New Products
09/01/2001
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RTP system for 300mm
The Summit 300XT rapid thermal processing (RTP) system, with throughput of 105 wafers/hr, addresses the most demanding 300mm applications, including ultrashallow junction annealing beyond the 100nm node. It features PrecisionTempPlus, a predictive, feed-forward, model-based temperature control system. A real-time model for wafer temperature is embedded in the PrecisionTempPlus control algorithm, giving the system a look-forward capability that allows very accurate temperature trajectory tracking. This feed-forward control approach provides superior spike anneal performance relative to the lamp RTP feedback systems based on conventional proportional derivative "PID" control. The system also provides accurate and repeatable emissivity independent temperature measurement, combined with closed-loop temperature control. The enhanced hot wall isothermal design produces repeatable within-wafer and wafer-to-wafer uniformity, resulting in very good process yields. The broad temperature range of 275-1200°C gives both logic and memory device makers the ability to cover the full array of advanced thermal processing applications, including anneals for ultrashallow junctions, dry and wet oxidation, silicides, shallow trench isolation oxides, copper, and high- and low-k dielectrics. Axcelis Technologies Inc., Beverly, MA; ph 978/787-4273, [email protected], www.axcelis.com.
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Litho cluster for wafer level packaging
This 300mm lithography cluster consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. The tool, the LithoPack300, is designed for wafer bumping and wafer level packaging applications on 300mm wafers and allows quick changeover from 300mm to 200mm wafers. Wafer level backend technology requires very thick photoresist layers (up to 100µm) and BCB or polyimide processing. The spin-coating modules therefore include this company's GYRSET technique, which allows considerable material savings. Other packaging-specific features, such as edge bead removal and backside rinsing, have been integrated into the system. Together with modules for resist baking and resist developing, the cluster can be configured for any thick resist process. The exposure unit is a 300mm full-field proximity mask aligner that enables wafers to be exposed in a single step, offering maximum throughput >100 wafers/hr. Karl Suss, Munich, Germany; ph 49/89-320-07449, [email protected], www.suss.com.
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Submicron prober
Used for device verification and failure analysis, the Real Time Prober (RTP) 2000 is a complete transistor level characterization tool that incorporates multiple independent scanning heads for both atomic force microscopy and internal node Ohmic probing. The independent heads allow designers and FA engineers to make Ohmic contact to internal circuit nodes of geometries >100nm. System software controls the scanning heads to produce ultrahigh-resolution microscopy and also controls precise placement of micro-machined probe tips. Included is a suite of Ohmic probes that incorporate high-impedance FET front ends for both high-precision DC and multi-Gigahertz AC probing. Up to four independent probe heads can be used to achieve true analog voltage and current measurements at leading-edge geometries. Image resolution is 50nm, probing capability is 100nm, and frequency range is DC to 2.5 GHz. MFI Technologies, San Jose, CA; ph 408/432-3980 ext 110, [email protected], www.mfitech.com.
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Point-of-use pump
This revolutionary new dry pump, the IPUP A100, has been jointly developed by Alcatel Vacuum and Applied Materials and is designed for integration within semiconductor tools, delivering substantial cost, time and energy savings. The pump, for 300mm fabs, is ~75% smaller and uses <50% of the power of conventional dry pumps with similar pumping speeds. The 100m3/hr pump is fully compatible with cleanroom operation and can replace remote pumps up to 500m3/hr. The pump's small size promotes temperature uniformity and eliminates by-product deposition, while the energy savings are created by locating the pump close to the process, eliminating conductance losses. Power consumption is also reduced thanks to the availability of variable speeds in standby mode. Elimination of vacuum lines gives considerable costs savings, while reducing energy consumption and footprint; and the elimination of by-product condensation in foreline pipings increases both up-time and yield. Time savings are another distinct advantage because there is no longer any need for tool-to-tool or fab-to-fab variation at installation and users get reduced evacuation time for load-locks. The IPUP A100's low vibration and noise levels, and compliance with high safety standards, make it suited to cleanroom use. Two main versions are available: the IPUP A100L, for clean applications not requiring purge gas, and the IPUP A100P for all process applications requiring comprehensive monitoring and precise temperature control up to 130°C. Alcatel Vacuum Technology/Applied Materials Inc., Annecy, France; [email protected], www.alcatelvacuum.com.
High-speed die sorter
The innovative high-speed die sorter DS 6000, available with or without a flip option, picks components directly from the wafer, performs an inspection, and sorts them into a carrier tape or surf tape. The system is configured for tape with reel-to-reel handling; throughput is up to 6500/hour. The DS 6000 handles good die from the wafer and is equipped with hot or cold sealing stations. The flexibility of the system means that users can use the system as a flip-chip sorter or normal sorter. With the flip-chip unit, bumped die are picked from the wafer and conveyed to carrier and surf tapes. A programmable Z-table, a programmable turning axis (180°), and the programmable die attach force are typical for this option. The sorter makes quality selection through a new vision system. Early testing enables users to cut production costs. Three optical systems referring to bond-, flip- and place position ensure high accuracy in placement and multiple inspection. Wafer mapping, which includes online sending of map files to the bonder, keeps exact statistics on good and bad die and on complete hours of operation. Mühlbauer AG, Roding, Germany; ph 49/9461/952-0, fax 49/9461/952-8483, [email protected], or ph 757/873-0424, fax 757/873-0485, [email protected].
Moisture analyzers
The V Series is a new generation of FTIR moisture analyzers that has been engineered for greatly reduced detection levels and increased durability under vacuum. Enhancements include dual ADC electronics for improved signal-to-noise, a sensitive thermo-electrically cooled InAs detector, electro-polished gas cells to eliminate sample moisture retention, and low internal power dissipation for durability under extended vacuum operation. The V Series analyzers provide real-time measurement of trace moisture in NH3, HCl, HBr, NF3, and other corrosive matrices. Measurement intervals are typically <1 min. The instrument is operated under vacuum to eliminate background atmospheric moisture, thus reducing set-up time to a few hours. Purged versions of the V Series are also available. MIDAC, Irvine, CA; ph 949/660-8558, [email protected], www.midac.com.
Copper delivery system
Copper 2.0 is a suite of polypropylene systems that deliver copper sulfate to — and recover spent material from — the copper deposition tool. All wetted surfaces in the delivery system are made from high-purity PFA or PVDF materials. For use on pilot or high-production lines, the Copper 2.0 system is easily scalable as production volume increases. The system works with ChemManager, an Internet enabling control system that monitors alarms and alerts, providing proactive diagnostics and services, as well as chemical usage and tracking. Microbar, Sunnyvale, CA; ph 408/541-1040, [email protected], [email protected], www.microbar.com.
Automated microcleaving system
The MC600 automated microcleaving system is designed for rapid cross-sectioning to produce clean, dry and artifact-free specimens for SEM and TEM characterization. Dedicated software allows automatic mapping and planning of single or multiple targets and features automatic off-loading for immediate inspection. PlanIt software lets system operators plan preparation of multiple target segments offline, from a full or partial wafer for SEM or TEM characterization. This new software allows use of defect coordinates from defect review tools or manual measurements to plan the most efficient set of cleaves for cross-sectioning of all desired defects and features in the wafer. An accurate cleaving map is created and printed with a one-to-one correlation to the wafer or wafer segment. The MC600 operates faster than previous microcleaving systems and offers the user a trade-off between speed and accuracy. A Scribe & Clean option is an automated sequence of coarse cleaves and final cleave with better than 0.5µm location accuracy, taking 9 min/sample. The QuickCleave option provides samples in 3 min, and targets can be processed up to the edge of the wafer. An advanced cryo-cooling mechanism improves accuracy and quality on substrates that have softer film material, such as aluminum, copper, photoresist, and organic low-k dielectrics. SELA USA Inc., Upper Yokneam, Israel; [email protected], www.sela.com.
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Dual-arm robot
The AdeptVicron 310D dual-arm robot, designed for semiconductor wafer handling, is a four-axis, Class 1-compatible robot designed for high-throughput 200mm and 300mm inspection, metrology and wafer process tools. AdeptVicron robots are controlled by AdeptWindows C-40 robot controllers, which enable PC connectivity at a greatly reduced cost by providing built-in, plug-and-play Ethernet connectivity. The controller also provides simplified integration with DeviceNet industry standard distributed I/O capability. Adept Technology Inc., San Jose, CA; ph 408/434-5021, [email protected], www. adept.com.
UHP resin
PFA-FLEX is a series of PFA resins designed for semiconductor processes that require superior environmental stress crack resistance (ESCR). In addition to extreme chemical and temperature resistance, the resin provides very low levels of extractable ions. The recent trend toward the use of fluorosurfactants as wetting agents has caused concern, since PFA can be stress-cracked by fluorosurfactants. PFA-FLEX offers improved ESCR in the presence of these chemicals. It is available in two grades: X 8502 UHP, with a nominal 2 melt-flow index for tubing applications; and X 8515 UHP, with a nominal 15 melt-flow index for injection molding applications. Dyneon LLC, Oakdale, MN; ph 651/736-9241, www.dyneon.com.
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Ozone destruct systems
This range of ozone catalytic destruct systems offers the optimum design solution to decompose ozone to safe levels through the catalytic conversion of ozone to oxygen. The O3-CAT family of destruct systems destroys high ozone concentrations, reducing them to safe levels, i.e., below the OSHA "threshold limit value" of 0.1 ppmv, thus protecting personnel, equipment, and the environment. In the O3-CAT family, ozone decomposes as a result of chemical adsorption at the solid surface of a catalyst bed. The ozone molecules are held to the catalyst surface by forces comparable in strength to their own chemical bonds, which ultimately weaken, and the ozone then decomposes in an exothermic reaction, forming oxygen. Benefits of these destruct systems include rapid reaction time, room temperature operation, compact sizes, no consumables or maintenance costs, and simple installation. IN USA, Needham, MA; ph 800/798-4029 or 781/444-2929, fax 781/444-9229, [email protected], www.inusacorp.com.
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RF plasma generator
The Qinto 3.0 RF system is offered in both an OEM modular and a 19" rack-mount model. Its built-in microprocessor allows output monitoring, power ramping, energy control, error logging, and energy observation. Actual volume has been reduced to 80% and weight to less than 50% of older Huettinger models in the same power range. The generator produces 3000 Watts of power when operated into a 50 Ohm load. Output frequency is 13.56 MHz, &!177;0.05%, with CEX input and output. The generator can be run on either 208V, 3-phase or 400V 3-phase. By using a high-efficiency switch-mode design, utility requirements (water and power) are minimized. Interfaces available include RS232, RS484, DeviceNet and CANopen. Huettinger Electronic Inc., Farmington, CT; ph 860/255-6555, [email protected], www.huettinger.com.
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Advanced particle deposition
The AcuDep system allows semiconductor device and silicon wafer manufacturers to create their own NIST-traceable particle measurement standards, a significant cost saving over commercial depositions, while controlling the particle size and the accuracy of the depositions. The accuracy of these standards, used to calibrate particle scanners and to certify wafer cleaning tools, is critical to advanced semiconductor device and silicon wafer manufacturing. The design eliminates traditional deposition drift problems, resulting in a tool with great accuracy for both particle sizing and count. Precise deposition of PSL spheres, which support SEMI standards, can be accomplished at user sites, to their own proprietary patterns and recipes. ADE Corp./The Scatter Works Inc., Westwood, MA; ph 781/467-3500, www.ade.com.
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Stackable clean process oven
The LLC oven is stackable to save cleanroom floor space, and all serviceable components are easily accessible. Chamber volume is 1.6 cubic ft, which is large enough to handle processing applications for both 200mm and 300mm wafers. The chamber also features a noncorrosive stainless steel interior. Continuously welded seams on the insulation side protect the work chamber from contamination and allow washing of the chamber without damage to the insulation. The recirculated airflow is 100% HEPA-filtered for operation up to Class 10. The oven is Semi S2 and CE compliant. It features the programmable Protocol Plus controller, which is designed to make operation simple and flexible. Using Tracker software, controllers can be networked and connected to a host computer, allowing for centralized operation, monitoring, and data logging of an oven network. The LLC is available in either air or nitrogen atmosphere configurations. Despatch Industries, Minneapolis, MN; ph 800/828-9903 or 612/781-5363, [email protected], www.despatch.com.
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Closed-loop cleaning system
The Mega II's revolutionary closed-loop, solvent (or water) electronic assembly and parts cleaning system, with quantitative ION detection and statistical process control capability, is ideal for flip chip, optoelectronics, and advanced or high-reliability technology packages and assemblies. The Mega II wash and rinse cycles incorporate a highly effective spray under immersion process, with strategically located venturi nozzles for maximum cleaning efficiency. The agitation can be controlled to handle sensitive wire bonded substrates or hard-to-clean, tight-tolerance flip chip technology. An ultrasonics assist is available as an option for extremely tough cleaning requirements. A new pre-wash feature for the Mega II allows it to operate in conjunction with this company's patented closed-loop regenerative cleaning process, and allows for an optional dual chemistry cleaning process. Austin American Technology Corp., Austin, TX; ph 512/335-6400, fax 512/335-5753, www.aat-corp.com.
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Programmable power controller
This new Programmable Power Controller proves the reliability of a design by testing the most vulnerable area, its power-up/power-down behavior. The PPC-232 is a programmable microprocessor-based controller for selectively switching 120/240 VAC power to devices under test. It consists of a benchtop control unit and from one to four outlet boxes containing two duplex receptacles/box. The duplex receptacles are controlled individually by the microprocessor, providing a maximum of 16 independently switched loads. The user's hardware configuration is easily tested using the graphical Windows-based PPC "Power-Cycler" software. Innovative Solutions, Minford, OH; ph 888/820-3751, fax 740/820-5451, [email protected].
Resists to simplify lift-off
The AZ nLOF 2000 series i-line photoresists achieve the retrograde profiles required for metal lift-off processing with a single lithography step rather than the complex multistep process. The resists provide a combination of high throughput, versatility and ease of integration into standard single-layer processing. Aspect ratios as high as 4:1 can be achieved. The 2000 series is available in a variety of film thicknesses and can be used with any metal-ion-free developer under standard processing conditions. Data packages and samples are available. Clariant/AZ Electronic Materials, Somerville, NJ; ph 908/429-3538, e-mail [email protected], www.azresist.com.
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300mm resist coating system
The EV101 accommodates an extensive range of materials, including positive or negative resists and polyimides. Dispensing modes can be selected to achieve very thick layers (up to several hundred microns) in one spin cycle. Also, the system supports double-sided coating of thin resist layers, high-viscosity resists, and edge-protection coatings. Economical low resist usage settings and enhanced resist spreading options are provided. System software manages all critical steps, to lower operating costs and increase equipment uptime. The EV101 is fully compatible with this company's automated 300mm production line systems. EV Group US Inc., Cranston, RI; ph 401/784-0008, [email protected], www.EVGroup.com.