Multilayer sputter deposition

12/01/1998

Multilayer sputter deposition

The Nimbus 300 multilayer sputter deposition system is designed for high-volume/low-cost production applications. The 1.3 ? 2.5-m cassette-to-cassette system features three progressive levels of vacuum and an independent sputter etch chamber to enhance film adhesion and quality. Throughput is >60 wafers/hr (200 mm), and the system runs 100- to 300-mm wafers without hardware changes. The Nimbus 300 is well suited to applications that require sequential or simultaneous deposition of multiple metals, such as UBM for flip chip, phased-in binary layers, backside metallization, Cu interconnects, and magnetic heads. Klee Corp., Peabody, MA; ph 978/532-3334, fax 978/532-4445, e-mail [email protected].