Literature
08/01/2001
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Ionization booklet
The revised, 30-page booklet Ionization and Electrostatic Charge Control in the Semiconductor Industry has a new design, updated information, and numerous new illustrations and references. It provides an overview of three ways static electricity affects process yields and product quality; available ionization technology; and measurements of ionizer performance. Discussions of cause and effect, ESD models, various methods of ion generation, standard tests, and maintenance guidelines are also included. SIMCO, Hatfield, PA; ph 800/538-0750 or 215/997-0590, fax 215/997-3450, e-mail [email protected], www.simco-static.com.
Dispense and assembly web site
Information on products for eutectic bonding, optical modules, microwave module assembly, GaAs, die attach, and RF is available on this new web site. The site offers applications and product profiles, as well as a "customers only" page with special features and access. Also included on the site are services, news announcements, newsletters, and a site search engine. MRSI Group, Billerica, MA; ph 978/667-9449, fax 978/667-6109, e-mail [email protected], www.mrsigroup.com.
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XRF technology guide
The X-ray Fluorescence Technology Guide provides information on the basic theory and operation of XRF film thickness and composition measurement tools. It covers topics like generation and detection columns (tubes, collimation, detectors, processing); algorithmic tools; user interface; optical collimation vs. mechanical collimation; gas proportional detection; solid state detection; and air chamber vacuum and vacuum conduit measurement environments. NeXray, Ronkonkoma, NY; ph 631/738-9300, fax 631/738-9329, www.veeco.com.
Assembly and rework application bulletins
A series of eight assembly and rework systems application bulletins are available in print or via the Internet. Each covers a specific application topic, describing the use of appropriate equipment and processes. Topics include solder flip chip bonding; conductive adhesive attachment of gold stud-bumped flip chips; rework of underfilled flip chips; bonding edge-emitting laser diodes using gold/tin preforms; bonding VCELs using gold/tin preforms; hot gas die rework; picking die from dicing tape; and wafer mounting for dicing. Semiconductor Equipment Corp., Moorpark, CA; ph 805/529-2293, fax 805/529-2193, e-mail [email protected], www.semicorp.com.