E-beam moire publication

11/01/1998

E-beam moir? publication

Highlighted in this brochure is the relatively new electron-beam (e-beam) moir? technique that measures submicrometer strains on a local scale in electronic packaging. The publication describes the background, setup, and procedures for the technique, and is intended to give readers enough information so that they can conduct an experiment in their own laboratories. Such experiments would include a scanning electron microscope, access to e-beam or another lithography process, and computers to run the lithography process and aid in reducing and analyzing the data. The brochure also covers specimen preparation, e-beam lithography, thermal testing, mechanical testing, and analysis of the moir? fields. Nine papers on e-beam moir? theory and applications serve as appendices. National Institute of Standards and Technology (NIST), Boulder, CO; contact Elizabeth S. Drexler, ph 303/497-5350, e-mail [email protected].