Non-cure chip adhesives

12/01/1998

Non-cure chip adhesives

ABLELOC 5850 nonconductive tape adhesive is designed for high-reliability semiconductor applications. A thin layer of high-purity thermoplastic adhesives is coated onto both sides of a polyimide carrier, which maintains electrical isolation between the bonded substrates while the adhesive provides good mechanical strength. Both adhesives are designed for high-speed assembly operations, where dwell time and device thermal exposure must be minimized. Since the adhesives are a true thermoplastic, no curing is required following attachment. Ablestik Laboratories, Rancho Dominguez, CA; ph 310/764-4600, fax 310/764-2545, e-mail [email protected].