Proof of concept for OAI

02/01/2001

PCTF technology catalog
This catalog describes plated copper on thick film (PCTF), a proprietary manufacturing process that combines patterned copper-plated images with air-fireable thick films on ceramics for making metallized substrates, chip carriers, and packages. Special features of the technology include thick plated copper (0.001-0.010 in.); fine thick film lines (0.002 in.) copper-plated through holes and castellations; solid metal plugs (thermal vias); multilayers; and integrated resistors, capacitors, and inductors. PCTF is compatible with common assembly methods, including SMD reflow solder; CSP; COB; epoxy and eutectic die attach; gold and aluminum wire bonding; ball grid arrays; and flip chip technology.
Remtec Inc.,
Norwood, MA
ph 781/762-9191
fax 781/762-9977
e-mail sales @remtec.com
www.remtec.com.