Advanced autopolish module

10/01/1998

Advanced autopolish module

The Autopolish module is to be used with the Chip Unzip backside silicon thinning hardware on both devices and wafers. The Chip Unzip thins backside silicon to as little as 40 microns in order to permit the light from chip-level defects to be detected from the backside on those designs where front-side collection of the light is impossible. These designs include advanced DRAMs and LOCs, and the number of backside-only designs will grow as design rules shrink. The Autopolish module uses CMP and a digitally metered spray to deliver a precise quantity of diamond slurry to the polishing tool. Constant, gentle force ensures uniform polishing. Like other Chip Unzip functions, this automated tool is computer numerically controlled. Hypervision Inc., Fremont, CA; ph 510/651-7768, fax 510/651-1415, e-mail [email protected].