NIST report shows billions spent for metrology capability
09/01/1998
NIST report shows billions spent for metrology capability. The US semiconductor industry spent between $2.3 billion and $2.5 billion in 1996 to buy measurement tools and instruments used in support of chip manufacturing, according to a study commissioned by the National Institute of Standards and Technology (NIST). Capital spending to acquire metrology capability is expected to grow to between $3.5 billion and $5.5 billion by 2001. Suppliers of semiconductor manufacturing equipment incur nearly two-thirds of the industry`s metrology costs, most of it going for measurement tools and equipment needed for making the inspection equipment and other gear used during chip production. Analytical labs- facilities that provide specialized testing services-account for the fastest growing share of the industry`s total investment in measurement-related equipment.
Schlumberger Automated Test Equipment (ATE), San Jose, CA, a semiconductor manufacturing general contractor, is offering design, consulting, engineering, and production services on a performance-compensation basis. Under the firm`s recently-launched business unit, Schlumberger Advanced Business Engineering Resources, a customer can outsource one or more projects-design debug and validation planning, test program development, capacity planning/management, and yield improvement and production optimization programs. The operation now has about 50-100 contracts running in the test, characterization, and engineering/manufacturing productivity improvement areas.
In addition, Schlumberger ATE has received an order from Vitesse Semi-conductor for multiple SX 100 systems for testing a variety of gallium arsenide devices, including high-speed telecommunications and data communications devices. The systems will be shipped to facilities in Camarillo, CA, and Colorado Springs, CO. A member of the Schlumberger ITS 9000 family, the SX 100 is based on flexible advanced symbolic ATE programming software. The systems are field upgradeable.
Credence Systems Corp., Fremont, CA, a maker of automatic test equipment, has acquired HPL Inc.`s memory test assets and hired key HPL development personnel. HPL`s patented memory technology will be integrated with Credence`s suite of mixed-signal and memory test products. In addition, Credence has received a multiple system order for ValStar Series` VS 2000 test systems from Adaptec, which will use the systems in production facilities in the US and Singapore.
Cerprobe Corp., Gilbert, AZ, has signed a letter of intent to purchase the probe card operations of Upsys, a French testing and engineering company owned by IBM and GAME COGEMA Group, for about $8 million in cash. The Cobra probe cards have features for testing grid array, ultrahigh density, and multidie. The Cobra probe technology was originally developed by IBM for probing proprietary high density bumped contact wafers.
Camstar Systems Inc., Campbell, CA, has entered an agreement with Amkor Technology Inc., under which Amkor will standardize on Camstar`s MESA manufacturing execution system software at its back-end assembly and test foundries in the Philippines. The agreement with Camstar will support Amkor`s extended use of MESA for detailed work-in-process tracking, process control, and equipment management at Amkor facilities.
Veeco Metrology, Santa Barbara, CA, has received an order for multiple metrology systems valued at over $2 million from Advanced Micro Devices (AMD). The order includes the DEKTAK SXM-320 automated critical dimension atomic force microscopy and the DEKTAK SERIES V automated stylus profilometry systems. The systems, which incorporate cleanroom engineering with robotic handling and integrated SMIF interface, will be delivered to AMD`s Fab 30 in Dresden, Germany.
SST/Burlington MicroElectronics, Burlington, MA, has received a contract to supply 850 microelectronic components for Raytheon Missile Systems Division`s Stinger missile launch system. SST/Burlington provides additional screen testing, value added testing, and electrical and environmental testing on chips, as well as chip and wire assembly.
Philips Analytical X-ray, Almelo, The Netherlands, has begun taking orders for the SD3400 ellipsometer and PW2930 XRF wafer analyzer, two new inspection tools capable of handling 300-mm wafers. Based on ellipsometry, the SD3400 is a thin-film measurement system for use in both production and R&D environments. The XRF wafer analyzer uses 4-kW x-ray power. Customers can order the tools custom configured with up to 20 fixed measuring channels for nonroutine testing, contaminant identification, and trouble-shooting.
Micro Component Technology Inc., St. Paul, MN, a supplier of test handling solutions, has received an order package totaling $2.2 million for more than a dozen gravity feed handlers, and an MCT 7632 pick-and-place handler. The majority of the gravity units and the handler are scheduled for shipment in 1Q99.
Cabot Corp.`s Microelectronics Materials Division (MMD) is expanding its headquarters in Aurora, IL, increasing CMP slurry R&D and manufacturing space by 60%. As part of the expansion, the company is also investing in new polishing and metrology tools to be housed in an enlarged cleanroom.