DUV step-and-scan lithography

09/01/1998

DUV step-and-scan lithography

Designed for =0.18-?m device capability, the Micrascan III+ step-and-scan system has a 55-nm tool-to-tool overlay, low optical distortion, 180-nm resolution, and throughput up to 90 wafers/hour. Field size is 26 ? 34 mm. Advanced projection optics and 248-nm excimer laser illumination are combined with AXIOM off-axis alignment technology to provide wide process latitude in exposure and alignment. In addition to these enhancements, the Micrascan III+ offers the benefits of previous members of the family, including a catadioptric lens, incorporating both reflective and refractive optics, and a magnetically levitated wafer stage for precise motion control. Silicon Valley Group Inc., San Jose, CA; ph 408/467-5849 or 408/467-5870, e-mail [email protected].