New Literature
02/01/2001
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PCTF technology catalog
This catalog describes plated copper on thick film (PCTF), a proprietary manufacturing process that combines patterned copper-plated images with air-fireable thick films on ceramics for making metallized substrates, chip carriers, and packages. Special features of the technology include thick plated copper (0.001-0.010 in.); fine thick film lines (0.002 in.) copper-plated through holes and castellations; solid metal plugs (thermal vias); multilayers; and integrated resistors, capacitors, and inductors. PCTF is compatible with common assembly methods, including SMD reflow solder; CSP; COB; epoxy and eutectic die attach; gold and aluminum wire bonding; ball grid arrays; and flip chip technology. Remtec Inc., Norwood, MA; ph 781/762-9191, fax 781/762-9977, e-mail sales @remtec.com; www.remtec.com.
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Data integration and analysis brochure
FabGuard Sensor Integration and Analysis System taps into the data generated by tools and process sensors in a fab, stores it in an SQL-searchable database, and analyzes it using physical models and statistical techniques. Specifically, the system provides run-by-run and real-time analysis for process control and fault finding; automated data collection and storage; data combined from multiple sensors; a single-user interface for all tool data; classification of faults; and an overall impression of tool/process health to aid preventive maintenance personnel. FabGuard can provide new insights on specific tools or an entire fab; applications include comparing tools to assist in tool matching and consistent processing; tracking process performance across multiple tools; and transferring recipes and models between fabs. INFICON Inc., East Syracuse, NY; ph 315/434-1100, fax 315/437-3803, e-mail [email protected], www.inficon.com.
SPM metrology reports
A series of three reports highlights scanning probe microscopy (SPM) semiconductor metrology applications. The first, a six-page report entitled Controlling Wafer Processing by Scanning Capacitance Microscopy, describes the use of capacitance and electrostatic force measurements to visualize ion-implanted dopant levels and 3-D device structure profiles, and to make quantitative measurements of oxide thickness. A second six-page report, Scanning Thermal Microscopy and Its Application in Thermal Characterization of Semiconductor and Advanced Material Surfaces, studies the thermal conductivity of gallium nitride on sapphire and diamond-like composite a-(C:H:Si:O) films on silicon. The third report (four pages), Measurement of Small Microroughness Differences Using High Amplitude Resonance Atomic Force Microscopy, describes how images obtained with a ThermoMicroscopes Explorer AFM were used to examine the microroughness of a silicon surface in order to evaluate a new semiconductor cleaning process. ThermoMicroscopes, Sunnyvale, CA; ph 408/747-1600, fax 408/747-1601, e-mail [email protected], www.thermomicro.com.
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High-purity filter and flow restrictor brochures
Six full-color brochures describe a line of high-purity porous metal filters, porous metal flow restrictors, Integrated Gas System (IGS) filters and flow restrictors, and utility line and bulk filters. GasShield PENTA filters, including PENTA-MV, PENTA POU, and PENTA HiFlow gas filters, provide high flow rates and low DP; IGS filters and flow restrictors are compatible with gas system interfaces in process tools, gas cabinets, and valve manifold box installations per Semi 2787; and bulk and utility filters provide filtration systems for utility lines inside the wafer fab, as well as flow streams at the gas pad. Mott Corp., Farmington, CT; ph 860/747-6333, fax 860/747-6739, e-mail [email protected], www.mottcorp.com.
Cleanroom furnishings mini-catalog
This catalog offers a sampling of a line of UltraClean stainless steel furnishings for cleanroom and laboratory. Included are work benches and accessories; work stations; changing room products; gowning room products; wafer fab carts and cabinets; controlled environment storage; and modular cleanroom shelving. Some items have been independently certified for Class 1 cleanroom use by the Ultraclean Products Approval Laboratory. Detailed pricing and application information is also included. Terra Universal Inc., Anaheim, CA; ph 800/767-0155 or 714/526-0100, fax 714/992-2179, e-mail [email protected], www.TerraUni.com.
Fluorochemical materials literature
Information on a line of fluorochemical materials used in semiconductor chamber cleaning and heat transfer applications is now available. The 3M Specialty Gas PFG-3480 brochure describes a perfluorocarbon (PFC) gas used in CVD chamber cleaning that can reduce net PFC emissions by 90% compared to C2F6. The 3M Novec Engineered Fluid HFE-7500 dielectric fluid brochure details a thermal management fluid with low global warming potential that helps reduce the environmental impact of wafer fabrication processes. Each brochure contains sections pertinent to its product, including physical properties, material specs, and health, safety, and handling for the PFG-3480; and environmental properties, materials compatibility, and regulatory status for the HFE-7500. 3M Co., Performance Materials Division, St. Paul. MN; ph 800/833-5045, www.3M.com.
Fab construction/expansion materials web site
This web site features detailed information on gases, chemicals, water, and wastewater treatment products necessary in the construction, expansion, and ongoing support of wafer fabs. Highlighted on the site are a front-to-back network of molecules, technical services, process support systems, and sustaining operations. The site also features current news and information on the joint venture company partners that founded it, Air Products and Chemicals Inc. and Kinetics Group Inc. In one area, customers and project teams can access schedule status, provide scope development, perform systems design, and use cost-tracking tools. TRiMEGA Electronics LLC, Santa Clara, CA; ph 610/481-3673 or 408/588-4431, www.trimega.com.
Etch temperature control brochure/data sheets
This literature series describes thermoelectric temperature control products for etch applications. Point-of-use (POU) systems provide temperature control for the wafer chuck and chamber walls; the line also includes systems that create process advantages for wet etch and track applications. POU system benefits include precise temperature control in real time; compact design; solid-state operation with only one moving part; low power usage; high tool up-time; and environmentally friendly operation. Noah Precision, an Advanced Energy Co., San Jose, CA; ph 408/281-7772, fax 408/281-7797, e-mail [email protected].
Metrology system literature
The SSM 6000, a metrology system that performs nondestructive electrical testing of wafers on the production line at speeds up to 60 wafers/hour, is featured in new literature from the manufacturer. Using a proprietary elastic probe to form a MOS gate in scribe lines and test areas to determine semiconductor gate and channel properties, the SSM 6000 can be used on gate dielectrics for all process nodes through 0.035mm technology. Solid State Measurements, Pittsburgh, PA; ph 412/787-0620, e-mail [email protected], www.ssm-inc.com.
Sensor isolation valve brochure
This four-page brochure contains applications, specs, dimensions, and prices for the HPS IDA vacuum valve. The part, a three-port, dual-body valve used in vacuum gauge isolation, consists of a pneumatic primary valve, a manual secondary valve, and a third port that allows the in situ calibration of capacitance manometers. MKS Instruments Inc., Vacuum Products Group, Boulder, CO; ph 800/345-1967 or 303/449-9861, www.mksinst.com.