New Products
11/01/2001
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High-precision inspection for 300mm
Optistation-3000 is a set of tools designed for all 300mm inspection requirements. The system includes three models: OST-3000, a simple open-cassette instrument for engineering and analysis; OST-3100, an offline single FOUP inspection tool that has a small footprint and low cost; and OST-3200, a two-FOUP system that meets 300mm fab automation needs. Optistation-3000 systems allow very good brightfield and darkfield observation as standard, plus optional differential interference contrast observation. A newly designed DUV module is available for 0.10µm design rules. Front- and backside macro inspection is a standard feature of the 3100 and 3200; it is optional on the 3000. Flexible layouts on the single loadport systems allow the loadports to be placed on the side or rear of the 3100 and 3200, and on the side or front of the 3000, allowing the tools to be adapted easily to various cleanroom layouts. The system surpasses Class 1 cleanroom-compatible specifications, and it can be fully automated for loading, magnification change, brightfield/darkfield switching, aperture stop, field stop, and polarizer capabilities. Nikon Instruments Inc., Melville, NY; ph 800/526-4566 ext P1049, www.nikonusa.com.
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Ion implanter for 300mm
The IW-630 ion implanter, designed for 300mm fabrication, allows automatic control of ion beam profile and scanning speed for very good dose uniformity and repeatability. The unit increases processing speed with a quick raw beam set-up and high-speed mechanical throughput, while offering low tool cost. Handling system throughput is 220 wafers/hr and system footprint is 17.2 m2. The implanter shows negligible effects from outgassing or energy contamination, and requires little maintenance. It is also applicable to parallel, wide tilt angle, and stepping ion implantation. The IW-630 is also available for 200mm fabrication. ULVAC Technologies Inc., Methuen, MA; ph 978/689-6300, e-mail [email protected], www.ulvac.com.
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Airborne contaminants in DUV lithography
The IonPro-IMS analyzer is designed to solve the problem of portable, real-time airborne contamination monitoring in the DUV fab. It detects airborne contaminants in DUV lithography, improving resist uniformity, maximizing filter life, and reducing process downtime. The tool is based on field-proven ion mobility spectrometry (IMS) technology, with sub-ppb to ppm levels of detection. It has an internal 4-channel sampling system for easy monitoring from four locations within the tool. IonPro-IMS is supplied with an onboard calibration system and can use the HMI (human-machine interface) software package. This allows real-time viewing of all channels being sampled. A Windows NT workstation gives a composite graphical display of concentrations, historical trending, alarms, and settings. With an Ethernet network interface card and an HTTP web server, the IonPro-IMS allows multiple users to view the system over the Internet from a standard web browser. Molecular Analytics Inc., Sparks, MD; ph 410/472-2146 ext 102 or 800/635-4598, [email protected].
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Optical metrology module
The Wyko Optical Metrology Module (OMM) is designed for in-situ metrology in high-volume production environments for OEM applications. The OMM provides accurate process control metrology that features high-speed, noncontact topography measurements for feature heights from 0.1nm to 2mm and for fields of view up to 8mm square on advanced surfaces. Utilizing field-proven interferometry techniques, the OMM is a stand-alone module designed to integrate easily into the user's production equipment and environment. When integrated, the gauge-capable OMM provides closed-loop feedback, minimizes part handling, and meets critical measurement requirements for a wide range of applications. The OMM supports both phase-shifting and white light interferometry. Its straightforward interface of self-contained tip/tilt, illumination, auto-focus, and motorized turret mates easily with new and existing machinery and handling. Ethernet-based architecture allows access from a remote computer, and customizable recipes allow complete control of automated measurement runs. OMM has an easy-to-use production interface and versatile Vision32 software for analyzing and visualizing data. Digital Instruments/Veeco Metrology, Santa Barbara, CA; ph 805/967-2700 ext 2295, [email protected], www.veeco.com.
Polishing pad conditioner disk
This pad conditioning disk for CMP processes uses a new metal matrix that improves conditioning performance. Not only is the disk chemically resistant to all CMP chemistries, the disk's life expectancy is two to three times that of a standard conditioning disk. The new metal bonding matrix has a high hardness (2600 vickers) and acts as a solid film lubricant, which in turn will reduce defects caused by build-up in the conditioning process and provide longer life. TBW Industries Inc., Furlong, PA; ph 215/794-8070, [email protected], www.tbw-inc.com.
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Megasonic cleaning system
ProSys Mark-I is a stand-alone megasonic cleaner that delivers a wide range of controllable, adjustable power. It includes custom software control and electronics allowing for exact frequency match for every crystal, feedback control of frequency that provides optimum continuous power, and the MegaSeries electronics package with pulsed or continuous wave operation for repeatable results. The system can accommodate either a 25-wafer cassette (200mm) or a 13-wafer cassette (300mm). ProSys Mark-I provides the highest available watt densities (up to 25 W/cm2), resulting in faster cleans and reduced chemical usage. ProSys Inc., Campbell, CA; ph 408/871-2500, www.prosysmeg.com.
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In-line flip chip cleaning
This automated cleaning and drying system is based on the Mach I and Mach III Series HydroJet Inline Cleaners. Advances and improvements in the configuration of the system have given it the ability to efficiently clean and thoroughly dry delicate flip chip assemblies at in-line speeds. Incorporating patented wet and dry isolation, this technology improvement minimizes upstream contamination and improves the life and economy of the optional closed-loop resin beds. Effective flip chip cleaning chemistries can thus be employed to their maximum cleaning effectiveness while maintaining lowest cost operation and efficiency. The patented dryer module removes 99.9% of all rinse water from under large flip chips where spacing approaches 1-2 mils at component stand-off or small heights up to 3.5 inches with no heat. The options are available in a very small footprint, 12.7 ft - HydroJet I, 16.7ft - HydroJet III. Multi-configurable spray jet configurations, combined with top and bottom pressure adjustments, allow maximum flexibility and the ability to "tune" the cleaner specifically for flip chip application requirements. Austin American Technology Corp., Austin, TX; ph 512/335-6400, fax 512/335-5753, [email protected], www.aat-corp.com.
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Probe cards
Pyramid Probe cards reduce the cost of test by increasing equipment throughput through increased uptime and by increasing speed through multi-DUT testing. Fine-pitch capability enables semiconductor manufacturers to test their pad-limited, 0.1µm devices. Pyramid Probe's advantages over needle probe cards for devices with demanding probe test requirements are: low pad damage, multi-DUT probing, fine pitch, high RF bandwidths, fast rise times, long service life, and low contact resistance. Cascade Microtech Inc., Beaverton, OR; ph 503/601-1181, [email protected], www.cascademicrotech.com.
Thin-film SOI wafers
Three new thin-film UNIBOND silicon-on-insulator (SOI) products leverage this company's proven Smart Cut technology to target ICs with sub-0.10µm geometries. These new products — partially fully depleted UNIBOND, fully depleted UNIBOND, and ultrathin UNIBOND — maintain layer thickness nonuniformity to ±5% for silicon layers as thin as 700Å, at all sites on all wafers. SOITEC, Peabody, MA; ph 978/531-2222, [email protected], www.soitecusa.com.
Compact dry leak detector
The ASM 182TD+ particulate-free, oil-free leak detector meets the stringent demands of the semiconductor market and has been designed for easy cleanroom operation. It is voice-synthesized with four levels of operator interface, and locates leaks as small as 10-12 atm.cc/sec without using liquid nitrogen. Alcatel Vacuum Products Inc., Hingham, MA; ph 781/331-4200, fax 781/331-4230; [email protected], www.alcatelvacuumus.com.
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Fume extraction system
The Purex Powerflow fume extraction and purification system features a unique vacuum control capability. By automatically keeping air flow constant, accurate temperature profiles are maintained in reflow ovens and wave soldering machines. The risk of thermal shock is therefore minimized, improving product quality and reducing reject rates. The microprocessor-controlled IPCP (Intelligent Purification Control Program) monitors the vacuum in the system and automatically varies the pump's motor speed to keep a constant vacuum. Hi-Tech UK, Rotherham, UK; ph 44/1709-763000, [email protected], www.purexltd.co.uk.
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Optically collimated x-ray beam generation
The Optical Element x-ray generation column focuses x-rays to a super-intense small spot for measurement of metal film thickness and composition. The technology replaces less efficient conventional mechanical collimation that relies on circular or rectangular apertures to govern resultant beam size. Instead, the Optical Element captures primary beam x-rays in an input array, then bends the x-ray path through the element and releases a focused and consistent resultant beam source via the exit matrix. Efficiency is enhanced 1000x for circular beams at the sample surface with diameters from 20-50µm, resulting in simultaneous multimetal layer determination with precision values of 0.1-2% relative standard deviation for thickness ranges from 5nm to 10µm. The Optical Element has been incorporated into NeXray's Bench, Console and Automated Wafer Handling System XR platforms of MXRF (Microbeam X-Ray Fluorescence) metrology tools. NeXray, Ronkonkoma, NY; ph 631/738-9300 ext 2446, www.veeco.com.
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Magnetron sputtering sources
The Nautilus Series "rotating" magnetron sputtering sources, in target sizes ranging from 150-300mm, have several features that can simplify both retrofit and new-system design. The sources are built around a rotating, modular magnet array that can be tuned to optimize uniformity and/or target utilization in all types of chamber geometries and shielding configurations. It can also be configured for segmented target sputtering for co-deposition or combinatorial chemistry investigations. Integration with a new system design is facilitated by an optional hinge-plate that permits the operator to "flip" the source for easy access target changes and cleaning. A fully self-contained gas introduction system helps offset the effects of asymmetrical vacuum pumping and simplifies cleaning, since the gas ring is easily accessed during target changes. If gas is introduced through a small hole in the mating flange between the source's double O-ring seal system, no external, flexible gas lines — which can easily fatigue causing vacuum leaks — are required. AJA International Inc., North Scituate, MA; ph 781/545-7365, [email protected], www.ajaint.com.
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Environmental monitor system
The QView Environmental Monitor System monitors key environmental parameters in critical equipment applications such as factory interfaces, robotics, minienvironments, and wafer and reticle stockers. The five parameters that will be monitored in the Version 1.0 fully integrated system are air pressure, air velocity, temperature, relative humidity, and particles. The QView is a "plug-and-play" solution that uses a standard software applications package. Capable of supporting 32 sensors, the QView can monitor several pieces of process equipment simultaneously. Pentagon Technologies, Fremont, CA; ph 510/440-1890, [email protected], www.pen-tec.com.