Low-k dielectric

09/01/1998

Low-k dielectric

Accuspin T-23 LOSP (low organic siloxane polymer) is a non-etchback inorganic material for gapfill applications with the goal of retaining low-k values over a wider process window than cage HSQ. For temperatures between 380 and 450?C, the k values for T-23 range between 2.8 and 3.0. By contrast, k values for HSQ have been reported between 3.0 and 4.0 over the same temperature range. When deposited on a 1-?m line and space pattern, T-23 showed >90% degree of planarization for a 0.4-?m-thick film on 1-?m-high features with linewidths of 0.25-2 ?m. AlliedSignal Inc., Sunnyvale, CA; ph 408/962-2000, fax 408/980-1430.