EGA/lead inspection

10/01/1998

BGA/lead inspection

PPT4240 is a turnkey, in-tray component inspection system that uses SMI 3-D technology to achieve speeds of >10,000 pph for complete coplanarity, package and mark inspection. At a resolution of 2.5 ?m, it offers almost 3? better resolution for coplanarity inspection than available laser-based systems. The 4240 provides complete inspection for a range of semiconductor components, including BGA, QFP, CSP, and other bumped or leaded (gullwing or J-lead) components, with almost no changeover. All components are inspected in-tray, and a tray-flipper facilitates inspection of both sides of the components while eliminating individual component handling. Trays are handled in secure frames moving side-by-side for faster tray motion in a small footprint. PPT VISION, Minneapolis, MN; ph 612/996-9500, fax 612/996-9501, e-mail [email protected], www.pptvision.com.