Integrated film thickness measurements

12/01/1998

Integrated film thickness measurement

The NanoSpec 9000 is an ultracompact thin-film measurement system that uses noncontact visible reflectometry and can be integrated into CMP systems to determine removal rates and uniformity; into deposition systems to determine growth/deposition rates and uniformity; into etch systems to determine uniformity and etch rates; and into lithoclusters to determine coat uniformity. The 9000 will complete a five-point measurement across a patterned 200-mm wafer in 15 seconds. The system incorporates an automated 200-mm wafer stage, pre-aligner, measurement system, pattern recognition system, and autofocus assembly, all within a 12-in. cube design. Nanometrics Inc., Sunnyvale, CA; ph 408/746-1600 ext 105, fax 408/720-0196, e-mail [email protected].