Photoresist adhesion promoter packet

11/01/1998

Photoresist adhesion promoter packet

The nonaminic advanced priming system (NAAPS), a new, patented technology for use in priming substrates and promoting uniform photoresist film formation, is described in this packet. Operating as a drop-in replacement for hexamethyldisilazane, and without problems associated with the generation of ammonia or amines, the system benefits CD control, can eliminate T-topping due to ammonia exposure, and may eliminate the requirement for a protective top coat. It can function with all positive photoresists. The packet includes a brochure on background, operation, and applications, and a data sheet on the technology. Silicon Resources Inc., Phoenix, AZ; ph 602/345-2411, fax 602/345-1817, e-mail [email protected].