Thermal control system

10/01/1998

Thermal control system

The ETC 1000 thermal control system delivers very good performance for die and transistor junction temperature control, especially for high-power devices such as microprocessors and system-on-chip ASICs. As power densities increase above 10 W/cm2, the effectiveness of response to changes in DUT dynamic power can diminish quickly. The ETC 1000 is not limited by this power density barrier. It offers ? 2?C junction temperature control for power densities of 30 W/cm2 and beyond, and features a setpoint temperature range of -35 to +125?C. It is not necessary to attach a heat sink or slug to the device for test. The system also allows thermal profiles and transition rates to be programmed, permitting a wide range of characterization flexibility. Other features of the ECT 1000 are an ATE interconnection for SOT/EOT, on-system data collection, a dynamic temperature analysis package, support for standard data formats and charting packages, a touchscreen operator interface, PC/NT controls, and a LabVIEW extendible software environment. Schlumberger ATE, San Jose, CA; ph 408/501-7145, [email protected].