Wafer dicing and singulation Wafer dicing and singulation

09/01/1998

Wafer dicing and singulation

The NSX-250 is designed for dicing difficult semiconductor materials such as GaAs, SiGe, composites (SOI), ceramics, PZT, and other advanced materials. Also, its design allows for high-productivity and flexibility for CSP and fiber reinforced package singulation. It offers very good machine rigidity, a unique overarm spindle support, multilayer vibration isolation, Windows-based CNC controls, and MTIvision NT for automatic alignment, index correction, and inspection. The NSX series features aged Meehenite heavy walled castings, Z over Y design for high accuracy over the full travel range, oversized precision rails, and ball screws for stiffness and reliability. The full 4 axes CNC functionality allows axis interpolation, plunge cuts, in-process dressing programs, and multiple processes. Manufacturing Technology Inc., Ventura, CA; ph 805/644-9681, e-mail [email protected], www.mtionline.com