technology. In addition to measuring CDs, it 3-D images the sidewall profile of device features down to 100nm with up to 10x greater resolution of the slope than conventional SEMs. Achieving in seconds what can take hours by off-line analysis, the VeraSEM lets chipmakers realize higher yields and reduce costs through the early detection of process excursions. Unlike other profile viewing techniques that require off-line destructive testing (such as cross-section SEMs), the tool allows rapid monitoring of wafers between process steps and automatically alerts operators to marginal or out-of-spec conditions. The VeraSEM 3-D is also expected to be advantageous for copper applications, where maintaining slope shape is critical for preventing voids in dual damascene structures. Features include full, operator-free automation, a shared database, offline programming, and online data analysis. The system's design accepts both 200mm and 300mm wafers with minimal changes. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647, www.appliedmaterials.com.
Coat/develop cluster system
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The Pro-Cell CD-200 (for 200mm processing) and the CD-200/300 (a 200mm/300mm bridge tool) are coat/develop cluster systems that feature a hexagonal, close-packed platform design and patented synchronous scheduling. More than 40 wafers can be processed simultaneously, with varying position time requirements and sequencing. The Advanced Guidance System optimizes wafer movement by calculating the optimal wafer path before movement is initiated, so that wafers are transferred at the exact moment necessary for consistent process results. The hexagonal cell/three-axis structure and bidirectional thermal modules make possible the simple robotics design. Silicon Valley Group, San Jose, CA; ph 408/944-8751, fax 408/434-0216, e-mail [email protected].
Surface topography measurement
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Surface NanoTopograpy (SNT) is a new capability for the Surfscan SP1 unpatterned wafer inspection platform. It allows the SP1 to provide quantitative measurements of topography variations with nanometer sensitivity over millimeter ranges. Chipmakers can thus obtain vital data on wafer surface quality and improve process monitoring — both important for the development of ˆ0.13µm devices and the production of 0.18µm devices. Surface topography variations can create film thickness nonuniformity following CMP processes, as well as making endpoint detection more difficult. Film nonuniformity can lead to resistivity variations, resulting in reduced device performance or complete device failure. A new wafer-handling system, Edge Handling, is a key aspect of SNT, leaving the wafer backside untouched during the inspection process. Previously, vacuum chucks were used to hold wafers on the backside during inspection, distorting wafer shape and increasing the likelihood of backside contamination. KLA-Tencor Corp., San Jose, CA; ph 408/875-7039, e-mail [email protected], www.kla-tencor.com.
Spray etch processor
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Evergreen Model 202 is a spray etch processor that can process 50-100 wafers/hr (200mm) in 13 sq ft of cleanroom space (54 x 35 in. footprint). It employs dual robotics for uninterrupted operation, achieving dry in/dry out single-wafer etch processing with optimum precision and uniformity. Digital control throughout the tool ensures precision in chemical flow rate, pressure, and temperature, as well as nozzle height, motion profile, and dispense time. The process chamber is completely sealed, with an automatic door for loading and unloading, and a clear window for process viewing. The plumbing system is constructed from highest-grade commercial components, including PFA pneumatic valves, molded pressurized canisters, and Teflon protected transducers. Venturi vacuum pumps handle fluids without moving parts, for high reliability and low particle count. Solid State Equipment Corp., Horsham, PA; ph 215/328-0700, fax 215/328-9410.
Chemicals/Chemical Handling
High-purity semiconductor fluid
Novec HFE-7100DL electronics grade fluid reduces impurities — whether organic, water, nonvolatile residue, or ionic — in parts cleaning baths, wet bench wafer cleaning, and wafer drying operations. The fluid is practically nontoxic and nonflammable, has zero ozone-depletion potential, and has low global-warming potential. It has been approved by the EPA, which has excluded it from the definition of a volatile organic compound because of its negligible impact on tropospheric ozone formation. 3M Specialty Materials, St. Paul, MN; ph 800/833-5045, www.mmm.com.
Two-way high-pressure valve
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Integra is a half-inch, two-way, high-pressure valve that is safe and reliable at forward and back pressures to 120 psig. Features include: an all-PFA valve body and high-purity fluoropolymer wetted components that provide a noncontaminating fluid stream and chemically compatible construction; a secondary containment diaphragm that isolates the coated springs from the secondary containment and external media; a compact design for a small footprint; and the absence of metals or elastomers in the secondary containment chamber for reduced contamination in the event of a media leak or exposure to a harsh external environment. Entegris Inc., Chaska, MN; ph 612/448-8193, fax 612/556-4078, e-mail [email protected].
Process Equipment
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Electroplating solution for 300mm
The LT308 electrochemical deposition system is a high-volume 300mm electroplating tool that builds upon the production-proven design and performance of the LT210c, which has a throughput >70 wafers/hr, <4% nonuniformity on 0.8µm film, and void-free fill of features consistent with ˆ0.13µm technology. LT308 has similar specifications, in a footprint of 3.62 m2. Semitool Inc., Kalispell, MT; ph 406/752-2107, fax 406/752-5522, www.semitool.com.
Lithography
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Automated mask transfer
The MTS system enables photomasks to be transferred from one cassette to another without manual handling, reducing breakages and eliminating contamination. It complements the API-3000 and the QCO-4000 photomask inspection systems. The system features the twin CLS (cassette loading station), which allows cassettes to be transferred from one stepper to another, even those of different manufacturers. QC Optics, Wilmington, MA; ph 978/657-7007, fax 978/657-6077.
Contamination Control
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Wet point-of-use system
Mystaire MTS scrubbers are designed for the removal of highly corrosive, reactive, toxic, and pyrophoric gases from semiconductor tool exhaust streams. Typical applications include vacuum pump exhaust from CVD, etch, and wet bench. The scrubber's multichamber design and six scrubbing stages ensure removal efficiencies typically >99.9%. Gases treated include BCl3, SiF4, WF6 TEOS, SiCl2, BF3, HCl, and HF. Systems are available in standard and custom versions. Misonix Inc., Farmingdale, NY; ph 800/645-9846 or 631/694-9555, fax 631/694-9412, e-mail [email protected], www.misonix.com.
CMP slurry filters
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Absolute-rated ALpHA filters offer optimized filtration of bulk, recirculating loop, and point-of-use CMP slurries. The pleated filters are constructed from a self-bonded, 100% polypropylene monofilament that will not unload captured contaminants or shed fibrous material. The filters' gradient density media provide high flow rates, high dirt-holding capacity, and absolute retention of yield-reducing particles. ALpHA filters are available in mini-cartridges, cartridges, and capsule configurations, with ratings of 0.45-40µm. Meissner Filtration Products Inc., Camarillo, CA; ph 800/391-9458, fax 805/388-5948, www.meissner.com
Packaging/Assembly/Test
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Custom dispensing needles
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EasyRelease custom dispensing needles, which are available in 11-30 gauge in 0.25-0.35 in. lengths, give precise, repeatable application of encapsulation and underfill material. Each needle is precision-machined from solid stainless steel; the internal profile enhances material flow and consistency. Encapsulation needles feature the standard conically chamfered tip that ensures complete transfer of material from the needle to the substrate or package. Underfill needles feature a "relieved" tip that allows the needle to be adjacent to the chip for better wicking action. DL Technology LLC, Haverhill, MA; ph 978/374-6451, fax 978/372-4889, e-mail [email protected], www.dltechnology.com.
Hot aqueous soluble bonding adhesives
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Solvents are no longer needed to debond and clean parts when these new thermoplastic bonding films and blocking agents are used. The adhesives are completely dissolved by hot gaseous chemistries such as this company's environmentally safe cleaning agents. The bonding films and blocking agents offer high adhesion and structural stability to a range of substrates, for easy performance of cutting, grinding, or polishing processes. The films, ULTRA MEC TFA, which is produced in a neat film, and TFG, which contains a structural reinforcement, are produced in thicknesses of 4 and 8 mils, respectively. The blocking agents, ULTRA MEC T50 and T85, are offered in bulk form and provide structural characterisitics similar to those seen in the films. Each product is made with an ultraviolet dye, for easy identification during material processing and clean-up. The films and blocking agents are stable at room temperature in both aqueous and solvent-based slurries, allowing normal machining processes to be carried out without incident. Moore Enviro-Chemical Inc., Camarillo, CA; ph 805/383-2474, fax 805/383-2476, e-mail [email protected], www.mec-chemicals.com.
Die sorting and bonding optimization
Gel-Frames are designed to meet the semiconductor industry's need to optimize die sorting and bonding equipment. They can accommodate traditional bare die handling, along with newer wafer-level packaging for die bonding operations. Gel-Frames use proprietary GEL elastomer. The gel is laminated onto a membrane that can then be assembled to any standard dicing frame, including those for 300mm wafers. The result is a Gel-Frame that can store a large custom array of die and is compatible with any assembly equipment. The frame can be configured to release the die by standard pin ejection with reduced force or by using this company's patented vacuum release technology. This carrier creates an ideal situation for handling multibin parts. Devices can be binned by automated die sorters and placed onto the frames to create 100% KGD (known good die) wafers of each bin type. The frames can then be shipped directly to the assembly operations or stored for later assembly. The frames loaded with repopulated KGD wafers enable automated die bonding equipment to pick 100% of the die, increasing the bonder throughput by avoiding the need to step over bad die or die of a speed sort that is not needed for that bonding operation. Gel-Pak, Sunnyvale, CA; ph 408/733-1313, fax 408/730-1947, www.gelpak.com.
Gases/Gas Handling
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Full-flow compact regulator
Designed for the semiconductor industry and offering the smallest full-flow design available, HF series regulators are suitable for use in valve manifold boxes, gas interface boxes, and tools — or any application where space is at a premium. The regulator's pressure-sensing assembly controls gas delivery pressure. The assembly is charged with argon to set pressure at precisely the desired level. The multiple, welded-diaphragm design of the HF regulator offers several advantages: multiple diaphragms are more flexible than a single diaphragm and permit higher system flow rates at lower pressures, and set-pressure models are factory-charged to pre-selected input and output delivery pressures. Swagelok, Cleveland, OH; ph 440/349-5934, fax 440/349-5806, e-mail [email protected], www. swagelok.com.
Quadrupole mass spectrometers
Orion Compact quadrupole mass spectrometers for process monitoring and digital Mass-Flo controllers for DeviceNet and Profibus protocols help to save cost and space, while simplifying hookup. The Orion Compact, for monitoring PVD, CVD, and etch tools, is operated by an on-board electronics controller linked to a Windows NT-based host computer. This computer can run up to six Orion modules simultaneously by using Orion process monitoring software. The Orion Compact is available in both open (RGA) and closed ion source (CIS) options. The CIS module has an integrated turbomolecular pumping system that is also controlled by the on-board electronics system, simplifying hookup and reducing installation space. MKS Instruments, Andover, MA; ph 800/227-8766, fax 978/975-0093, www.mksinst.com.
Hardware/Accessories
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Linear motor system
The Micro Plus LX linear motor positioning stage is a compact, low-cost linear motion solution for applications requiring very high speeds and long travels. It provides the high speeds of belt drives and higher precision than ball screw drives. Designed with an iron based, brushless linear motor, the LX provides acceleration up to 4g, with velocities to 3 m/sec. Recirculating linear guides give very good load-carrying capabilities in a compact aluminum package. An integral, precision, noncontact linear encoder provides position feedback with high repeatability. LX stages are available in single or multi-axis configurations. With travels up to 1 m, the stages are well suited to several applications, including wafer handling. Bayside Motion Group, Port Washington, NY; ph 516/484-5353, fax 516/484-5496, www.baysidemotion.com.
Software
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Automated test tool
The GPT300 is an automated test tool for verification of parallel communication as outlined in Semi E84. The specified parallel communications are used in 300mm fabs for carrier (FOUP) handoff between automated material-handling systems (AMHS) and production equipment. The GPT300 provides standard E84 signals, cabling, a Hokuyo optical data transmission device, and proprietary test software. It can simulate either equipment or AMHS and allows for verification of either normal operation or error recovery. GW Associates Inc., Sunnyvale, CA; ph 408/745-1844 ext 103, e-mail [email protected], www.gwainc.com.