New Products
12/01/2001
Yield-acceleration technology
µLoop (MicroLoop) is a yield-acceleration technology designed to help chipmakers speed time-to-market on next-generation chips. Representing the first available in-line, noncontact electrical defect monitoring solution, µLoop technology reduces the length of each electrical yield-learning cycle within the fab from as much as eight weeks to as little as a few days. This enables chipmakers to accelerate the production ramp of new IC technologies while increasing their baseline yields. At the heart of µLoop are e-beam scanning inspection and review technologies — used in tandem with patented test structures and defect and yield-analysis software — which within minutes profile an entire wafer and pinpoint the exact location of electrical defects. This approach to yield-learning effectively brings electrical-test results in-line for front-end fabrication, closing the time gap between process development and electrical test. Speed and accuracy in locating electrical defects are made possible by: patented test structures that replicate customer-specific design rules and products; the latest-generation eS20XP scanning e-beam inspection and eV300 review systems, which use a voltage-contrast technique to identify and characterize electrical defects; and advanced defect and yield-analysis algorithms that filter out non-yield-relevant defects. KLA-Tencor Corp., San Jose, CA; ph 408/875-5473, [email protected], www.kla-tencor.com.
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Electron-beam maskwriting system
The MEBES eXara system — based on the MEBES X platform architecture and developed in partnership with International Sematech — is a mask pattern generation solution for 100nm mask production and 70nm mask development. Its high-resolution 50kV electron optics and precise raster-based writing strategy provide very good linewidth control and image placement accuracy with high productivity, independent of pattern density and optical proximity correction complexity. The system's Raster Graybeam II writing strategy represents an advantage over competing vector-scanning methods, and the data format for eXara's raster-based architecture streamlines data preparation prior to writing, further reducing turnaround time from chip design to printed mask. Another benefit of the MEBES eXara system is its broad application space. The electron beam spot size and spot current are independently adjustable over a wide range. The variable spot size allows users to write the most advanced masks using the sharpest spot (60nm) while writing the majority of circuit layers with a larger spot for optimal productivity. The variable spot current enables customers to extend mature resist processes that typically require high doses, as well as supporting a spectrum of high-performance chemically amplified resists. Writing speed is independent of resist dose. ETEC Systems Inc. (an Applied Materials company), Santa Clara, CA; ph 408/748-5227, [email protected], www.appliedmaterials.com.
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Material control system
CLASS MCS 5 — CLeanroom Automation System Server Material Controls System — controls automated material handling system (AMHS) hardware, allowing users to manage automated material movement in a fab cleanroom environment. It addresses requirements that include interbay and intrabay material movement, dynamic configuration, ease of use and administration, and open architecture. CLASS MCS 5 is AMHS equipment independent and interoperable; it employs International Semi standards IB SEM (E-82) and Stocker SEM (E-88) for AMHS equipment automation. The system includes an associated MCS development kit and a standard FACTORYworks MES interface. Enhancements include additional AMHS vendor interfaces, a notification server, support of bi-directional ports, and expanded anomaly handling. CLASS MCS 5 manages the scheduling, transportation and storage of carriers in the manufacturing environment. Control of the AMHS equipment includes management of stockers, transport equipment, and automatic identification systems, as well as the tracking of material movement in the facility. Brooks Automation Inc., Chelmsford, MA; ph 978/262-5855, [email protected], www.brooks.com.
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Dry and wet clean processes
Users of Trilennium cleaning systems can now employ a dry cleaning process prior to single-wafer wet cleaning. Processing with 172nm UV light removes many organic contaminants and renders the surface of the substrate more hydrophilic, improving the effectiveness of subsequent wet cleaning steps. The Trilennium Model 3309 processor maximizes polymer removal productivity and effectiveness for wafers up to 300mm. Its compact structure incorporates nine stacked, sealed processing chambers, providing the uniformity and precision available only with single-wafer wet processing under complete digital control over process parameters — chemical flows, temperature, application, and circulation. The 3309 houses the entire process, from chemical storage to complete automatic handling, and is Semi S2-0200 safety and ergonomic compliant. Solid State Equipment Corp., Horsham, PA; ph 215/328-0700, [email protected], www.ssecusa.com.
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Integrated wafer feeder
This integrated wafer feeder incorporates state-of-the-art vision processing and field-proven wafer handling to offer users reliability, high speed, flexibility, and the ability to retrofit. It presents die directly to the GSMxs, GSMx, GSM1, or GSM2 platforms. Die are picked from the wafer and shuttled to the placement head for picking. From one to seven die can be presented for gang picking. Single or multiple part numbers of wafers can be processed. Features include: magazine input up to 25 wafers; random access to multiple part-number wafers; automatic tool change; pre-stretched wafers for fast wafer change up to 200mm; wafer map input or ink dot identification; tact time of 1 die/sec; barcode identification and tracking of wafers; and a footprint <4 ft2. Universal Instruments Corp., Binghamton, NY; ph 607/786-8104 or 800/432-2607, [email protected], www.uic.com.
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Transmission electron microscopes
The next generation of Tecnai transmission electron microscopes (TEMs), Tecnai G2, allows both experts and nonexperts to use the most advanced TEM, STEM, and nanoanalysis techniques for semiconductor, data storage, and materials research applications. The series features automatic aperture control, complete remote-control capabilities, and automatic set-up of optimized parameters for all operating modes. Tecnai imaging and analysis software allows automated data-acquisition using advanced spectrum imaging and tomography techniques. The G2 series also includes the F20 U-Twin STEM, which combines the ultimate in TEM and STEM resolution to make possible sub-nm chemical profiling using advanced energy dispersive x-ray spectroscopy and electron energy loss spectroscopy. The F20 U-Twin STEM features an ultrahigh-resolution objective lens, a very high-stability scanning system, and a high-sensitivity electron detection system. FEI Co., Eindhoven, Netherlands; ph 31/40-276-6225, [email protected], www.feicompany.com.
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Automatic wafer jar loader
Model 325-6000 wafer jar loader automatically removes wafers from cassettes and safely loads them into shipping jars. The wafer holder cassette is placed in the Speedline loader with the H-bar facing up, not down, eliminating the need to rotate wafers. Wafers are picked up from the backside, improving throughput because the jar loading process goes faster and more smoothly, and the risk of mishandling is reduced. The short cassette-to-jar distance further enhances throughput and safe handling of wafers. The unit handles all popular styles of wafer cassettes and commonly used jars/containers up to 3-1/8 in. deep. The interleaf loading chamber holds up to 400 interleafs — either porous or nonporous, carbon-based interleafs run equally well. A vacuum generator is built into the 325-6000. Wafers are removed from cassette via the vacuum pick-and-place arm, and an advanced linear transfer ensures smooth, vibration-free movement of wafer to container. When in position, wafers are released and gently guided into the jar with accurate placement, separated by an interleaf sheet. The wafer jar loader loads up to 10 wafers/min. Speedline Manufacturing Co., Springfield, PA; ph 610/604-9932, [email protected], www.speedlinemfg.com.
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Thermal interface materials
The ABLETHERM 3100 series of advanced thermal interface materials feature very good thermal performance, low modulus, and high adhesion. This combination of features provides better heat transfer and device reliability than thermal greases, gels, and phase change materials. The materials have very low moisture absorption, contributing to good adhesion reliability during 200-hour HAST exposure. The ultralow stress bond between the chip and thermal lid survives 1000 temperature cycles under condition B (-75 to 125°C) without delaminating. The good adhesive properties of the materials also allow their use for FCBGA lid attach applications. Good dispensability and rheology enable the materials to be incorporated into standard dispensing systems. Ablestik, Rancho Dominguez, CA; ph 310/764-4600, fax 310/764-2545, www.ablestik.com.
Perfluoroelastomer parts
Kalrez 6375 UltraPure (UP) parts resist all wet process chemicals, including acids, amines and bases. These chemicals can attack elastomeric seals, causing them to swell and degrade or to leach undesirable metallic and ionic extractables that affect IC functionality. Kalrez 6375UP minimizes the potential for wafer contamination with trace chemicals (anions and total organic carbons), metallic ions, and particles. Typical physical properties of 6375UP include good mechanical strength and compression set properties at continuous service temperatures up to 275°C. DuPont Dow Elastomers, Wilmington, DE; ph 800/853-5515 or 302/792-4347, www.dupont-dow.com/crg.
Detection of wafers in cassette
The LED Wafer Mapping Sensor, MDW-1, offers safe, reliable detection of wafers in a cassette. It senses nitride coated wafers, which in the past were hard to detect reliably. The MDW-1 was designed to detect any type of wafer, including glass wafers. The sensor uses a visible red LED light source, so there are none of the safety issues that must be addressed when using sensors with laser light as the source. It uses a unique arrangement of projectors and detectors, is both compact and lightweight, and is completely self-contained. By offering both NPN and PNP outputs, it is compatible for worldwide use. Sunx Sensors-Ramco, West Des Moines, IA; ph 800/280-6933, [email protected].
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Ball placement system for CSP
The DirEKt ball placement system consists of two machines: the ELA and 265 Horizon systems, side-by-side in the production line. The ELA puts down flux or solder paste using print technology; the 265 features a ball transfer head that positions a solder ball at each pad location. The balls are gently but firmly pushed down into the receiving material with independent pressure on each sphere. Wafers can be processed using dedicated tooling, and other substrates can be processed in strips, trays or boards, making the equipment highly flexible. The ball placement reservoir is easily interchanged in situ, and the two-stage hopper design holds up to 50 million solder balls. Product changeover is <10 min. DEK, Flemington, NJ; ph 44/1305-208-356 or 908/782-4140, [email protected], [email protected], www.dek.com.
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High-viscosity fluid dispense
The Encompass HV fluid dispense system, for high-viscosity fluids, has two-stage pump technology that independently filters while it performs dispense functions at a separate rate. The PI 250 cartridge filter efficiently reduces gels and bubbles, greatly improving the process. CE-certified, the system offers a programmable controller that prevents chemical stagnation and provides accurate, independent control of all fluid-handling functions. This allows dispense recipes to be downloaded by a removable, handheld terminal. The controller is designed to meet current Semi S2 standards. Encompass HV is offered in both stainless steel and Teflon versions. Using a hollow-fiber, ultrahigh-molecular-weight-polyethylene membrane, the PI 250 cartridge filter will meet the demands of point-of-use polyimide filtration. Mykrolis Corp., Bedford, MA; ph 781/271-4000 or 972/359-4000, [email protected], www.mykrolis.com.
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High-purity pressure transducer
Model 227 pressure transducer is designed for installation on modular gas delivery systems or panels for monitoring of specialty gas processes in high-purity gas delivery systems and semiconductor process tools. Weighing only 6.5 oz and standing 3.6 in. high, the Model 227 offers good zero stability and long-term reliability, achieved through this company's variable capacitance sensing technology. The transducer has a 1.125-in. down-mount "C" seal pressure fitting and small swept sensor chamber, utilizing VAR 316L SS electropolished to 5Ra (10 max.) finish for contaminant-free operation and system purging. In addition, every sensor is mass spectrometer helium-leak tested to 1 x 10-9 ATM.CC/sec. The Model 227 is available with 5 VDC, 10 VDC or 4-20 mA output with 0.25% of full-scale or 1.0% of reading accuracy. It offers pressure ranges from 0-2 psi to 0-3000 psi in gauge, absolute, or compound pressure. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, [email protected], www.setra.com.
Spectroscopic ellipsometer
The GES5 stand-alone spectroscopic ellipsometer offers the possibility of combining several techniques onto one R&D instrument in order to achieve more accurate diagnostics on complex structures. In this way, measurements can be performed quasi-simultaneously at the same sample location. This combination capability addresses such applications as photonics and material analysis, new semiconductor processes, and advanced lithography. SOPRA, Bois-Colombes, France; ph 33/1-4649-6700, [email protected], www.sopra-sa.com.
Liquid IPA drying
The A2VID Liquid IPA dryer provides completely dry wafers with no particles added larger than 0.16µm and process time <9 min. It dries high-aspect featured wafers with deep trenches at a width down to 0.09µm with no discernible watermarks. Based on proprietary liquid IPA drying technology, A2VID uses an inert plastic drying chamber and manifold, in situ de-ionization, state-of-the-art nitrogen, DI water, IPA filtration, and on-board diagnostic software. It is designed primarily to be integrated into automated wet chemical processing stations for wafers up to and including 300mm. L-Tech Corp., Mountain View, CA; ph 650/903-0304 ext 16, [email protected], www.ltechcorp.com.
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High-density I/O controllers
These two families of D.I.P. DeviceNet I/O controllers are designed for use on semiconductor manufacturing tools and for similar industrial manufacturing processes. The D.I.P. Products CDN39x Series consists of three high-density controllers for bi-directional digital and analog I/O applications. The D.I.P. CDN49x Series consists of four high-density digital, analog, and mixed analog/digital controllers. All controllers can be rack mounted in a standard card cage or used in stand-alone control systems. DeviceNet signaling is optically isolated from all input and output. Onboard isolated DC-DC converters provide 5 VDC processor power from the DeviceNet supply voltage. MKS Instruments Inc., Andover, MA; ph 909/686-4211, [email protected], www.mksinst.com.
Low-k cleaning and resist removal
Highlands is an advanced 200/300mm system designed for low-k cleaning and high-dose implant resist removal. Built on the production-proven Aspen III platform, Highlands features a proprietary ICP technology for optimal uniformity and low damage. The system's modular design allows process modules to be added for greater process capacity and flexibility. Highlands' dual-wafer processing capability provides high productivity, and its ability to reduce operational steps simplifies integration and provides customers with very good COO. Mattson Technology, Fremont, CA; ph 510/492-6518, fax 510/492-6460, www.mattson.com.
Miniature ion source
The MIG5 is based on a filamentless cold-cathode principle. This miniature ion source can operate with very low gas flow and at low energy, through a range of 0.2-5 keV, producing beam currents up to 80 microamps. The MIG5 is suitable as a low cost ion gun for substrate cleaning, as well as for sputtering applications. Due to its inherently easy-to-use design, the MIG5 provides instant start-up and low maintenance. Oxford Applied Research, Witney, UK; ph 44/1993-773575, [email protected], www.oaresearch.co.uk.
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Filter assembly
The PhotoKleen EZD-2 filter assembly is designed for small resist dispense installations that require the smallest system footprint and lowest holdup volumes. The filter configuration provides safe, fast and easy filter change-outs while decreasing system downtime and minimizing operator exposure to harmful chemicals. The assembly consists of a PTFE head manifold interface and a high-density polyethylene capsule filter. It offers low holdup volume, minimized dead space, and reduced chemical waste. The capsule-style design provides top in/top out flow direction and one-step quick filter disconnect. The design allows a bottom fill path that minimizes air entrapment. Pall Corp., East Hills, NY; ph 516/484-3600, [email protected], www.pall.com/micro.
Low-k and copper residue removal
The improved chemistry of the Sequestrox product line provides better performance in today's low-k and copper residue removal applications. The Sequestrox family of residue removers contains specially formulated electrolytes and chelating agents. Sequestrox chemistry sequesters ash residue, allowing it to be removed from dielectrics, copper, silicon, and other materials without substrate etching. Sequestrox types I, II, III, and IV are sodium-free, high-purity aqueous cleaners that can be removed using a DI water rinse. Type V contains a strong chelating agent and is also easily rinsed. Sequestrox chemistry provides a range of formulations for optimizing processing conditions. Transene Co., Danvers, MA; 978/777-7860, www.transene.com.
No flow-fluxing underfill
The E1340 series of no flow-fluxing underfills incorporates solder fluxing capability into an epoxy-based underfill chemistry. The result is a robust encapsulant for interconnecting/underfilling area array devices. The series is specifically designed to enhance the reliability of area array device assemblies such as flip chip, chip scale packages, and ball grid arrays. The first product of the series, E1344, facilitates solder joint interconnect and fully cures in a variety of SMT processing configurations. Using a typical SMT reflow cycle, E1344 interconnects and achieves full cure in only one typical SMT reflow exposure plus an in-line (or snap) post cure. With a slightly modified SMT reflow condition, it will interconnect and fully cure in just one reflow exposure, allowing the assembly of area array devices with underfill to be virtually transparent to the typical SMT process. Emerson & Cuming, Billerica, MA; ph 800/832-4929, [email protected], www.emersoncuming.com.
Test handler
The RoboTek GT-1000 test handler automatically feeds semiconductor devices from a stacked tube input system through a gravity track assembly where they are singulated into a series of test sites. After testing, the GT-1000 automatically sorts the devices into one of eight tubes in the rotary tube output system. The handler is configured using standard interchangeable modules. Lead straightening sites, multiple test sites, marking sites, and/or vision inspection sites can be implemented to customize the handler for almost any requirerment. RoboTek International, Richardson, TX; ph 469/330-0850, [email protected], www.robotek.com.
High-rate silicon etch source
This new high-rate silicon etch source, the ASEHRM, is based on a completely new design of decoupled ICP source and offers significantly improved etch rates and cross-wafer uniformity. The source has successfully demonstrated a range of applications, including high-aspect-ratio etching and deep/through wafer anisotropic etching. In addition, it has achieved good results in etching optically smooth trench sidewalls and small high-aspect-ratio via holes. As with all systems running deep silicon etch processes, results are device-dependent, but for a range of typical MEMS devices the ASEHRM source has consistently demonstrated etch rates up to three times those of the standard rate "Bosch" sources. These results are achieved without any degradation in profile or roughness, and in many instances also benefit from greater cross-wafer uniformity. Coupled with this company's loadlocked Multiplex or ASPECT cluster platforms, the ASEHRM greatly improves the price/performance equation that has limited the acceptance of deep silicon etch processing for certain applications. Surface Technology Systems, Newport, UK; ph 44/1633-654-702, fax 44/1633-652-405.