Automatic BG tape laminator and remover

11/01/1998

Automatic BG tapelaminator and remover

The Adwill RAD-3500F/12 fully automatic BG tape laminator handles 150-, 200- and 300-mm wafers. The system features a tape tension control system that allows the most suitable tape lamination to be used on the wafer circuit surface. Damage to wafers due to an intrusion of the chip into the backgrinding process is eliminated. Processing capacity is 80 uph. The Adwill RAD-3000F/12 is a fully automatic tape remover designed for the 300-mm wafer backgrinding process. The system emphasizes the safe tape removal that is made possible by application of a heat seal and 180? peeling. Lintec Corp., Tokyo, Japan; ph 81/35295-7737, fax 81/35295-7725, www.lintec.co.jp.For FREE info circle 477