Wafer dimensional measurement

12/01/1998

Wafer dimensional measurement

The S9600A2 is a fully automatic metrology station that measures the dimension and shape of silicon and nonsilicon wafers, materials, and substrates with sub-micron accuracy. Using noncontact, auto-positioning backpressure probe technology, the S9600A2 provides very good characteristics and flexibility for measurement of thickness up to 10,000 ?m and bow and warp up to 2000 ?m. The station meets the need for noncontact measurement of any type of fragile, brittle, or polished material, and thick or extra-thin wafers, round or square, up to 300 mm. Sigmatech Inc., Phoenix, AZ; ph 408/727-6427, www.sigma9600.com.