Issue



Japan


10/01/1998







Japan

Tokyo Electron Yamanashi Ltd. (TEL) and Air Liquide America Corp., Houston, TX, have partnered to characterize the emissions of etch tools at TEL`s research facility in Nirasaki, Japan, to provide IC manufacturers with more accurate data on tool emissions. The study quantified emissions from TEL`s Unity oxide etch tools by performing a mass balance around all fluorine-containing species entering and exiting the tool.

Sony Semiconductor Co. will relocate headquarters from Atsugi, Kanagawa Prefecture to Osaki, Tokyo, near Sony Corp.`s world corporate headquarters by early 1999. The move will align system

LSI development work with end-user product development. Under the plan, an R&D wafer processing line and MOS and bipolar pilot production lines will remain in Atsugi, but all other divisions, including LSI design and marketing divisions, will move to Tokyo. Fujitsu is planning to use Sony`s Atsugi Technology Center for its joint R&D on advanced system LSIs with 0.13-?m design rules and beyond.

Under a distribution agreement, the air-gap CV technology called SSM 3000 Nano GAP CV, developed by Dainippon Screen (DNS), Kyoto, Japan, will be available worldwide through Solid State Measurements (DNS), Pittsburgh, PA. DNS will manufacture the system, while SSM will provide sales, training, service, and applications support worldwide.

DuPont Microcircuit & Component Materials has opened an Asia/Pacific technical center in Utsunomiya City, Japan. DuPont has relocated its thick film product development and technical service activities from Yokohama to the expanded Utsunomiya laboratory facility to meet the growing needs of customers in the Asian region.