Semiautomatic dicing systems

12/01/1998

Semiautomatic dicing systems

Two additions to the 980plus precision dicing line improve productivity by enhancing yield and process capability. The 984plus is designed for hard materials such as TiC, ceramics, glass, and sapphire up to 16-mm thick; and the 982plus is designed for thin semiconductors, sensors, and plastic CSPs. A robust structure and closed-loop positioning axes deliver very good cut placement accuracy, while advanced software and pattern recognition capabilities can be added for the most intricate dicing processes. For maximum flexibility, 2- and 4-in. spindles are available, allowing the use of blades of up to 5-in. diameter. A swivel cover gives easy access to the cooling block for fast blade replacement. Other options include a high-accuracy turntable, high-accuracy Z axis, noncontact height sensor, and broken-blade detector. Kulicke & Soffa Industries Inc., Willow Grove, PA; ph 215/784-6000, fax 215/659-7588, www.kns.com.