Wafer substrate flatness inspection

12/01/1998

Wafer substrate flatness inspection

The WYKO SFT4500 wafer substrate flatness inspection system is a noncontact instrument that improves process characterization of thin-film head wafer substrates by providing single- or double-sided measurement of global and site flatness across 4.5-in. square wafer substrates. Designed specifically for thin-film head manufacturers, the system determines global as well as user-definable local site flatness, such as Rz, Rt, slope, and radius of curvature, in a single measurement. Based on Fizeau plano interferometry and operating at 633-nm or 1.06-?m wavelength, the 4500 is gauge-capable for peak-to-valley tolerances as low as 2 ?m. The fully automatic system includes built-in robotic handling and full SECS/GEM communications, and features ergonomic design, software production interface, and operator safety shielding. Veeco Process Metrology, Tucson, AZ; ph 520/741-1044, fax 520/294-1799, www.veeco.com.