Silicon slicing Silicon slicing

09/01/1998

Silicon slicing

The Multi Wire Saw (MWS) line of wire saws consists of five models and is designed for automatic slicing of super-hard materials and ceramics, including silicon ingots for the semiconductor industry. The new technology improves on interior- or circumferential-cutting machines, as fine wires are used instead of blades, providing for a high material yield and shorter cutting times. Four new features contribute to the system`s speed and quality of cutting: a pivoting head system increases the area of contact between wire and material, for fast, precise cuts; the vertical balance sliding system controls wire tension to increase speed and reduce wire breakage; an abrasive solution is applied by an under-nozzle to the cutting wire; and a plural wire supply system reduces wire wear. A micro-computer control system stores up to 10 slicing and winding patterns or quick changeover times. GTI Technologies Inc., Shelton, CT; ph 203/929-2200.