New Literature
02/01/2000
Sensor and sealing assembly brochure
This four-page, four-color brochure focuses on a line of sensors and sealing devices for materials processing, IC testing, IC handling/hardware manufacturing, and wafer manufacturing. Products featured include thermocouples used to monitor surface temperature during the manufacture of flat panel glass; thermocouples and sense line feedthroughs for screening moisture levels within packaged ICs; fiber optic cable sealing used to seal against pressure or vacuum environments for optical sensors and position devices; and platinum thermocouples with quartz sheaths for rapid thermal processing reactors. Other products highlighted are fiber optic feedthrough assemblies capable of sealing vacuum to 2000psi at -40-85°C; optical temperature sensors designed for wafer fabrication processing up to 1350&3176;C; and one-piece virgin Teflon sensor housings with integral PC-programmable transmitters for deionized water systems. Conax Buffalo Technologies LLC, Buffalo, NY; ph 800/223-2389, fax 716/684-7433, e-mail [email protected], www.conaxbuffalo.com.
Ultrahigh vacuum valve brochure
An HPS UHV valve for ultrahigh vacuum systems is featured in this four-page, color brochure. The valve is available in angle and offset inline configurations for sizes NW 25 and 40, and can be ordered with manual or pneumatic actuation, optional solenoids, limit switches, flanges, and finishes. Welded bellows within the valve allow a longer stroke and cycle life; the metal bonnet seal limits outgassing and permeation, allowing a lower base system pressure. Also included in the brochure is information on the valve's dimensions, specs, applications, and pricing. MKS Instruments Inc., The Vacuum Products Group, Boulder, CO; ph 800/345-1967 or 303/449-9861; fax 303/442-6880.
Packaging brochure and selector guide
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Semiconductor Packaging Materials, a new four-page, color brochure, describes an array of packaging products such as electrically and thermally conductive paste, and film and tape adhesives. Included in the brochure is a selector guide, which categorizes the products by application: alloy leadframe; copper leadframe of different die sizes; thermally enhanced or plastic ball grid array; ball grid array on flex substrates; microprocessor packaging; package assembly materials; and memory packaging. The guide also outlines product-specific composition, viscosity, thixotropic index, thermal conductivity, modulus of elasticity, cure type and condition, moisture resistance, and bondline control. Ablestik Information Center, Ontario, CA; ph 310/ 764-4600, fax 310/764-2545, e-mail jilla.senkbeil@ nstarch.com.
Lab and process control web site
A line of liquid, air, and gas-handling equipment, and temperature, flow, and lab apparatus is featured on this newly expanded web site. Customers have complete access to the company's catalog, as well as downloadable software to assist in the selection of the right product to meet a specific requirement. The site also provides application assistance forms; setup and service manuals; special promotional information; an events calendar; a list of employment opportunities; and other news. Barnant Co., Barrington, IL; ph 800/637-3739, fax 847/381-7053, e-mail [email protected], www.barnant.com.
Water management brochure
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This color brochure entitled Total Water Management for the Worldwide Microelectronics Industry highlights a company's water management capabilities from point-of-use purification, distribution, reclaim
ecycle, and wastewater treatment to ongoing service and plant operations. Treatment technologies for reclamation applications include CMP effluents, low TDS/TOC rinses, backside grind/effluent, HF rinses, copper-plating rinses, and ultrapure water system effluents. Ultrapure water technology includes chemical-free systems, pretreatment, make-up, polishing, reverse osmosis, continuous electrodeionization, degasifcation, deionization, advanced oxidation, ultrafiltration, and microfiltration. Wastewater treatments include pH neutralization; fluoride, arsenic, suspended solids, and copper removal; ammonia, TOC/BOD/LOD, and phosphate reduction; and CMP effluent treatment. Also featured in the brochure are case histories illustrating solutions to a variety of customer needs. USFilter Corp., Lowell, MA; ph 800/875-7873, ext. 7352, ask for literature number US5500, www.usfilter.com.
Ductless fume enclosure catalog
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Highlighted in this eight-page, color catalog is the AURA line of ductless fume enclosures, which are designed to provide operator safety protection. The catalog details differing filter technologies and identifies typical applications for each filter type. Large graphics show the monitoring system and controls, which feature a digital display of the face velocity. Safety elements described include visual and audible alarms to alert operators when filters are approaching saturation. Specs for the various models are illustrated in a user-friendly chart; another section details the Filtrak Positive Sealing System, which seals the filter in place without jeopardizing the integrity of the filter assembly. Misonix Inc., Farmingdale, NY; ph 800/645-9846 or 516/694-9555, e-mail [email protected], www.misonix.com.