New Products
04/01/2001
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DUV step-and-scan system
The PAS 5500/800 deep-UV step-and-scan system achieves 120nm resolution by means of a 0.80 numerical aperture. With throughput of 115 wafers/hr (200mm), it is designed for high-volume processing of the most advanced current ICs and for R&D applications for next-generation products. The system incorporates Carl Zeiss' Starlith 800 lens. Advanced illumination options are available that build upon the AERIAL II illuminator design and that offer greater flexibility to increase contrast for pattern-specific applications as the industry migrates to low-k1 imaging in production. The 5500/800 features the ATHENA wafer-alignment system in combination with reticle alignment using the actinic wavelength (reticle blue alignment), allowing overlay accuracy of 20nm in a single machine and 30nm from machine to machine. A new wafer-leveling system substantially enhances the leveling process latitude, resulting in focus margin improvement. Using the PAS system architecture, the new tool is readily field-compatible with users' current installed bases of this company's DUV and i-line equipment. It matches seamlessly with the PAS 5500/400C i-line scanner, further improving cost efficiency through the use of mix-and-match manufacturing strategies. ASML, Veldhoven, The Netherlands; ph 31/40-268-3938 or 480/383-4475, www.asml.com.
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Transparent film metrology
The S200/300 systems, with MatrixMetrology, are designed for CMP, etch, diffusion, and thin-film deposition. They combine small-spot ellipsometry, microspot reflectometry, and software optimized for each application. The systems deliver the robust pattern recognition, measurement speed, and thin-film measurement performance for these applications while providing a cost-effective solution for each process. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, fax 973/691-5480, www.rudolphtech.com.
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SOI wafer inspection
The AW-2000 is an automated system that creates images through bonded SOI wafer pairs in order to find voids, microvoids, and other internal defects. Based on this company's proven C-SAM acoustic imaging technology, the new system uses a robot arm to remove a wafer from an incoming cassette and position it for acoustic imaging. The very high-frequency ultrasonic transducer used for scanning wafers detects microvoids as small as 5µm in diameter. The AW-2000 can handle wafers up to 200mm, and it finds defects in wafer pairs joined by direct bonding, glass frit bonding, and epoxy bonding. After acoustic imaging, system software classifies each wafer according to user requirements, and the robotic arm places the wafer in the appropriate outgoing cassette. Stored acoustic data contain the information needed to apply accept
eject criteria to individual devices after the wafer is diced. AW-2000 inspection can be performed after initial bonding, after annealing, and after thinning. After metalization, the acoustic image is typically overlaid with a wafer map in order to relate local defects to specific devices on the wafer. Sonoscan Inc., Elk Grove Village, IL; ph 847/437-6400 ext 240, [email protected], www.sonoscan.com.
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Substrate mapper
The Optium substrate mapper quickly identifies known good areas of filter substrates for maximum yield and minimum downstream processing of out-of-spec parts. The high-precision, automated system qualifies thin film process recipes by mapping filter performance as early as possible — at the substrate level. Incorporating this company's advanced signal analysis with a high-performance tunable laser diode source and an industry-standard, multichannel optical multimeter, the Optium classifies filter zones according to user-definable wavelength and signal quality criteria. Flexible analysis software allows mapping of transmission and reflection characteristics, as well as phase-dependent loss. Optional machine vision and an integrated database capture and store absolute locations of good areas, which can then be converted for use at subsequent dicing operations. Veeco Instruments Inc., Tucson, AZ; ph 520/741-1044, [email protected], www.veeco.com.
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Overlay metrology tool
Designed for both current and future requirements, the Archer 10 features coherence probe metrology, which takes 3-D measurements of overlay targets, as compared to the 2-D measurements taken by other overlay metrology systems. It also incorporates new Adaptive Noise Reduction Algorithm (ANRA) focus methods, which allow overlay measurements over low-contrast targets. Along with improved optic lenses, these enhancements provide up to a 30% increase in precision, to within 2nm. Throughput is 150 wafers/hr (200mm) and 120 wafers/hr (300mm). The Archer 10 includes automated recipe set-up and an easy-to-use Windows NT platform, which can reduce the training time needed to operate the tool from 14 days to three days. It also has a roadmap in place for integration with this company's yield-management products, including advanced process control software, recipe data management, KLASS stepper analysis and Klarity ACE root cause analysis software, VARS images storage, and iSupport remote assistance and tool maintenance. KLA-Tencor Corp., San Jose, CA; ph 408/875-5473, [email protected], www.kla-tencor.com.
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DeviceNet I/O controllers
The CDN57X is the first in a family of optically isolated, high-density DeviceNet I/O controllers. It offers a mix of analog and digital interfaces driven by requirements for OEMs and is targeted to a wide range of OEM process tool manufacturers that need industrial networked solutions. The tool uses a base board that offers 24 digital I/O points, an optically isolated ODVA SemiSig-compliant DeviceNet interface, and power distribution. Standard features include on-board thermal monitoring, status LEDs on all digital I/Os, bus and I/O power monitoring, and rotary switch settable MacID and baud rate settings. MKS Instruments Inc., Riverside, CA; ph 909/686-4211, fax 909/686-4122, www.mksinst.com.
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Single-wafer lift-off system
The M6000L metal lift-off cluster system is a single-wafer tool that allows higher process control than existing batch methods. Single-wafer processing eliminates errors in device manufacture by preventing metal redeposition back onto the wafer, which can be a problem with batch processes. Single-wafer dry in/dry out processes also allow improved process control and tuning to accommodate various metal and resist film stacks. Metal lift-off can be used to create 3-D metal interconnects surrounded by air — air bridges — that use the inherent low-k value of air over other dielectric materials. Metal lift-off processes also allow the deposition/patterning of materials such as Au, Ta and Ti, which are not easily etched using traditional plasma or wet chemical processes, and can do so without damage to the substrate. The technology is particularly suitable for production of high-frequency devices, addressing the special needs of the GaAs, optoelectronics, and telecom markets. The M6000L, which has a footprint of ~1200 x 1200mm, complements this company's existing exposure tools, coat/develop clusters, flip chip bonders, and high-frequency prober solutions. Karl Suss, Munich, Germany; ph 802/244-5181, [email protected], www.suss.com, www.suss.de.
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Processed wafer defect inspection
QuickSilver is a surface defect inspection system for the identification and automatic classification of such flaws as passivation voids, scratches, and debris on wafers, post-processing and prior to bumping. The system, which detects and classifies defects as small as 1µm, is a high-speed optical instrument based on a TDI camera that provides 100% inspection of all die on every wafer at production rates. Inspection equipment that is used to detect defects in front-end wafer processing is too slow for use in back-end inspection and has unnecessarily high resolution (which is costly). QuickSilver, which continuously scans wafers under constant illumination, is optimized for finding and classifying defects relevant in the last phase of wafer production. The system is supported by the QuickLook workstation, which allows detailed analysis and comparison of defect data by organizing and presenting wafer maps, defect maps, measurement files, and images from one or multiple systems. Process trends and problems can be readily identified by displays and graphs that QuickLook can create from QuickSilver inspection data. Electroglas Inc., Corvallis, OR; ph 541/738-2200, www.electroglas.com.
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Recirculating wet scrubbers
The GP recirculating wet scrubbers remove water-soluble gases, condensable gases, and reaction by-products from process exhaust streams. Application-specific systems are available for metal etch, PECVD nitride and epitaxy. The GP line includes: the W-Series for low vapor pressure, water-soluble gases; the R-Series for chemical reaction of acid gases; and the D-Series for chemical reaction of base gases. Hot gas-tolerant inlets are available for use with this company's temperature-management systems on the ducts entering the scrubber to reduce maintenance requirements. In addition to process chamber applications, GP wet scrub models are available to 1500 cfm for wet chemistry applications. These models are suitable for exhaust management atmospheric process tools such as spray acid tools, wafer-cleaning tools, exhaust hoods, and tube cleaners. Models are available with either acid or base dosing for enhanced performance. The GP scrubbers readily achieve removal efficiencies of >99.9%. High-volume design ensures high-efficiency scrubbing with minimum flow resistance to 1800 cfm. The GP scrubbers are fully Semi S2-93-compliant. BOC Edwards, Wilmington, MA; ph 800/848-9800 ext 3487, [email protected], www.bocedwards.com.
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Wafer surface preparation
The Spectrum is an advanced batch wafer surface preparation platform that provides a range of cleaning, etching, and stripping processes featuring advanced spray cleaning or a combination of spray and immersion processing. It processes multiple lots, 150, 200 and 300mm wafers at a time. Designed for high-volume manufacturing, the small-footprint tool incorporates advanced software for precise, repeatable and reliable control of the manufacturing process. The Spectrum Solvent tool provides precise process control solutions for both FEOL and BEOL manufacturing. The Spectrum Acid features spray processing for high-throughput wafer surface preparation, and the Spectrum E incorporates a surface-tension-gradient-dry capability. Semitool Inc., Kalispell, MT; ph 406/751-6325, [email protected], www.semitool.com.
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Wafer temperature analysis
Thermal MAP 3 is a real-time wafer-temperature data acquisition, logging, and analysis system. Thermal data can also be imported from this company's portable Thermal Track 4 for advanced analysis. The system includes a Windows 2000 laptop and features enhanced graphical analysis software; the enhancements to the software allow comparisons of data from different tools or different points in time to uncover tool-to-tool temperature profile differences or tool drift over time. Thermal MAP 3 acquires, records, and displays temperature profiles, process system sensor readings, and operating conditions in situ during photolithography, plasma processes, RTP, CVD, and most other wafer-fabrication processes. Thermal data is collected from SensArray Process Probe wafers, which are instrumented with temperature sensor arrays. The new software automatically detects and reads all SensArray data-acquisition systems and types of thermal sensors. Temperature data is measured and recorded from wafers instrumented with thermocouples, resistance-temperature detectors, or fiber optic elements. The software is used for equipment and process characterization, troubleshooting, and tool thermal management. SensArray Corp., Fremont, CA; ph 510/360-5600, [email protected], www.sensarray.com.
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Tape-and-reel system
The DT-8000 high-performance tape-and-reel system provides ultra-safe, high-throughput inspection and handling of SOIC, SSOP, TSSOP, MSOP, and similar devices. It accepts devices in tube or magazine and outputs to tube or tape. Damage-free device transfer is ensured by proprietary Drop-Point technology, in which a gravity-assisted arm moves each device into tape in a single, unidirectional motion, eliminating torsional forces and the risk of damage to leaded devices. Also, the system does not allow devices to come into contact with one another after inspection, further reducing the danger of device damage, misalignment, and system jams. The DT-8000 features an advanced vision system, the AVS-4000, which inspects for lead quality, marking, and orientation, as well as providing complete camera-based 3-D measurement of lead and average plane coplanarity, terminal dimension, true position span and spread error, pitch, width, and standoff. Robotic Vision Systems Inc., New Berlin, WI; ph 520/297-2621 or 800/669-5234, www.rvsi.com.
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Thin-film metrology tool
The JVX 5200 thin-film metrology tool is based on advanced x-ray technology and measures film thickness, density, and roughness, as well as elemental concentrations. Films can be single- or multilayer, metal or dielectric, single-crystal, poly-crystal, or amorphous. Thickness measurements have »-level accuracy and precision, allowing ultrathin layers to be characterized. Combined techniques extend the range of metal film thickness measurement from » to µm. The 5200 has applications to both front- and back-end processes. Multilayer stacks and ultrathin layers can be characterized. Buried layer metrology allows ultrathin interfacial layers to be resolved. The tool characterizes metals (Cu, Ti, Al, Ta, W, alloys, etc.), dielectrics (oxides, nitrides, poly, etc.), silicides (WSix, TiSix, CoSix, NiSix, etc.), SiGe, ONO, SION, SIRN, and more. It detects buried metal voids, examines post-CMP dishing and oxide erosion, determines film uniformity, analyzes solder bump composition, and investigates individual die with DAM (Device Area Metrology). The 5200 can accommodate 150, 200 and 300mm wafers with open cassette and SMIF configurations. Stand-alone and through-wall designs are available. Jordan Valley Semiconductors Inc., Austin, TX; ph 512/973-9229, info@jordanvalley semi. com, www.jordanvalleysemi.com.
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Quiet fan filter unit
Ideal for use in cleanrooms, the MAX8000EQ FFU Ceiling Module attains 48 dBA, the lowest noise level (dBA) currently available. The energy-efficient unit uses half the power of standard models, weighs 55 lbs, is slim-profiled for height-restricited areas, and is 99.99% efficient on 0.3µm and larger. A 1-in. pleated pre-filter is standard at no extra cost (30% ASHRAE). Liberty Industies Inc., East Berlin, CT; ph 860/828-6361 or 800/828-5656, fax 860/828-8879.
DUV antireflective coatings
These three new antireflective coatings —DUV52, DUV54 and DUV64 —have been designed for use in DUV (248nm) photolithography processing. Both 52 and 54 are high planarizing materials developed for dual damascene applications; they have been demonstrated at sub-0.13µm design rules. Both formulae are compatible with a wide range of resist types. DUV64 is an advanced antireflective coating designed for faster throughput. Due to its superior optical and coat qualities, 64 can be coated considerably thinner than traditional BARCs and has demonstrated etch rates more than twice as fast as traditional BARCs. Brewer Science Inc., Rolla, MO; ph 573/364-0300, sjones@ brewerscience.com.
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Controlled resistivity ceramics
These controlled resistivity ceramics are suitable for mechanical, chemical, or vacuum applications that require controlled electrical conduction or static charge dissipation. They feature metallized, brazed, or bonded assemblies. To suit specific user needs, the ceramics are manufactured in a range of insulating and controlled resistivities. To ensure quality, assembly and packaging take place in a cleanroom. Morgan Advanced Ceramics, Munich, Germany; ph 49/89-416098-0, fax 49/89-416098-41, www.morganadvancedceramics. com.
Liquid leak detector
The FD-F70 fiber optic sensor provides a very reliable, safe means of detecting the smallest leak. A specially designed sensing head uses the capillary phenomenon of liquids to sense the presence of liquid. By using fiber optic sensing, the sensor offers an explosion-proof design, and the fiber cable has also been protected with a PDF (Teflon) coating to provide a high degree of chemical resistance. The FD-F70 employs a fail-safe design in which damage to the fiber optic cable gives the same indication as the presence of liquid. The sensing head is extremely small, so it needs minimal mounting space, and no replacement parts are required. Sunx Sensors-Ramco, Des Moines, IA; ph 800/280-6933, e-mail [email protected].
Differential pressure controller
The Intelligent Differential Pressure Controller (IDP) improves minienvironment and cleanroom operation by dynamically optimizing fan or exhaust performance. This can reduce contamination, improve process parameters, and lower energy costs. The IDP has the unique ability to adjust fan speed or exhaust dynamically in order to maintain a constant differential pressure. Applications include minienvironments, exhaust hoods, and tool airflow regulation. The pressure set-point, alarms, and all operating parameters can be configured locally using the control panel, or remotely from a computer or terminal. Alarms can be local or external, immediate or delayed. The IDP offers a variety of interfaces, including 0-5V, 4-20 mA, and 1-10kHz, which allow it to interact with almost any external device or system. Lighthouse Worldwide Solutions, Milpitas, CA; ph 408/945-5905, info@golighthouse. com, www. golighthouse.com.
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Vacuum gauges, controllers/pumping system
These vacuum gauges and controllers* have automatic gauge recognition as a standard feature. The gauge range includes Pirani, Pirani/cold cathode, and Pirani/hot cathode in various configurations. The Drytel 1025 oil-free vacuum pumping system** is a simple, one-switch, compact design that operatbetween atmospheric pressure and 10-5 torr. A maximum pumping speed of 16 cfm is highly suitable for small chambers, cryostats, and loadlocks. Alcatel Vacuum Technology Inc., Hingham, MA; ph 781/331-4200, fax 781/331-4230, [email protected]. com,* [email protected].**
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Heated chucks for semiconductor processing
Thermofoil heated chucks save weight and space while improving temperature uniformity. They are designed for such processes as lithography, CVD and PVD, dry etch, and stripping, in both 200mm and 300mm wafer sizes. Design options include polyimide insulated heaters bonded to aluminum chucks (to 260°C), mica insulated heaters sealed into welded chucks (to 500°C), and mica insulated heaters clamped between silicon carbide plates (to 600°C). Custom design options include profiled power for highly uniform temperature and integral sensors for accurate control. Hermetically sealed power connections are available for high-vacuum applications. Minco Products Inc., Minneapolis, MN; ph 763/571-3121, [email protected], www.minco.com.
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Hydrogen monitoring system
Designed to measure H2 concentrations at either ppm or percent LEL (lower explosive limit) levels, the PureAire Hydrogen Monitoring System monitors processes and applications where hydrogen is present. It provides a fast, repeatable response to hydrogen leaks without interference from other hydrocarbons, alcohols, or silicone. The system consists of a disposable sensor cell linked to a companion transmitter; it is available with either a 0-2000 ppm or 0-100% LEL measurement range. The sensor is capable of reliable operation in both oxygen-deficient and 100% RH atmospheres, it has a lower detectable limit <100 ppm, and it will operate for approximately two years under normal conditions. PureAire Monitoring Systems Inc., Rolling Meadows, IL; ph 847/788-8000, fax 847/788-8080, www. pureairemonitoring. com.
Ultrapure chemical pump
The air-operated Magnum 620 chemical pump handles flows up to 12 gpm (45 lpm) and features an ultrapure, completely nonmetallic design, including an all PTFE and PFA fluid path. It also features a free-floating, hub-less diaphragm that lasts >100 million cycles; a compact size of 6.5 x 7.7 in. for simple installation or retrofit into existing systems; a no-stall air control valve; and low maintenance with field serviceability. In contrast to its predecessor, the Magnum 610, the 620 contains no metal parts or elastomer O-ring seals, even in the air paths, and requires less maintenance. Trebor International, West Jordan, UT; ph 801/561-0303, [email protected], www.treborintl.com.
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High-purity pressure transducer
Model 217 Down-Mount "C" Seal pressure transducer is designed for installation on a modular "Block" gas stick or panel for monitoring of specialty gas processes in high-purity gas delivery systems and semiconductor process tools. Very good zero stability and long-term reliability is achieved through variable capacitiance sensing technology. The 217 has a Down-Mount "C" Seal pressure fitting and small swept sensor chamber, using VAR 316L SS electro-polished to 7Ra (10 max.) finish for contaminant-free operation and system purging. Every sensor is mass spectrometer helium leak tested to 1 x 10-9 ATM.CC/sec. Model 217 is available with 5VDC, 10VDC or 4-20 mA output with 0.25% of full-scale or 1.0% of reading accuracy. It offers pressure ranges from 0-25 psi to 0-3000 psi in gauge, absolute or compound pressure. Bar ranges from 0-7 to 0-200 bar are also available. There is a choice of 15 pin or 9 pin D-sub connector, 4 pin bayonet connector, or 6-ft multiconductor cable for electrical termination. Model 217 meets the latest revisions to Semi Standard 2787.1E. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, [email protected], www.setra.com.
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Air monitoring system
The Aries Roaming Air Monitoring System combines an industrial FTIR spectrometer with an 80-meter multipass gas cell to provide portable emissions monitoring. The cell enclosure is actually a removable bellows, allowing access to ambient air for direct on-site monitoring. The entire system is mounted on a rugged, wheeled cart and is battery-powered for complete mobility. Gases are readily detected at ACGIH's threshold limit values and OSHA's permissible exposure limits. Aries can detect, identify and quantify a wide range of key contaminants simultaneously in near real-time. AutoQuant software provides powerful calibration and analysis capability behind a simple operator interface. This company's comprehensive gas phase spectral library, Standards, contains high-quality reference spectra collected according to EPA protocol. MIDAC, Irvine, CA; ph 949/660-8558, [email protected], www.midac.com.
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Photoresist filter
The Chemdyne PS filter undergoes a proprietary process to minimize extractables levels for optimized filtration of antireflective coatings and DUV resists. The polypropylene membrane filter provides high flow rates and low pressure drops, reducing microbubble formation and helping ensure uniform resist coatings. The filter removes yield-reducing particulates and gel contaminants from these chemicals. It is manufactured in a Class 1000 cleanroom and is 100% integrity tested during manufacture. The Chemdyne PS is available in absolute ratings of 0.2, 0.1 and 0.04µm. Meissner Filtration Products Inc., Camarillo, TX; ph 805/388-9911, fax 805/388-5948, leads@ meissner.com.
Reduced-grain-size tantalum targets
These tantalum targets with reduced grain size are designed for advanced PVD barrier processes; they feature a low oxygen content and a high-strength diffusion bond. The targets have a grain size of <65µm with a preferred grain orientation, and an oxygen content that has been reduced to <50 ppm. This material has a 4N5 purity with low nobium content and is available for all leading PVD systems. The high-strength target assembly — >20,000 psi — uses this company's Prelude diffusion bonding technology. Tosoh SMD, Grove City, OH; ph 614/875-7912, [email protected], www.tsmd.com.
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Thin film characterization
The 9350-NT UltraGage characterizes thin film stress and wafer shape for both patterned and monitor wafers. It provides fast, high-resolution measurements in two dimensions, and it correlates with x-ray diffraction, which is the only direct measure of thin film stress. It is not sensitive to film type, reflectivity, or other optical reflections that may result from subsurface multilayer stacks. An off-line software package emables the 9505-NT to measure both local and global stress. The 9530-NT applies ADE-industry standard metrology to backgrind, etch and lap processes that reduce wafer thickness as low as 150µm. It is designed for production operations that demand high-performance metrology for equipment set-up, process qualification, and on-going process control of next-generation wafer-thinning processes. ADE Corp., Westwood, MA; ph 781/467-3500, fax 781/461-1575, www.ade.com.
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Hot plate accessory for spin coater
This precision drying/curing hot plate cures photoresists, epoxies, and other thermally cured or solvent-based materials applied to flat substrates such as spin-coated wafers. It is a useful accessory for this company's SCS line of portable precision spin coaters, which includes several bowl sizes, with chucks to suit various substrate sizes and shapes. The hot plate can be set to any temperature between 50 and 150°C and maintains the selected level with an accuracy of +/-1% across the entire working surface. It is operated with a single control, and a 4-digit LED display shows the hot plate temperature in either Celsius or Fahrenheit. A vacuum hold-down feature ensures intimate contact between coated substrates and the heating plate, for efficient and even heat transfer. Specialty Coating Systems, Indianapolis, IN; ph 800/356-8260 or 317/244-1200, www.scscookson.com.
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Manifold check valve
This thermoplastic manifold-type check valve is designed to prevent reverse flow while simplifying installation of multiple check valves. Flow "circuitry" can be specified by the user. In applications requiring multiple valves, the manifold design saves space, simplifies system design, and eliminates excess piping and fittings. Designed for highly corrosive and ultrapure liquids, single manifolds can be configured with up to six check valve diaphragms. Individual manifolds can then be daisy-chained to provide almost any number of valve orifices. Also, they can be customized to have a specific number of inlets and outlets, with flow circuitry determined by the application. For more specialized needs, the manifold can have other types of valves, including actuated valves, built in. Plast-O-Matic Valves Inc., Cedar Grove, NJ; ph 973/256-3000, fax 973/256-4745, www.plastomatic.com.