Post-plasma strip and post-ash cleans

10/01/1998

Post-plasma strip and post-ash cleans

The HydrOzone process, for post-plasma strip, post-ash cleans, organic cleans, and resist stripping applications, uses a mixture of ozone and water to achieve low-cost cleaning, eliminating sulfuric acid and hydrogen peroxide from the process and reducing water consumption by as much as 99%. The process operates at elevated temperatures, increasing the reaction rate and achieving resist removal at rates up to 15 times greater than subambient processes. It also uses less ozone than most systems because of the highly efficient manner in which the ozone is applied to the surface of the wafer. Semitool Inc., Kalispell, MT; ph 406/751-6360, fax 406/752-5522.