New Products
02/01/2001
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Automated 300mm wafer inspection
This production-ready, I300I-compliant 300mm wafer inspection tool is fully automated and can run multiple wafer sizes without mechanical changeover, an important consideration for manufacturing environments scaling from 200mm to 300mm and for foundries where frequent wafer size changes are common practice. Based on the proven NSX series, the new system combines automated 300mm wafer handling, factory hardware, and software interface capabilities with the inspection technology of the NSX, providing chipmakers with a complete high-speed inspection solution for 300mm production. It is a dual loadport configuration with an optional secondary user interface for bulkhead mounting in bay and chase facilities. Optional SMIF capability and custom configurations are also available. Depending on specific application requirements, throughputs up to 43 wafers/hr (300mm) can be achieved. August Technology, Bloomington, MN; ph 952/259-1647, [email protected], www.augusttech.com.
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Soft solder die bonder
The 2007 fS is a high-speed, soft solder die bonder that is optimized to run standardized power packages, the TO-220 and D-Pak, at speeds up to 6000 units/hr, an increase of up to 40% over conventional equipment. The machine structure has been optimized in order to reduce significantly the number of dedicated parts, in turn reducing equipment lead times and speeding delivery and service. The new machine is based on the field-proven 2007 SSI die bonder, which is very well suited to use with soft solder packages — especially high-end applications — because of its soft solder pattern dispenser, the SSD. ESEC, Cham, Switzerland; ph 480/893-6990, fax 480/893-6793, [email protected], www.esec.com.
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Electrical characterization of conductive materials
Two high-sensitivity, high-resolution current sensing techniques — tunneling atomic force microscopy (AFM) and conductive AFM — are designed for electrical characterization of small conductivity variations in samples ranging from dielectric and ferro-electric films to nanotubes, conductive polymers and organic materials. Applications include identification of leakage paths, mapping of contaminants and components in composite materials, and differentiation of regions of high and low conductivity, such as for evaluation of thin film continuity and integrity. Conductive AFM allows measurement of currents in the range of 1pA-1µA, while tunneling AFM can map ultralow currents in the range 60fA-120pA at a lateral resolution better than 10nm. By simultaneously mapping the topography and current distribution, direct correlation of a sample location with its electrical properties is accomplished. Digital Instruments/Veeco Metrology Group, Santa Barbara, CA; ph 805/967-2700 ext 2295, fax 805/967-7717, [email protected], www.di.com, www.veeco.com.
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300mm spray cleaning tool
Storm 300 is a centrifugal spray cleaning tool for 300mm FOUPs, FOSBs and carriers. The system cleans and dries eight 300mm pods and doors in <30 min, and up to 30 cassettes, FOUPs or FOSBs in one hour. Features include eight DI spray manifolds with multiple PVDF nozzles; a brushless DC motor with digital control; centrifugal acceleration drying, coupled with ULPA filtered and heated clean fab air, for low cost of ownership; electropolished stainless steel and Teflon construction; and multiposition rotor and surfactant delivery for very high throughput. Semitool Inc., Kalispell, MT; ph 406/751-6325, [email protected], www.semitool.com.
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Particle size and concentration monitor
This battery-operated, hand-held instrument, the GT-521, is designed to quickly measure and document particle size and concentration. It measures particles from 0.3-5.0µm in 0.1µm increments, can handle concentrations as high as 3 million particles/ft3, and can store multiple readings for later downloading and analysis. The monitor also incorporates a sophisticated particle size discrimination technology that permits counting of only a particular particle size. It is suitable for cleanroom monitoring, ventilation system testing, filter testing, facility monitoring, process measurements, and other in situ particle monitoring applications. Particle size and concentration information are displayed on a large LCD readout and stored for later recall. The GT-521 can measure two particle sizes simultaneously and can be programmed for sample periods ranging from 6-999 sec. It can be field-configured as a benchtop unit, a field survey device, or as a sensor for process control, and it can be operated from either line current via the battery charger/power supply or off its own internal battery. Stored data can be downloaded to a computer via an RS-232 or RS-485 serial or output directly to a printer. PureAire Monitoring Systems Inc., Rolling Meadows, IL; ph 847/788-8000, fax 847/788-8080.
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Trap for metal etch
The HPS Metal Etch Trap removes byproducts from metal etch lines before they reach the dry pump. Aluminum etch systems use chlorine to etch aluminum on wafer surfaces; one of the byproducts of this process is aluminum chloride, which condenses and clogs the pump line. This reduces pumping speed and causes process variability and yield loss, and the downtime needed for cleaning the lines reduces throughput. The new trap efficiently traps condensable effluents that are generated by aluminum etch processes without reducing pumping speed. High trapping capacity extends the time between maintenance. Trap maintenance is straightforward: users replace a single, disposable trapping element rather than having to clean up many feet of vacuum line. It is not necessary to run heated lines all the way to the scrubber, lowering cost of ownership. MKS Instruments, Vacuum Products Group, Boulder, CO; ph 800/345-1967 or 303/449-9861, www.mksinst.com.
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Linear pump configurations
Three new configuration of the DP-3000 Series linear pump include an improved refill module that increases refill speeds, pump enhancements allowing faster priming, and a DP-3000-02 version that is configured with a low-speed gearbox for more precise dispensing. The pump is designed to provide high throughput for a number of dispensing applications, including flip chip underfill, IC encapsulation, thermal materials, and die attach adhesive. Specially designed to improve pump performance of underfill dispensing for small die or flip chips, the DP-3000-02 version can dispense small shot sizes of <5mg. It has greater control of flow rate when used for underfilling very small die or encapsulating TAB leads on CSP packages. The DP-3000's new chamber is well suited to high-pressure, small-needle-size dispensing and allows faster priming by using less material. The fast refill module significantly speeds the refill cycle for all encoded DP-3000 pumps and can be incorporated on all Millennium Series platforms. This company's linear positive displacement technology allows high-speed, repeatable dispensing regardless of fluid viscosity ot temperature. Asymtek, Carlsbad, CA; ph 760/431-1919, fax 760/431-2678, [email protected], www.asymtek.com.
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Lead-free packaging
ABLEBOND 2000 Series electrically conductive die attach adhesives are designed specifically for plastic ball grid array (PBGA) packaging and matrix-style BGA designs. The materials can withstand higher-temperature reflow for lead-free electronic assembly due to very low moisture absorption and optimized adhesion and stress. Engineered with a low modulus, they are suitable for a wide range of die sizes, up to 500 x 500 mil square. The 2000 Series adhesives, which exhibit very low bleed on solder mask surfaces (a critical requirement for BGA applications), offer very good dispensing characteristics and fast cure capability. Ablestik, Rancho Dominguez, CA; ph 310/764-4600, fax 310/764-2545, www.ablestik.com.
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Continuous CMP slurry monitoring
SlurryAlert is a cost-effective tool for monitoring changes in slurry particle size distribution (PSD) and percent solids. It samples undiluted slurry, eliminating waste stream creation and the problems caused by pH shock that are associated with other slurry measuring technologies. It detects changes in PSD from 0.03-5.0µm, and a complete analysis takes <1 min. SlurryAlert is compatible with multiple slurry types. With real-time monitoring of shifts in particle size distribution and percent solids, users can increase yield by preventing wafer scratching. SlurryAlert communicates via Ethernet or 4-20mA output for easy interfacing with PLCs and SCADA systems. Data collection, user-defined control limits, and alarming functions are some of the system's capabilities when it is used with Facility Net, this company's comprehensive software package. Particle Measuring Systems, Boulder, CO; ph 303/443-7100, fax 303/449-6870, [email protected].
Optical measurement system for material characterization
The Purged CAMS is a DUV spectrophotometer specifically designed for operation at 120nm to 250nm in a nitrogen-purged environment. The nitrogen purge compatibility eliminates the costs of vacuum system operation and reduces the potential for contamination caused by test materials outgassing under vacuum. The Purged CAMS permits characterization of pellicles, reticle blanks, lens materials, silicon wafers, and optical coatings for reflectance and transmission measurements from 120nm to 250nm. Acton Research Corp., Acton, MA; ph 978/263-3584, fax 978/264-0859, [email protected], www.acton-research.com.
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PVDF vortex flowmeter
The Hydro-Flow Model 2300 flowmeter uses proven vortex technology to measure flow. Constructed of PVDF material, it is well suited to monitoring ultrapure water, DI water, acids, solvents, and general water. The 2300 has no moving parts, giving lower maintenance costs and eliminating the possibility of fluid contamination. Hydro-Flow's microprocessor-based electronics and piezo-resistive sensor ensure high accuracy at low flows (as low as 0.5 ft/sec) with a 30:1 turndown. In-line sizes are from 0.5-8 in. EMCO Flowmeters, Longmont, CO; ph 303/651-0550 ext 10, [email protected], www.emcoflow.com.
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Compact chiller
Thermocube is a compact thermoelectric chiller suitable for providing temperature control to a laser or other small equipment. It cools, heats or cycles temperature between -5 and 50°C within 0.2°C of setpoint. It is 1 ft3 in size and can provide up to 400W (air-cooled) or 600W (liquid-cooled) cooling capacity at normal room teperatures. Solid State Cooling Systems, Pleasant Valley, NY; ph 845/635-5500, fax 845/635-8081, [email protected], www.sscooling.com.
Nondestructive electrical testing
The SSM 6000 is a metrology system that performs nondestructive electrical testing of wafers on the production line at rates up to 60 wafers/hour. It uses a proprietary elastic probe to form a MOS gate in scribe lines and test areas for immediate determination of semiconductor gate and channel properties. The system can be used on gate dielectrics for all process nodes through 0.035mm technology, and it requires no sample preparation or costly consumables. SSM 6000 systems include new data acquisition and optimization techniques to provide process control data at speeds compatible with device production processes. Solid State Measurements Inc., Pittsburgh, PA; ph 412/787-0620, e-mail [email protected], www.ssm-inc.com.
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Compact servo actuator
The AR servo actuator offers a compact integrated design, as the servo amplifier, servo driver and controller are integrated into a single unit. A self-contained electronic gear allows positioning data to be set easily without considering the machine's reduction gear ratio. Both absolute and incremental encoders are supported by the amplifier, and a built-in brake control function is synchronized with the actuator's on/off functions. Four types of AR servo actuator are available, with capacities ranging from 0.4 to 2.5kW, as well as seven types of gear ratio. Harmonic Drive Technologies, Peabody, MA; ph 800/921-3332, [email protected], www.harmonic-drive.com.
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DUV microscope
The DUV-250 real-time microscopic imaging system, with submicron resolution, combines this company's advances in optics and mercury arc illumination to achieve 25,000x magnification. Image resolution of <0.25µm is available in real time, and at low cost. The system typically operates at less than half the cost of traditional laser systems. Designed to fill a gap between visible light and scanning electron microscopy, the DUV-250 represents a major innovation for semiconductor pre-manufacturing and failure analysis, as well as for photomask inspection and mass storage component examination. TNP Instruments Inc., Carson, CA; ph 310/532-2222, fax 310/527-0740, [email protected], www.tnpinstruments.com.
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Bulk ammonia purifier
The GateKeeper Model 10M inert gas purifier removes ammonia in high-flow point-of-use applications. It delivers low cost of ownership because of its high capacity and regenerable nature. The portable unit removes moisture, oxygen, and other contaminants, is hydrocarbon release free, and requires no heat or power. Designed for high-purity nitride applications, Model 10M has shown film improvement in gallium nitride and barrier layer films such as TaN. In addition to ammonia, arsine, phosphine and silane can be purified. Outlet purity is <100 ppb for all contaminants removed or 99.9999999% pure gas. The 10M's body is constructed of 316L stainless steel, internally electropolished to 10 Ra, and it is cleanroom welded, tested and packaged for maximum contamination control. It is rated up to 1000 slm of NH3. The purifying medium does not contain organics that can outgas. Aeronex, San Diego, CA; ph 858/452-0124, fax 858/452-0229, jeffs@ aeronex.com, www.aeronex.com.
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Fine-grain copper targets
Fine-grain Forte copper targets are designed for use in advanced semiconductor PVD processes, providing very good film thickness uniformity and reduced particle generation. The new Forte copper fabrication process produces homogeneous fine-grain microstructures with an average grain size <20µm. The crystallographic texture is uniform throughout the target, giving good film thickness uniformity throughout target life. The copper alloy backing plate assembly is stiffer than current aluminum plates, reducing target deflection and particle generation even at high powers. The 6N purity Forte copper target is production-proven and available in various target configurations for sputtering equipment suppliers. Tosoh SMD, Grove City, OH; ph 614/875-7912, fax 614/875-0031, [email protected], www.tsmd.com.
Scriber/breaker systems
The GST-series is designed for the emerging semiconductor technologies that require a dry process to separate die effectively. This dry process solution is designed to work in cleanroom environments, eliminating the need for waste-water disposal, and improving the speed and efficiency of the dicing process. The scribe and break technique is ideally suited to high-precision wafer die separation for III-V substrates and materials, such as silicon-on-insulator. The GST-100 (for 4-in. wafers) and the GST-150 (for 6-in. wafers) are available with the standard Windows NT operating system. Dynatex International Inc./Macrotron, Santa Rosa, CA; ph 32/3-773-1990, [email protected]., [email protected].
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Ultrapure precision regulator
The Furon UPRP 1/4-in. precision regulator — available in either a manually actuated or pneumatically actuated version — is designed to deliver aggressive pure chemicals and DI water precisely while maintaining downstream pressure to a predetermined set level. It handles fluid temperatures up to 194°F (90°C) and is constructed from all virgin PTFE/Fluoroloy T and PFA wetted flow paths. It features a PTFE isolation bellows that protects system chemistry and, in the pneumatically actuated version, a secondary diaphragm that also protects the user's compressed air system. An optional integral leak detection port is available. All external surfaces are nonmetallic, and the UPRP is assembled and tested in a Class 100 cleanroom. Saint-Gobain Performance Plastics, Garden Grove, CA; ph 800/463-8766, fax 714/688-2614, www.sgppl.com.
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Wall-mounted CO2 analyzer
The CEA 266 is a wall-mounted infrared CO2 gas analyzer in a water- and dust-tight NEMA 4X enclosure with digital display readout. Ranges of 0-2000ppm, 0-5000ppm, 0-1%, 0-2%, 0-5%, 0-10%, or 0-20% are available. The sample gas is continuously drawn into the unit through a built-in air pump, and a self-draining water trap and dust filter are also provided. The 266 includes 0-5 VDC and 4-20 mA outputs and two user-adjustable alarms and contact relays. CEA Industries Inc., Emerson, NJ; ph 201/967-5660, fax 201/967-8450, [email protected], www.ceainstr.com.
Vacuum inlet trap
The MV Multi-Trap Model IC is a high-capacity vacuum inlet and exhaust trap for collecting solids in LPCVD, MOCVD, WCVD, and metal etch processes. It features water-cooled internal coils that provide more than 200 in.2 of surface area, along with two customizable filtration stages to condense and collect heavy particulates. Developed for production processes that generate large amounts of condensables, the trap has more than 500 in.3 of space to accumulate solids and keep production lines operating longer. The trap is constructed from all stainless steel and is offered with ISO-80 or ISO-100 flanges. The two filtration stages use five 4.5-in. replaceable elements: typically stainless steel gauze and micron-rated polypropylene. Other types are available. MV Products, Division of Mass-Vac Inc., No. Billerica, MA; ph 978/667-2393, fax 978/671-0014, [email protected], www.masvac.com.