Residue-removal chemistries

11/01/1998

Residue-removal chemistries

EKC525 Cu removes post-etch residue from copper substrates where low-k dielectrics are used, providing an ultraclean surface while eliminating any harmful effects on copper or low-k dielectrics. EKC505 Cu removes photoresist on copper substrates and eliminates swelling, bowing, or delamination of low-k dielectrics. EKC450 cleans downstream post-etch and ash residues and is compatible with low-k dielectrics and associated etch processes. EKC150 is a combination bulk photoresist and post-etch residue remover that fills the gap left by generic resist strippers. It is designed for use in both metal and via processing. EKC Technology Inc., Hayward, CA; ph 510/784-9105, fax 510/784-9181, e-mail [email protected].