Wafer bumping machine

10/01/1998

Wafer bumping machine

The DS-1 wafer bumping machine is a "drop-on demand" metal jet system for deposition of solder balls on silicon wafers. It is able to deposit spheres with diameters ranging from 60-105 ?m. The DS-1 is a CAD-driven system, which means that patterns and other parameters can be changed virtually instantly from wafer to wafer by changing a file. The machine also eliminates the need for intermediary hard tooling, such as masks and stencils, and incorporates a robotic loader/unloader with dual cassettes and wafer aligner. The DS-1 incorporates Windows NT as the operating system; and a Pentium 200 MMX multitasking computer is provided with a swing-out, flat-panel display monitor. The machine is designed for Class 1000 cleanroom requirements. Speedline Technologies, Materials Deposition Systems, Franklin, MA; ph 508/520-6999, fax 508/520-2288, e-mail [email protected].