New Products
06/01/2001
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Wafer surface and edge inspection
The Magic Mirror is an automated surface inspection system for advanced wafers. The system is used for characterizing and monitoring the nanotopography of wafers consisting of devices with <0.18µm design rules. Surface smoothness, undulations, waviness, and other nm-level flatness-related features are instantly displayed in a whole wafer optical image. The Magic Mirror method, a full-field optical reflective imaging technique, is integrated in the YIS-SPN system with defect detection software and robotics for automated wafer-transfer and positioning. System throughput can reach 300 wafers/hr. The Raytex Edge Scan automated wafer-edge defect inspection system uses a noncontact laser-based system to inspect the entire wafer edge rapidly for chips, pits, cracks, scratches, particles, roughness, and other anomalies. It also uses a recipe-based image-processing system to inspect the notch, provide final defect characterization, and print and store video images of the defects. Hologenix Inc., Huntington Beach, CA; ph 714/903-5999, [email protected], www.hologenix.com.
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Automated CD measurement
The MicroLine 500 automatically performs critical dimension (CD) measurements on cassettes of wafers. The system employs an auto-loading robot, pre-aligner, and motorized positioning stage, along with pattern-recognition software, to load, align, and measure wafers without operator intervention. It provides measurement accuracy of 0.01µm with 6nm (1s) repeatability. The system includes a highly flexible, proprietary programming language (MCL) that offers full control of system functionality, including the user interface and report customization. The MicroLine family includes systems that offer automated photomask measurement with repeatability of 2nm (1s). Micro-Metric Inc., San Jose, CA; ph 800/490-3333, [email protected], www.micro-metric.com.
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Nanoindentation test system
The Nano Indenter XPW, designed for tests on wafers up to 300mm in diameter, characterizes the surfaces of full-size silicon wafers down to the level of a few nanometers. Properties such as hardness and modulus of elasticity at this scale can have significant effects on the performance of semiconductors. The system works under computer control by making an indentation with its diamond indenter tip with a controlled force. The depth of the indentation is continuously monitored, providing data from which the hardness of the test specimen, Young's modulus, fracture behaviour, and other mechanical properties can be calculated. The XPW includes a complete operating and data analysis software package. An optional vacuum mount system ensures that the wafer will stay in good condition for additional tests. MTS Systems Corp., Eden Prairie, MN; ph 865/481-8451 or 952/937-4000, fax 952/937-4515.
Photoresist removal solvent
Dynastrip 2001SG is a solvent that removes photoresist films used in lithography processes. As well as removing the resist, it also hinders the redeposition of the material. It is safer than many solvents currently in use, containing no chemicals included on the HAPs list. This is an important factor for companies required to reduce the amount of hazardous air pollutants they produce. Dynaloy Inc., Indianapolis, IN; ph 800/669-5709, fax 800/671-9583, [email protected].
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300mm wafer carriers
EPI 300 MM wafer carriers are seamless, one-piece carriers that feature a detachable handle and can fit inside dry transport systems to minimize handling. They are molded and machined from superclean PTFE or PTFM resins and are unaffected by photoresists, acids, and corrosives. Custom fabricated for semiconductor equipment OEMs, the carriers incorporate Semi standard kinematic couplers. They are free of microvoids and porosity and have no pins, screws, or dovetails that can loosen or trap contaminants. They exhibit virtually no degradation from harsh chemicals such as aqua regia, sulfuric acid, hydrochloric acid, and ammonia, and they can be rinsed in DI water. Engineering Plastics Inc., Westboro, MA; ph 508/366-4425, [email protected], www.engineeringplastics.com.
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SOI wafers
The Smart Cut process produces thin film silicon-on-insulator (SOI) wafers for high-volume production. The Smart Cut SOI product, UNIBOND, has very good uniformity of the top SI film; BOX quality is identical to thermal oxide. UNIBOND wafers — 4, 5, 6 and 8 in. — have typical thickness of surface silicon of 1000Å to 1.5µm. SOITEC/USA, Peabody, MA; ph 978/531-2222, fax 978/531-2758, [email protected].
Configurable system software
EquipeSoft EFEM is a fully configurable system software package for equipment front-end modules. It allows configuration — via a GUI Wizard — of the number of loadports, the port type, alignment components, handling robot, and delivery stations, as well as fan-filter units, ionizers and lighting. Once configured, the system software controls manual and automatic wafer-handling, provides an industry-standard MMI, and a full complement of system features. EquipSoft EFEM provides full support for the 300mm software standards released by Semi. PRI Automation Inc., Billerica, MA; ph 978/670-4270 ext 3161, [email protected].
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Vibration isolation workstations
Series 1400 VIBRAPLANE variable-height vibration isolation workstations reduce fatigue and back stress. A smooth and quiet electro-hydraulic mechanism allows users to raise or lower the tabletops to levels that best suit their heights. The workstations are ideal for microscope use and for wafer probing, mask aligning, and other applications in which external vibrations adversely affect the operation of precision equipment. Kinetic Systems Inc., Boston, MA; ph 617/522-8700, fax 617/522-6323, www.kineticsystems.com.
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Pressure control valves
Series 64 control gate valves are designed for clean PVD applications and deliver both pressure control and pump isolation in one valve. Stepper motor and 3-position pneumatics versions are available. The Series 65 pendulum control and isolation valve is optimized for corrosive semiconductor processes where fast, almost particle-free control are required, in addition to high uptime and easy maintenance. The Series 61 butterfly control valve is well suited to pressure control applications where no isolation is needed. Completing the pressure control system are adaptive pressure controllers that feature optimized control commands for multistep plasma processes, fast set-up, and stable control. VAT Inc., Woburn, MA; ph 781/935-1446, [email protected], www.vatvalve.com.
High-temperature-resistant valves
The Diapragm Valve Type 315-HTR is highly suitable for flow control applications and is available in sizes 20mm through 63mm. It offers a "snap-on handwheel" for easy removal and installation, an optional lock, and a position indicator. The Zero Static Valve Type 319-HTR eliminates dead legs in ultrapure water systems and is available in 34 sizes from 20 x 20mm to 110 x 63mm in SYGEF-PVDF HP. The 319 is offered in b and s polypropylene for physical properties including strength, low weight, abrasion resistance, impact strength, and a wide operating temperature range. George Fischer Inc., Tustin, CA; ph 800/854-4090, [email protected], www.us.piping.georgefischer.com.
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Zirconium oxide-based oxygen analyzer
The CGA351 oxygen analyzer uses an advanced zirconium oxide sensor in combination with a new manifold assembly to ensure leak-free integrity and accurate measurement of oxygen content from percent levels to <0.1ppm. The sensor delivers a response speed of <1 sec for a 90% step change in oxygen concentration, making it highly suitable as a fast alarm for instantaneous notification of process upsets on high-purity, inert-gas processes. The only maintenance necessary is periodic single-point calibration with a calibration gas. The CGA351 is nondepleting, highly stable, immune to acid gases, and does not show false low readings. Its microprocessor-based electronics feature a universal power supply (90-265 VAC), one analog output (either 0/4-20 mA or 0-2 VDC), and dual alarm contacts. Panametrics Inc., Waltham, MA; ph 781/899-2746 or 800/833-9438, [email protected], www.panametrics.com.
Epoxy adhesives
EPO-TEK H20E epoxy adhesive is designed for applications that require heat dissipation. It has been tested and achieved a thermal conductivity as high as 29 W/M°K, making it comparable to solder and eutectic alloys. H20E is compatible with a variety of substrates, such as FR4, ceramics, lead frames, and flex substrates such as Kapton, Mylar and polyester. EPO-TEK's low cost and user-friendly characteristics will benefit producers of high-density packages. Epoxy Technology Inc., Billerica, MA; ph 978/667-3805, www.EPO-TEK.com.
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CVD silicon carbide
Highly pure CVD silicon carbide is a solid ceramic material that can be fabricated into components up to 700 x 700 x 20mm and custom tubes and liners. Low-resistivity-grade (<1 Wcm) ceramic components for wafer-handling equipment perform in applications where low resistivity, high temperatures (>1500°C), ultrahigh purity (>99.9995%), and chemical resistance (HF/HCl) are system requirements. This new CVD silicon carbide material is highly suitable for wafer-handling equipment that requires RF coupling, as in plasma etch, CVD and MOCVD. Rohm and Haas Co., Woburn, MA; ph 781/933-9243, [email protected],www.cvdmaterials.com.
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Semiautomatic die bonders
The Model 410 bonder features enhanced optics and mechanical movement, as well as a very stable platform, to achieve 2µm placement accuracy — important for R&D applications where versatile processing capabilities are needed. Model 860 Omni laser bonder can be configured to bond edge emitting laser diodes, VCSELs, and laser bars/arrays; flip chips involving gold, solder, adhesive, or stud bumping; or eutectic die. The bonder aligns and attaches die sizes from 0.006 in2 to 1 in2 with ±5µm placement precision. The low-cost Model 850 bonder is designed for flip chips, chip scale devices, and bare die in low-volume production and development project environments requiring accuracies of ±12µm. Semiconductor Equipment Corp., Moorpark, CA; ph 805/529-2293, www.semicorp.com.
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Low-voltage room ionization system
The Gemini low-voltage room ionization system offers high levels of performance and control through individually addressable ceiling emitter modules. Ion output and balance can be easily adjusted using either the system controller or a handheld infrared remote control. The "smart" system controller polls each emitter module to verify system operation. Under normal conditions, the LCD displays "System OK" to provide assurance that no alarm conditions exist. Ion output and balance can be adjusted for individual emitters or the entire group of emitter modules. Aerodynamically designed to minimize turbulence in unidirectional airflow, each module contains separate positive and negative emitter points with microprocessor control of ion output and balance. Modules are available with proprietary germanium emitters for ionization designed for ultraclean environments. The system has an output to link to computer-controlled monitoring systems. Simco Static Control and Cleanroom Products, Hatfield, PA; ph 215/997-0590, [email protected], www.simco-static.com.
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Chemical contamination filtration
While using standard-size filters common to previous generations of LithoGuard systems, LithoGuard 300 includes high-efficiency particulate filtration, allowing installation of the system in less-than-clean environments. With an ergonomic design giving easy accessibility to both chemical and particulate filters, the system offers high-efficiency, broad spectrum gas-phase contaminant protection for both processes and tools with a footprint <1 m2. Donaldson Co. Inc., Bloomington, MN; ph 612/887-3475, fax 612/887-3612, www.donaldson.com.
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72-point continuous gas monitor
Vertex, a new Chemcassette-based gas detection system, is a small-footprint, cost-effective multipoint continuous gas monitor that can monitor up to 72 points. Detection points can be located up to 400 ft from the instrument. Up to nine gas families can be included in each system. A state-of-the-art graphical user interface provides secure, easy-to-access monitoring controls and convenient, clear display of system performance through its 17-in. touchscreen display. Access to communication can also be made through a remote PC. Communication capabilities include LonWorks, DeviceNet, RS-485, isolated 4-20 mA, relays, and high-speed modem. Built-in redundancy of critical components helps ensure system reliability. Vertex can detect dozens of gases through the use of Chemcassette detection technology. Chemcassette tapes feature low-level sensitivity and fast response while providing physical evidence of gas releases. Dynamic gas calibration is not required on Chemcassette-based systems. Zellweger Analytics Inc., Lincolnshire, IL; ph 847/955-8200 or 800/323-2000, www.zelana.com.
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Recirculating chiller
An addition to the Kodiak line of recirculating chillers, the RC030 provides cooling capacity of 3000 Watts, or 7.5 K BTU/hr (20°C fluid out, 20°C ambient environment). The standard model comes with a brass 4.3 gpm positive displacement pump and has a compact footprint. It offers tight temperature control, maintaining temperature stability of ±0.1°C. Kodiaks are offered in five cooling capacities: 600, 1100, 2200 and 4500, as well as the new 3000 Watts capacity. All chillers in the Kodiak line feature a user interface that includes a completely digital, easy-to-program controller with a pressure signal bar readout, and all models are available with optional RS232 capability. Every Kodiak contains a robust, ozone-friendly refrigeration system with hot-gas bypass to extend compressor life. Lytron Inc., Woburn, MA; ph 781/933-7300, [email protected], www.lytron.com.
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Ozone membrane contactor
The Infuzor ozone membrane contactor is designed to enhance ozonated water for wafer cleaning. The module is a compact membrane contactor made entirely of fully fluorinated materials for the infusion of ozone and other gases into aqueous-based liquids. Water pressure is kept higher than gas pressure throughout the length of the module to prevent bubble formation and to maintain the diffusive flow of ozone. The module's PTFE membrane forms a thin, nonporous, gas-permeable layer on one side. The hydrophobic membrane eliminates wetting problems. Pall Corp., East Hills, NY; ph 516/484-3600 ext 6104, [email protected], www.pall.com.
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LPCVD silicon nitride trap
The Vapor Sublimation Trap, which has heaters at the inlet, removes contaminants from the vacuum process system before they reach the pump. It catches ammonium chloride by-products that are generated in the LPCVD silicon nitride process. The two-stage design traps effluent by-products in the first stage and particulates in the second stage. This increases system yield by reducing the chance that by-products will backstream into the reaction chamber and contaminate the system. The trap also collects the by-products before they contaminate the vacuum pump, lengthening pump life. HPS Products MKS Inc., Boulder, CO; ph 800/345-1967 or 303/449-9861, www.mksinst.com.
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Industrial frame grabber
PC-CamLink is an industrial frame grabber based on the Camera Link interface standard for digital cameras. It combines a half-slot PCI-bus frame grabber — featuring this company's high-speed image transfer architecture — with the new Camera Link standard. Together they form a flexible interface for line and area scan cameras that supports high-speed, high-resolution machine vision applications such as 300mm wafer scanning and surface inspection. PC-CamLink has 16 MB of on-board memory for buffering image data between the camera and host PC system. This feature allows image transfers over the PCI bus that are up to 10 times faster than competing systems, allowing for simultaneous acquisition and processing of data. The on-board memory also ensures that image information will not be lost during transfer to system memory. Coreco Imaging Inc., Bedford, MA; ph 781/275-2700, [email protected], www.corecoimaging.com.
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300mm analytical probing system
The 9000 series, 300mm analytical probe station includes features such as MicroTouch knobs that permit "hands-on" control of the stage. The user can then use the joystick control or optional software control without special programming commands — the prober knows its location regardless of the navigation method used. The manual loading tray is a standard feature, providing manual loading and unloading of samples from a single wafer-loading tray to the probe station chuck. A complete auto wafer-handling system is available as an option. The benefit of either method is decreased risk of breakage and/or contamination of the wafer. The 9000 series can be configured for thermal applications by using the 300mm chuck and the H1000 thermal system. Specifically designed for use with analytical probe stations, these thermal chucks support testing from -65 to 300°C. The cooling rings on the thermal chuck prevent heat damage to the internal workings of the probe station and reduce the risk of injury to personnel. Also, the Kinematic mounting of the chuck minimizes expansion of the chuck up and into the probes or probe cards during heating cycles. Micromanipulator Co., Carson City, NV; ph 800/967-4358 or 775/882-2400, [email protected], www.micromanipulator.com.
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Feedthroughs/actuators
ChamberLink combines a rotary feedthrough and precise harmonic drive servo actuator in one stainless steel device. It provides high-powered, precisely controlled motion within a vacuum chamber. Because the device has no chamber-wall-penetrating shafts that require seals, vacuum leakage is averted. Two new sizes of the ChamberLink combination feedthrough and actuator, ChamberLink 14 and 32, offer higher torque capabilities than the original. Size 14 is rated at 40 in-lbs continuous torque at 70 rpm output speed and can provide accurate positioning for wafers and small cassettes in loadlock, transfer, and process chambers. The size 32 unit, rated at 500 in-lbs continuous torque, is suitable for turning indexing platens operating in vacuum process chambers. Harmonic Drive Technologies, Peabody, MA; ph 800/921-3332 or 978/532-1800, [email protected], www.harmonic-drive.com.
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Capacitance vacuum gauge
Model 720 capacitance vacuum gauge offers a 0-5 VDC or 0-10 VDC output that is linear with pressure and independent of gas composition. An accuracy of ±0.5% of reading is provided, as well as an optional accuracy of ±0.25% of reading. Accuracy of this transducer is assured with a wide compensated operating temperature of 0-50°C and temperature coefficients of ±0.005% FS/°C at zero and ±0.027% of Rdg/°C at span. Offered in a variety of vacuum pressure ranges from 2-150 kPa, 10-1000 torr, and 10-1000 Mb, Model 720 is configured with an industry-standard 9-pin D-sub electrical connection. A variety of vacuum pressure fittings is also available. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, [email protected], www.setra.com.
Heat exchanger system
This heat exchanger system, for use with deposition equipment, is capable of circulating Galden or HFE fluids at temperatures up to 140°C while removing 3Kw of heat. It features a magnetically coupled pump and this company's "zero clearance" seal system to ensure leak-free operation. Easy access to electrical panels and an internal drip tray make servicing easy. Systems are fully safety-certified for use in the semiconductor industry. Bay Voltex Corp., Livermore, CA; ph 925/606-6293, www.bayvoltex.com.