New Products
05/01/2001
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Compact wafer reader
The In-Sight 1700 wafer reader is a compact machine vision sensor that identifies and tracks wafers through the manufacturing process. Based on this company's technologies for 2D matrix, alphanumeric and barcode identification, it combines advanced ID software, image processing, and image formation in a single package. The unit can be mounted horizontally or vertically, requires no mechanical adjustments, and can be integrated with a wide range of fab equipment, including wafer handlers, sorters, probers, metrology tools, laser markers, and ion implant systems. Default recipe screens enable users to set up ID applications quickly and easily with no programming. In-Sight 1700 uses advanced OCR, 2D matrix, and barcode recognition algorithms to read softmarked, super-softmarked, or hardmarked Semi standard codes on the front or backside of a wafer. These algorithms work in conjunction with the unit's fully digital, on-board image formation system, allowing it to read codes even when they have been degraded by CMP, copper metalization, oxides, or other process defects. In-Sight 1700 is equipped with a complete wafer ID software library pre-installed. With built-in Ethernet networking capabilities, multiple wafer readers can be easily linked throughout the fab. Cognex Corp., Natick, MA; ph 508/650-3140 or 508/650-3000, www.cognex.com.
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Low-k dielectric for 100nm designs
SiLK porous spin-on film, with k = 2.0, will allow the continued miniaturization of ICs, improving speed and performance. Reduction of k values below 2.5 can only be achieved by introducing porosity to lower the material's density. For integration reasons, pore size must be <20nm for 100nm technology - about a fifth of the smallest printed feature. Even more critical is creating a closed pore system, with unconnected voids of equivalent size. For robust integration, the pores must also be uniformly distributed throughout the dielectric at a volume low enough to maintain adequate mechanical properties. SiLK resin requires a smaller pore volume to attain ultralow-k values than inorganic films, contributing to higher mechanical integrity, better film stability, and easier integration. The mechanical properties of the new porous SiLK resin have performed well in various evaluations, including CMP of bulk films, exhibiting two or three times the toughness of competitive materials with comparable dielectric constant. Dow Chemical Co., Midland, MI; ph 800/441-4369 (Ref. E#1-316G1), www.silk.dow.com.
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Advanced passivation process
The ChipSeal advanced passivation process provides wafer-level protection for ICs, offering bare die reliability that rivals traditional ceramic packaging at a much lower cost. The process uses a spin-on coating of FOx flowable oxide to planarize the wafer surface, followed by a top coat of silicon carbide - produced from this company's Z3MS CVD dielectric - to seal it. Openings to the IC contacts are then etched through both layers. The contact pads are covered with a metal barrier of titanium tungsten and then with gold, sealing the etched openings and providing very good electrical contact to the next level of interconnect. All processes are accomplished using standard chipmaking equipment. Dow Corning Corp., Midland, MI; ph 517/496-6000, fax 517/496-8026, www.dowcorning.com/electronics.
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Accurate wire sawing
Unlike other cutting media, Green Silicon Carbide (SiC) eliminates trailing fines in wire saw applications. The 99.5%-pure material reduces waste by curtailing warpage and total thickness variation. Green SiC is highly suitable for sawing silicon, quartz, and gallium arsenide. Its chemistry and sizing are closely controlled to meet the exact requirements of the customer, and it is manufactured to JIS, ISO, and FEPA standards. Electro Abrasives Corp., Buffalo, NY; ph 716/822-2500 or 800/284-4748, fax 716/822-2858, [email protected], www.electroabrasives.com.
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Integrated gas components
IGC II modular and integrated gas components enable chipmakers to develop streamlined gas delivery systems with a more compact size and footprint. They include modular substrates, manifolds, mounting components, and assembly hardware. The system is built around modular and surface mount technology, featuring channel-type substrate and manifold sections, and the components are easy to assemble and maintain. The smaller footprints of gas sticks built with IGC II technology allow sticks to be located closer to the chamber, reducing pneumatic lag and process time. The components are Semi-PR3.1-compliant and can accept any Semi-PR3.1 surface-mount component. This open architecture allows a variety of components - including this company's diaphragm valves and set-pressure regulators, as well as other compatible valves, regulators, transducers, filters, and mass flow controllers - to be used on a single gas stick. Swagelok Co., Solon, OH; ph 440/349-5934, [email protected], www.swagelok.com.
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Chemical filtration material
Purafilter, available in a variety of sizes and depths, is designed for retrofit within makeup air-handling units, recirculation air-handling units, and fan filter units. The new filter material suspends Purafil Select potassium permanganate media particles in a bicomponent fiber matrix without the use of adhesives. This gives the filter superior efficiency and gas removal capacity. A layer of particulate filtration can also be added, creating a single filter that offers control of both gaseous and particulate contaminants. The material is stiff, robust, pleats well, and has a low pressure drop - important in cleanroom applications. Use of potassium per-manganate gives Purafilter up to 10 times the capacity of activated carbon-type filters. Multiple chemical filtration media can be added to the matrix to achieve the broadest range of gas-phase contaminant removal. Purafil Inc., Doraville, GA; ph 800/222-6367 or 770/662-8545, meredith_christiansen@ purafil.com, www.purafil.com.
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High-speed in-line dispensing
The Millennium M-2022 dispensing system's high-capacity conveyor technology maximizes machine utilization for processes such as underfill and dam and fill. It increases throughput by masking flow-out for underfill dispensing. System-wait time is eliminated, since underfilling the components in one lane can be achieved while fluid flows in the other lane. SMEMA-compatible asynchronous control allows each lane to be moved and controlled independently. Depending upon the application, a throughput increase up to 80% can be achieved by eliminating conveyor transport time, as well as the time the dispensing system must wait for flow-out. The M-2022 comes standard-equipped with capacity to support six heaters and lift tables operating independently. Three stations are available for each lane: pre-heat, dispense, and post-heat. The six heat stations ensure precise and consistent substrate heating at specified ramp rates for reliable fluid dispensing. Asymtek, Carlsbad, CA; ph 760/431-1919, [email protected], www. asymtek.com.
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Optical inspection for wire bond
Viscom 6053BO gives highly precise and reliable fully automated optical inspection to wire bonding, allowing users to boost wire bond inspection speed to 100% in-line without compromising inspection reliability. High-resolution cameras capture digitized images of bond wires and connections and analyze them for defects using a powerful computer system. Sophisticated analysis software automatically recognizes a range of bonding defects, from coarse faults (such as detached bond connections) to possible shorts in bond wires. These operations are performed at such high speed that 100% in-line inspection is easily achieved. Inspection samples, maintained in a "library," are available for every type of bond connection and for various wire and pad geometries. These samples contain precise specifictions of the algorithms and parameters needed; the library can be optionally expanded. The heart of the 6053BO is its sensor head, which inspects the bond positions from above. A dual-axis gantry system moves the sensor head over the inspection target. The sensor head is fitted with a variety of sensor modules, which are adapted to the individual inspection procedure. Module resolution is also application-oriented and begins at 3.5mm. Viscom USA, Atlanta, GA; ph 678/966-9835, [email protected], www.viscomusa.com.
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Aluminum platen heaters
These bake and chill platens - for wafer-processing applications - use a high-density, mineral-insulated heating element, formed to provide a specific heat profile and cast onto 99.7% pure aluminum. Cooling tubes of various materials can be run systematically with the heat pattern for uniform chill requirements. Temperature uniformity across the surface of the platens can achieve ±1% of the maximum operating temperature. Zero porosity of the castings offers increased operating temperatures to 450°C (850°F). Helium leak test specifications of 1 x 108 cc/sec are performed to guarantee the integrity of the complete assembly. Precision machining of the platens using CAD/CAM/CAE and CNC manufacturing techniques maintains a flatness tolerance of 0.0005 in. and ensures exact location of vacuum grooves, channels, and hole patterns. The platen surfaces can be supplied with a hardcoat anodized finish and shipped chem-cleaned and packaged to cleanroom specificatons. Variations on these platen heater designs are typically found in PVD, CVD, etch, strip, photolithography, and probe test equipment. Durex Industries, Cary, IL; ph 847/639-5600, [email protected], www.durexindustries.com.
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Air bearing spindles
This range of air bearing spindles has been designed to address the requirements of manufacturing and processing 300mm wafers. They include: high stiffness linear air bearings for single 300mm wafer ion implantation under high-vacuum conditions; wafer backgrinding spindles with high-power motors in both single- and dual-shaft configurations; high-speed edge and notch grinding spindles with integrated electric motors for increased productivity and improved surface finish; and 60,000 rpm brushless DC motor dicing spindles with improved mounting stiffness and higher motor torque. Westwind Air Bearings Ltd., Poole, UK; ph 44/1202-627200, [email protected].
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Active anti-vibration system
The MOD active anti-vibration system eliminates low-frequency vibrations for many types of semiconductor instrumentation. For larger instruments such as electron microscopes, which often present problems to users who wish to retrofit a vibration solution, the MOD Sandwich comprises multiple sets of sensors and actuators (as many as necessary to support the instrument - 150kg/set) and a bottom and top plate casing system. The Sandwich is then essentially a full active vibration isolation platform that is only about 14cm (6 in.) high. A special device for lifting large instruments aids installation, raising the instrument to the required height without causing disconnection. The Sandwich is then slid underneath, and after the system is set up and turned on, no further maintenance is needed. Halcyonics GmbH, Goettingen, Germany; ph 49/551-999-0620, [email protected], www.halcyonics.de.
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Atomic emission endpoint detection
This windowless discharge lamp, operated with helium as a carrier gas, provides a clean background that allows the introduction of secondary or sample gases from process chambers or other sources, permitting the analysis or monitoring of gaseous nonmetals - fluorine and chlorine, for example. Applications include endpoint determination of CVD chamber cleaning. The detection of emissions anywhere from 30nm to the visible spectral region is made possible when coupled to one of this company's vacuum monochromators with suitable vacuum pumping. Scanning monochromators monitor discrete emissions, and array detector-based systems are useful for broad range detection. Endpoint detection systems are configured as turnkey systems or as stand-alone components. McPherson Inc., Chelmsford, MA; ph 978/256-4512 or 800/255-1055, [email protected], www.mcphersoninc.com.
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Portable leak detection unit
The HELIOT 300 Series line of high-sensitivity, portable leak detectors offers a new vacuum design (select free flow test mode) that meets all the requirements for finding gross, medium and very small leaks. It provides ultra-clean detection when equipped with an optional dry backing pump, in place of the traditional, oil-sealed rotary vacuum pump. The unit is fully automatic in all operating modes and has many configuration options to meet a range of testing requirements. HELIOT 300 can test for leaks ranging from 10-11 to 10-3 atm.cc/sec in large and small objects, such as vacuum chambers, valves, pumps, heat exchangers, tanks, piping and tubing assemblies - in any environment, including cleanrooms. ULVAC Technologies Inc., Methuen, MA; ph 978/686-7550, [email protected], www.ulvac.com.
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Zero-backlash gearheads
These new PSA-G harmonic drive gearheads are suitable for semiconductor robotics applications and can be supplied with low outgassing or non-lithium grease. They are available in standard gear ratios, ranging from 50:1 to 100:1, and are designed to handle high axial and overhung loads. Maximum radial shaft loading of the gearheads is up to 52kg (115 lbs), and they are very compact, measuring 33mm (1.3 in.) in diameter and 50mm (2 in.) in body length. Harmonic drive gearing is a precise, zero-backlash speed reduction system. The result is a transmission that delivers an accurate angular position and a very high input-to-output ratio (50:1 and up). Harmonic Drive Technologies, Peabody, MA; ph 800/921-3332 or 978/532-1800, [email protected], www.harmonic-drive.com.
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Jonathan Ashford
Solid State Technology
98 Spit Brook Road · Nashua, NH 03062
fax: 603/891-0597
e-mail: [email protected]