Die Bonder

10/01/1998

Die bonder

The Dr. Tresky T-3002 manual die bonder and component placer separates the die from the foil by pull down of the foil. The die is supported by the fixed ejector needle and remains stationary, which reduces the risk of surface damage or failure of the die. The T-3002 is capable of picking from a wafer up to 8", a waffle pack, or a tape and reel feeder using the same working platform. Additional features include dispensing of solder paste or adhesives using a syringe. It can also stamp adhesives with a built-in accessory. Another feature is force control of chip placement with preset pressure, which enables the operator to control the final placement of the chip. Options include pick up, placement, and bonding of flips chips. Fancort Industries Inc., West Caldwell, NJ; ph 973/575-0610, fax 973/575-9234, [email protected].