Wafer bumping printer for stencil printing

10/01/1998

Wafer bumping printer for stencil printing

The WP-1 wafer bumping printer is used for precision stencil printing of solder paste on silicon wafers. The system is also designed for printing conductive epoxies and other materials on wafers. The printer is capable of processing up to 60 wafers/hour. The WP-1`s "look-up, look-down" vision alignment system controls alignment to within ?5 ?m. It is capable of handling wafers up to 200 mm in size, and paste is dispensed automatically from cartridges with a choice of 300, 600, or 1200 g capacity. Speedline Technologies Materials Deposition Systems, Franklin, MA; ph 508/541-4833, fax 508/541-3061.