Die sorting system

11/01/1998

Die sorting system

Model 2010 is a die demounter that can easily remove a fully sawn wafer from a film frame in <30 sec. Die as small as 0.01 in.2 can be peeled quickly and easily without damage. Wafers with 1-6 in. diameters can be demounted (an 8-in. model is also available). The machine is semiautomatic; the operator places each wafer on the machine and the die are then separated and spread loosely on a removable tray, while maintaining their original orientation. The tray can then be taken to another area for manual die sorting. Unlike "poker plate" equipment, the 2010 causes no yield loss. Viking Semiconductor Equipment Inc., Fremont, CA; ph 510/657-9960, fax 510/657-5969, www.vikingse.com.